Inspection system
US-2024369495-A1 · Nov 7, 2024 · US
Apparatus and method for automatic inspection of through-holes of a component
US9310312B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9310312-B2 |
| Application number | US-201113818105-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 14, 2011 |
| Priority date | Sep 14, 2010 |
| Publication date | Apr 12, 2016 |
| Grant date | Apr 12, 2016 |
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Abstract
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An apparatus and a method for automatic inspection of through-holes of a component is provided. The proposed apparatus includes an imaging module, an image processing module and an analysis module. The imaging module generates a thermographic image of the component by passing a medium through the through-holes and capturing infra-red radiation emitted from the component while the medium is flowing through the through-holes. The image processing module fits the thermographic image on a digital image obtained from geometrical data of the component. The image processing module is further masks the fitted thermographic image using a digital image mask to extract regions corresponding to through-holes in the thermographic image. The digital image mask is computed based on a determination of positions of through-holes on the digital image. The analysis module evaluates the masked thermographic image to determine an irregularity or blockage in one or more of the through-holes.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for automatic inspection of a plurality of through-holes of a component, comprising: obtaining a thermographic image of the component generated by passing a medium through the plurality of through-holes and capturing infra-red radiation emitted from the component while the medium is flowing through the plurality of through-holes; generating a digital image from geometrical data of the component based on a viewing position of the thermographi…
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- G01N21/8851Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US9310312B2 cover?
- An apparatus and a method for automatic inspection of through-holes of a component is provided. The proposed apparatus includes an imaging module, an image processing module and an analysis module. The imaging module generates a thermographic image of the component by passing a medium through the through-holes and capturing infra-red radiation emitted from the component while the medium is flow…
- Who is the assignee on this patent?
- Jahnke Ronny, Sczepurek Tristan, Siemens Ag
- What technology area does this patent fall under?
- Primary CPC classification G01N21/8851. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).