Linear LED module

US9310045B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9310045-B2
Application numberUS-201414450111-A
CountryUS
Kind codeB2
Filing dateAug 1, 2014
Priority dateAug 1, 2014
Publication dateApr 12, 2016
Grant dateApr 12, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electrically coupled to the at least one light emitting device.

First claim

Opening claim text (preview).

What is claimed is: 1. A light emitting apparatus comprising: a substrate having at least one angled portion; at least one light emitting device arranged on the substrate; and a plurality of conductors arranged on the substrate, wherein the conductors are electrically coupled to the at least one light emitting device, wherein a portion of the substrate comprises a diffusive surface, the diffusive surface comprising a white solder mask arranged around the at least one light emitting device. 2. The light emitting apparatus of claim 1 , wherein the substrate further comprises a member supporting the light emitting device, and wherein the angled portion is coupled to the member at an obtuse angle between the member and the angled portion. 3. The light emitting apparatus of claim 1 , wherein the angled portion comprises a reflective surface, wherein the angled portion has greater reflectivity than the member. 4. The light emitting apparatus of 2 , wherein an angle between the member and angled portion is selected to fit a troffer light fixture. 5. The light emitting apparatus of claim 1 , wherein the at least one light emitting device comprises a flip chip LED. 6. The light emitting apparatus of claim 5 , further comprising an encapsulant that encapsulates the flip chip LED. 7. The light emitting apparatus of claim 1 , wherein the substrate comprises aluminum. 8. The light emitting apparatus of claim 1 , where the at least one light emitting device comprises a chip-on-board package. 9. A light emitting apparatus comprising: at least one light emitting device; a flexible substrate having a member supporting the at least one light emitting device; and an angled portion extending from the member, wherein the member comprises a diffusive surface comprising a white solder mask arranged around the at least one light emitting device. 10. The light emitting apparatus of claim 9 , wherein the angled portion comprises a reflective surface, and wherein the angled portion has greater reflectivity than the member. 11. The light emitting apparatus of claim 9 , wherein an angle between the member and angled portion is selected to fit a troffer light fixture. 12. The light emitting apparatus of claim 9 , wherein the at least one light emitting device is a flip chip LED. 13. The light emitting apparatus of claim 12 , further comprising an encapsulant that encapsulates the flip chip LED. 14. The light emitting apparatus of claim 9 , wherein the substrate comprises aluminum. 15. The light emitting apparatus of claim 9 , where the at least one light emitting device comprises a chip-on-board package. 16. A lamp comprising: a housing; a light emitting apparatus coupled to the housing, the apparatus comprising: at least one light emitting device; and a flexible substrate carried by the housing, the flexible substrate comprising a reflective portion and a diffusive portion, wherein the at least one light emitting device is arranged on the diffusive portion, wherein the diffusive portion comprises a white solder mask arranged around the at least one light emitting device. 17. The lamp of claim 16 , wherein the housing comprises plastic. 18. The lamp of claim 16 , wherein the housing is configured for mounting to a troffer light fixture. 19. The lamp of claim 16 , wherein the flexible substrate is configured to bend to fit a shame of the housing. 20. The lamp of claim 16 , wherein the housing comprises a member and an angled portion extending from the member, and wherein the diffusive portion is arranged on the member and the reflective portion is arranged on the angled portion. 21. The lamp of claim 16 , wherein the reflective and diffusive portions are configured to focus light in a downward direction.

Assignees

Inventors

Classifications

  • the elements being coupling devices {, e.g. connectors} · CPC title

  • plane · CPC title

  • comprising a linear array of point-like light-generating elements · CPC title

  • Light-emitting diodes [LED] · CPC title

  • F21V3/049Primary

    Patterns or structured surfaces for diffusing light, e.g. frosted surfaces · CPC title

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Frequently asked questions

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What does patent US9310045B2 cover?
Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electr…
Who is the assignee on this patent?
Bridgelux Inc
What technology area does this patent fall under?
Primary CPC classification F21V3/049. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).