Gas cooled LED lamp

Patent metadata

Field	Value
Publication number	US-9310065-B2
Application number	US-201313939821-A
Country	US
Kind code	B2
Filing date	Jul 11, 2013
Priority date	Apr 13, 2012
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs.

First claim

The invention claimed is:

1. A lamp comprising:
an enclosure being at least partially optically transmissive;
a board supporting a power supply for the lamp located in the enclosure;
at least one LED disposed in the optically transmissive enclosure and mounted to the board and operable to emit light when energized through an electrical connection;
a gas contained in the enclosure to provide thermal coupling to the at least one LED; and
the at least one LED mounted on a submount formed to have a three dimensional shape, wherein the submount comprises a flex circuit comprised of a thermally conductive material on a flexible dielectric material, the board being electrically coupled to the at least one LED and the submount being thermally coupled to the gas for dissipating heat from the at least one LED wherein portions of the flex circuit form heat conducting elements that provide suitable surface area and allow gas circulation such that heat generated by the at least one LED is transferred to the gas.

2. The lamp of claim 1 wherein the flex circuit is a single sided flex circuit.

3. The lamp of claim 1 wherein the flex circuit is formed into a three-dimensional shape providing surfaces for supporting the at least one LED.

4. The lamp of claim 1 wherein the at least one LED comprises a surface mount LED.

5. The lamp of claim 1 wherein the flex circuit is formed into a generally cylindrical shape having vertical surfaces that support the at least one LED.

6. The lamp of claim 1 wherein the thermally conductive material constitutes between approximately 30% and 50% of the surface area of the dielectric material.

7. The lamp of claim 1 wherein the thermally conductive material constitutes approximately 50% of the surface area of the dielectric material.

8. The lamp of claim 1 wherein a thermally conductive stiffener is attached to the back of the flex circuit.

9. The lamp of claim 1 wherein the gas comprises helium.

10. The lamp of claim 1 wherein the gas comprises hydrogen.

11. The lamp of claim 1 wherein the at least one LED comprises a plurality of LEDs arranged in an LED array.

12. A lamp comprising:
an enclosure being at least partially optically transmissive and a base defining a longitudinal axis of the lamp;
an electronics board supporting electronic circuitry connected to a power supply for the lamp, the board extending substantially along the longitudinal axis of the lamp and extending into substantially the center of the enclosure;
at least one LED disposed in the optically transmissive enclosure and mounted to the board and operable to emit light when energized through an electrical connection from the base; and
the at least one LED mounted on a submount formed to have a three dimensional shape, the board supporting the submount such that the at least one LED is positioned substantially in the center of the enclosure and the board being electrically coupled to the at least one LED; and the submount dissipating heat from the at least one LED.

13. The lamp of claim 12 wherein the submount is bendable.

14. The lamp of claim 12 wherein the board is supported in the enclosure by conductors that form part of the electrical connection.

15. The lamp of claim 12 wherein the submount is formed with a first connector and the board is formed with a second connector where the first connector engages the second connector to secure the submount to the board.

16. The lamp of claim 15 wherein the first connector comprises one of a female connector and a male connector and the second connector comprises another one of a male connector and a female connector.

17. The lamp of claim 15 wherein the first connector comprises one of a slot and a tab and the second connector comprises another one of a tab and a slot.

18. The lamp of claim 15 wherein the first connector comprises a slot and a resilient tab adjacent the slot and the second connector comprises a tab, the resilient tab being deformed by the tab to create a pressure force on the tab.

19. The lamp of claim 12 wherein a first electrical contact on the board is electrically coupled to a second electrical contact on the submount.

20. The lamp of claim 19 wherein the first electrical contact is electrically coupled to the second electrical contact at a soldered joint.

21. The lamp of claim 12 wherein the submount comprises heat conducting portions that provide suitable surface area and allow air circulation such that heat generated by the at least one LED is transferred to the gas.

22. The lamp of claim 21 wherein the heat conducting portions comprise electrically inactive areas.

23. The lamp of claim 12 wherein the submount comprises a circuitized submount and the at least one LED is mounted directly to the circuitized submount.

24. The lamp of claim 12 wherein the submount comprises a flex circuit comprised of a thermally conductive material of a flexible dielectric material.

25. The lamp of claim 12 wherein the submount comprises a lead frame where the lead frame supports the at least one LED and forms part of the electrical connection between the board and the at least one LED.

26. The lamp of claim 25 wherein the lead frame comprises a thermally and electrically conductive material.

27. The lamp of claim 25 wherein the lead frame is formed into an electrical circuit.

28. The lamp of claim 25 wherein the at least one LED is populated on the lead frame and connected to the electrical pads on the lead frame at joints where the joints mechanically hold the lead frame circuit together.

29. The lamp of claim 25 wherein the lead frame comprises portions that are provided to increase heat transfer between the lead frame and the gas.

30. The lamp of claim 29 wherein the portions are electrically active and are electrically isolated from one another.

31. The lamp of claim 12 wherein the submount is not part of the electrical connection, the submount physically supporting the at least one LED and providing a heat sink for dissipating heat to the gas.

32. The lamp of claim 31 wherein the at least one LED comprises a plurality of LEDs, the plurality of LEDs comprising top side contact pads that are electrically coupled by wire bonds.

33. The lamp of claim 32 wherein the wire bonds have sufficient length that the wire bonds accommodate bending of the submount without breaking.

34. A lamp comprising:
an enclosure being at least partially optically transmissive;
a board supporting a power supply for the lamp located in the enclosure;
at least one LED disposed in the optically transmissive enclosure and mounted to the board and operable to emit light when energized through an electrical connection;
a gas contained in the enclosure to provide thermal coupling to the at least one LED; and
the at least one LED mounted on a submount formed to have a three dimensional shape, wherein the submount comprises a flex circuit comprised of a thermally conductive material on a flexible dielectric material, the board being electrically coupled to the at least one LED and the submount being thermally coupled to the gas for dissipating heat from the at least one LED wherein the flex circuit is flooded with copper to provide enough heat conductive material that heat generated by the at le

Assignees

• Cree Inc

Inventors

• Hussell Christopher P
• Edmond John Adam
• Negley Gerald H
• Progl Curt
• Edmond Mark
• Athalye Praneet
• Swoboda Charles M
• Van De Ven Antony Paul
• Pickard Paul Kenneth
• Reier Bart P
• Lay James Michael
• Lopez Peter E
• Adams Ed

Classifications

• F21K9/135

  Mechanical Engineering · mapped topic

• F21Y2101/02

  Mechanical Engineering · mapped topic

• F21V29/2212

  Mechanical Engineering · mapped topic

• F21V29/24 Primary

  Mechanical Engineering · mapped topic

• F21V29/004

  Mechanical Engineering · mapped topic