Thermosetting composition and process for preparing fiber-reinforced composites

Patent metadata

Field	Value
Publication number	US-9309354-B2
Application number	US-201214117878-A
Country	US
Kind code	B2
Filing date	Jun 6, 2012
Priority date	Jun 24, 2011
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species. The system also includes a hardener mixture that has an amino hydrogen equivalent weight of from 35 to 90 and contains at least 90% by weight of a mixture of (i) from 5 to 75% of the combined weight of (i), (ii) and (iii) of one or more compounds that have at least two primary and/or secondary aliphatic amino groups and which have no phenolic groups; (ii) from 10 to 95% of the combined weight of (i), (ii) and (iii) of one or more aminophenol compounds that contain one or more primary and/or secondary aliphatic amino groups and at least one phenolic group and (iii) from 0 to 50% of the combined weight of (i), (ii) and (iii) of one or more phenolic compounds that contain two or more phenolic groups and do not contain primary or secondary amino groups. The epoxy resin component and hardener mixture are present in amounts sufficient to provide from 1.05 to 1.35 equivalents of aliphatic amine hydrogens per equivalent of epoxide groups provided by the epoxy resin component. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.

First claim

What is claimed is:

1. A two-component curable epoxy resin system, comprising
I. an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 250 and contains no more than 3% by weight of monohydrolyzed resin species;
II. a hardener mixture that has an amino hydrogen equivalent weight of from 25 to 90 and contains at least 90% by weight of a mixture of (i) from 5 to 75% of the combined weight of (i), (ii) and (iii) of one or more compounds that have at least two primary and/or secondary aliphatic or cycloaliphatic amino groups and which have no phenolic groups; (ii) from 10 to 95% of the combined weight of (i), (ii) and (iii) of one or more aminophenol compounds that contain one or more primary and/or secondary aliphatic or cycloaliphatic amino groups and at least one phenolic group and (iii) from 0 to 50% of the combined weight of (i), (ii) and (iii) of one or more phenolic compounds that contain two or more phenolic groups and do not contain primary or secondary amino groups;
components I and II being present in amounts sufficient to provide from 1.05 to 1.35 equivalents of aliphatic or cycloaliphatic amine hydrogens per equivalent of epoxide groups provided by the epoxy resin component.

2. The epoxy resin system of claim 1 , wherein the epoxy resin component includes an internal mold release agent.

3. The epoxy resin system of claim 1 or 2 , wherein the epoxy resin component contains at least 95% by weight of a diglycidyl ether of a bisphenol.

4. The epoxy resin system of claim 1 wherein component (i) of the hardener mixture is ethylene diamine, diethylene triamine, triethylenetetraamine, tetraethylenepentamine, aminoethylpiperazine, 2-methylpentane-1,5-diamine, N′,N′ -bis(2 -aminoethyl)ethane -1,2 -diamine, polyethylene polyamine mixtures, methylene bis(cyclohexylamine), 1,2-, 1,3- and/or 1,4-bis(aminomethyl)cyclohexane , an aminocyclohexanealkylamine, 2- and/or 4-alkylcyclohexane-1,3-diamine, isophorone diamine or a mixture of any two or more thereof.

5. The epoxy resin system of claim 4 wherein component (i) of the hardener mixture is triethylenetetramine.

6. The epoxy resin system of any preceding claim 1 wherein component (ii) of the hardener mixture contains an average of from 1 to 2 phenolic groups per molecule and an average of 3 to 6 aliphatic or cycloaliphatic amine hydrogen atoms per molecule.

7. The epoxy resin system of claim 1 wherein component (ii) of the hardener mixture corresponds to a Mannich base of a compound that forms component (i) of the hardener mixture with one or more monophenols or polyphenols.

8. The epoxy resin system of claim 1 wherein the hardener mixture contains from 10 to 30% by weight of component (iii), based on the combined weights of components (i), (ii) and (iii).

9. A process for forming a fiber-reinforced epoxy composite, comprising;
a) pre-heating an epoxy resin component to a temperature of about 30 to 150° C.;
b) mixing the pre-heated epoxy resin component with a hardener by impingement mixing and transferring the resulting mixture into a mold that contains reinforcing fibers, and
c) curing the mixture in the mold to form the fiber-reinforced epoxy composite, wherein;
1) the epoxy resin component contains at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 250, and the epoxy resin component contains no more than 3% by weight of monohydrolyzed resin species;
2) the hardener is at a temperature of no greater than 60° C. when mixed with the pre-heated epoxy resin component;
3) the mold is preheated to a temperature of at least 70° C. when the mixture of the epoxy resin and the hardener is transferred into the mold;
4) the hardener is a mixture that has an amino hydrogen equivalent weight of from 25 to 90 and which contains at least 90% by weight of (i) from 5 to 75% of the combined weight of (i), (ii) and (iii) of one or more compounds that have at least two primary and/or secondary aliphatic or cycloaliphatic amino groups and which have no phenolic groups; (ii) from 10 to 95% of the combined weight (i), (ii) and (iii) of one or more aminophenol compounds that contain one or more primary and/or secondary aliphatic or cycloaliphatic amino groups and at least one phenolic group and (iii) from 0 to 50% of the combined weight of (i), (ii) and (iii) of one or more phenolic compounds that contain two or more phenolic groups and do not contain primary or secondary amino groups; and
5) the ratio of the epoxy resin component and the hardener is such that from 1.05 to 1.35 equivalents of aliphatic or cycloaliphatic amine hydrogens are provided by the hardener per equivalent of epoxide groups provided by the epoxy resin component.

10. The process of claim 9 , wherein the ration of the epoxy resin component and the hardener is such that from 1.1 to 1.2 equivalents of aliphatic or cycloaliphatic amine hydrogens are provided by the hardener per equivalent of epoxide groups provided by the epoxy resin component.

11. The process of claim 9 , wherein step c is performed in the presence of an internal mold release agent.

12. The process of claim 9 , wherein the epoxy resin component contains at least 95% by weight of a diglycidyl ether of a bisphenol.

13. The process of any of claim 9 wherein component (i) of the hardener mixture is ethylene diamine, diethylene triamine, triethylenetetraamine, tetraethylenepentamine, aminoethylpiperazine, 2-methylpentane-1,5-diamine, N′,N′-bis(2-aminoethyl)ethane-1,2-diamine, polyethylene polyamine mixtures, methylene bis(cyclohexylamine), 1,2-,1,3- and/or 1,4-bis(aminomethyl)cyclohexane, an aminocyclohexanealkylamine, 2- and/or 4-alkylcyclohexane-1,3-diamine, isophorone diamine or a mixture of any two or more thereof.

14. The process of claim 13 wherein component (i) of the hardener mixture is triethylenetetramine.

15. The process of claim 9 wherein component (ii) of the hardener mixture contains an average of from 1 to 2 phenolic groups per molecule and an average of 3 to 6 aliphatic or cycloaliphatic amine hydrogen atoms per molecule.

16. The process of claim 9 wherein component (ii) of the hardener mixture corresponds to a Mannich base of a compound that forms component (i) of the hardener mixture with one or more monophenols or polyphenols.

17. The process of claim 9 wherein the hardener mixture contains from 10 to 30% by weight of component (iii), based on the combined weights of components (i), (ii) and (iii).

18. The process of claim 9 wherein the epoxy resin component is preheated to a temperature of at least 80° C.

19. The process of claim 9 wherein the hardener mixture is at a temperature of no greater than 40° C. when mixed with the pre-heated epoxy resin component.

20. The process of claim 9 wherein the composite contains from 25 to 70 volume percent of the reinforcing fibers.

Assignees

• Shields Nigel
• Reimers Martin
• Verghese Nikhil K E
• Morley Timothy A
• Null Marty J
• Turakhia Rajesh H
• Dow Global Technologies Llc

Inventors

• Shields Nigel
• Reimers Martin
• Verghese Nikhil K E
• Morley Timothy A
• Null Marty J
• Turakhia Rajesh H

Classifications

• B29K2063/00

  Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title

• C08G59/621 Primary

  Phenols · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08K7/06

  Elements · CPC title

• B29C70/48

  and impregnating the reinforcements in the closed mould, e.g. resin transfer moulding [RTM] {, e.g. by vacuum} · CPC title