Formulation methodology for distortional thermosets

Patent metadata

Field	Value
Publication number	US-9309353-B2
Application number	US-201313963745-A
Country	US
Kind code	B2
Filing date	Aug 9, 2013
Priority date	Aug 9, 2013
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

Methods and formulations for distortional thermosets are disclosed that display enhanced composite mechanical performances and robust sorption resistance. The composition includes an epoxy resin of formula (I):

and a diamine curing agent. The resultant distortional thermoset compositions possess superior out-life requirements and advantageous reaction kinetics for preparing prepreg compositions and materials.

First claim

What is claimed is:

1. A composition having a von Mises strain of at least 0.300, the composition comprising:
an epoxy resin of formula (I):

 and
a diamine curing agent selected from the group consisting of formulas (II)-(XXV):

and combinations thereof, wherein the diamine curing agent comprises:
about 10% (wt) of formula (V):

 and
about 90% (wt) of formula (II):

2. A composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (wt) after 30 days, the composition comprising:
an epoxy resin of formula (I):

 and
a diamine curing agent.

3. The composition of claim 2 , wherein the epoxy resin and the diamine curing agent have a stoichiometric ratio of amine hydrogens to epoxide groups selected in the range from about 0.6:1.0 to about 1:1.

4. The composition of claim 2 , wherein the composition possesses a von Mises strain of at least 0.300.

5. The composition of claim 2 , wherein the diamine curing agent is selected from the group consisting of formulas (II)-(XXV):

and combinations thereof.

6. The composition of claim 2 , wherein the diamine curing agent comprises formula (V):

7. The composition of claim 6 , wherein the diamine curing agent further comprises formula (II):

8. A composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (wt) after 30 days, the composition comprising:
an epoxy resin of formula (I):

 and
a diamine curing agent comprising:
about 10% (wt) of formula (V):

 and
About 90% (wt) of formula (II):

9. A composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
an epoxy resin of formula (I):

 and
a diamine curing agent selected from the group consisting of formulas (II)-(XXV):

and combinations thereof.

10. A resin composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
an epoxy resin of formula (I):

a first diamine curing agent, and
a second diamine curing agent.

11. The composition of claim 10 , wherein the first diamine curing agent comprises at least one electron-withdrawing moiety.

12. The composition of claim 11 , wherein the at least one electron-withdrawing moiety is selected from the group consisting of: —SO 2 , —SO 3 H, —NO 2 , —CN, —CR 3 , —CHO, and —CO 2 H, wherein R is a halide.

13. The composition of claim 11 , wherein the second diamine curing agent comprises at least one electron-withdrawing moiety.

14. The composition of claim 13 , wherein the at least one electron-withdrawing moiety of the second diamine curing agent is selected from the group consisting of: —SO 2 , —SO 3 H, —NO 2 , —CN, —CR 3 , —CHO, and —CO 2 H, wherein R is a halide.

15. The composition of claim 10 , wherein the first diamine curing agent and the second diamine curing agent are independently selected from the group consisting of formulas (II)-(XXV):

16. The composition of claim 15 , wherein at least one of the first diamine curing agent and the second diamine curing agent of formulas (II)-(XXV) further comprises at least one electron-withdrawing moiety.

17. The composition of claim 16 , wherein the at least one electron-withdrawing moiety is selected from the group consisting of: —SO 2 , —SO 3 H, —NO 2 , —CN, —CR 3 , —CHO, and —CO 2 H, wherein R is a halide.

18. A resin composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
an epoxy resin of formula (I):

a first diamine curing agent, and
a second diamine curing agent,
wherein the ratio of the first diamine curing agent and the second diamine curing agent is about 9:1 (wt %).

19. A resin composition having an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
an epoxy resin of formula (I):

a first diamine curing agent, and
a second diamine curing agent,
wherein the first diamine curing agent comprises at least one electron-withdrawing moiety, and
wherein the ratio of the first diamine curing agent and the second diamine curing agent is about 9:1 (wt %).

20. A composition having a von Mises strain of at least 0.300 and an absorption of methylethyl ketone (MEK) fluid being no more than about 1% (Wt) after 30 days, the composition comprising:
an epoxy resin of formula (I):

 and
a diamine curing agent.

21. The composition of claim 5 , wherein the diamine curing agent is formula (II):

Assignees

• Boeing Corp
• Boeing Co

Inventors

• Christensen Stephen
• Tucker Samuel J
• Wiggins Jeffrey S

Classifications

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08G59/56

  together with other curing agents · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08K7/14

  Glass · CPC title

• C08G59/50

  Amines · CPC title