Measuring device for measuring distance

US9310197B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9310197-B2
Application numberUS-201213481396-A
CountryUS
Kind codeB2
Filing dateMay 25, 2012
Priority dateMay 26, 2011
Publication dateApr 12, 2016
Grant dateApr 12, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A measuring device and a method for adjusting the measuring device is disclosed. The device includes a first electro-optical component, a second electro-optical component, a beam-shaping optical element, an optics carrier, and a printed circuit board. The optics carrier includes a first receptacle, where the first electro-optical component is mounted in the first receptacle, and a second receptacle, where the beam-shaping optical element is mounted in the second receptacle. The printed circuit board includes a third receptacle, where the second electro-optical component is mounted in the third receptacle. The first electro-optical component and the beam-shaping optical element are adjustable relative to the optics carrier in a direction of a respective optical axis of the first electro-optical component and the beam-shaping optical element and the second electro-optical component is adjustable and fixable in a plane essentially perpendicular to an optical axis of the second electro-optical element.

First claim

Opening claim text (preview).

What is claimed is: 1. A measuring device for measuring a distance between a reference mark and a target object, comprising: a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam; a beam-shaping optical element; a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element; a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the beam-splitting optical element is mounted in the third receptacle; a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle; and a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device; wherein, during an adjustment of the measuring device, the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element, and the second electro-optical component is adjustable and fixable only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component, such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component. 2. The measuring device according to claim 1 , wherein, during the adjustment of the measuring device, the printed circuit board is adjustable relative to the monolithic optics carrier in the plane and a contact surface of the monolithic optics carrier abuts the printed circuit board in a direction of the associated optical axis of the second electro-optical component. 3. The measuring device according to claim 1 , wherein the second electro-optical component is disposed on a side of the printed circuit board that faces the monolithic optics carrier. 4. The measuring device according to claim 1 , wherein the second electro-optical component is adjustable relative to the printed circuit board in the plane. 5. The measuring device according to claim 1 , wherein the second electro-optical component is disposed on a rear side of the printed circuit board facing away from the monolithic optics carrier. 6. The measuring device according to claim 1 , wherein the monolithic optics carrier is a metallic material. 7. The measuring device according to claim 1 , wherein the connecting device is a screwed connector. 8. The measuring device according to claim 1 , wherein the connecting device is an adhesive and a screwed connector. 9. A method for adjusting a measuring device, wherein the measuring device comprises: a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam; a beam-shaping optical element; a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element; a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the beam-splitting optical element is mounted in the third receptacle; wherein the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element; a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle; and a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device; and comprising the steps of: adjusting the first electro-optical component and the beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the first electro-optical component and the beam-shaping optical element; abutting the printed circuit board against the monolithic optics carrier; and adjusting the second electro-optical component only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component. 10. The method according to claim 9 , wherein the step of adjusting the second electro-optical component only in the plane essentially perpendicular to the associated optical axis of the second electro-optical component includes the step of adjusting the printed circuit board relative to the monolithic optics carrier in the plane. 11. The method according to claim 9 , wherein the second electro-optical component is disposed on a side of the printed circuit board that faces the monolithic optics carrier. 12. The method according to claim 9 , wherein the step of adjusting the second electro-optical component only in the plane essentially perpendicular to the associated optical axis of the second electro-optical component includes the step of adjusting the second electro-optical component relative to the printed circuit board in the plane. 13. The method according to claim 9 , wherein the second electro-optical component is disposed on a rear side of the printed circuit board facing away from the monolithic optics carrier. 14. The method according to claim 9 , wherein the monolithic optics carrier is a metallic material. 15. A measuring device for measuring a distance between a reference mark and a target object, comprising: a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam; a beam-shaping optical element; a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element; a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and wherein the beam-splitting optical element is an aperture mirror and is integrated into the monolithic optics carrier; a printed circuit board including a third receptacle, wherein the second electro-optical component is mounted in the third receptacle; and

Assignees

Inventors

Classifications

  • G01C3/08Primary

    Use of electric radiation detectors · CPC title

  • Alignment of sensor · CPC title

  • Housing arrangements · CPC title

  • for measuring distance only (indirect measurement G01S17/46; active triangulation systems G01S17/48) · CPC title

  • G01S7/4812Primary

    transmitted and received beams following a coaxial path · CPC title

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What does patent US9310197B2 cover?
A measuring device and a method for adjusting the measuring device is disclosed. The device includes a first electro-optical component, a second electro-optical component, a beam-shaping optical element, an optics carrier, and a printed circuit board. The optics carrier includes a first receptacle, where the first electro-optical component is mounted in the first receptacle, and a second recept…
Who is the assignee on this patent?
Gogolla Torsten, Tiefenthaler Stefan, Seifert Helmut, and 2 more
What technology area does this patent fall under?
Primary CPC classification G01C3/08. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).