Sensor structure for sensing pressure waves and ambient pressure

US9309105B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9309105-B2
Application numberUS-201414198645-A
CountryUS
Kind codeB2
Filing dateMar 6, 2014
Priority dateMar 6, 2014
Publication dateApr 12, 2016
Grant dateApr 12, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.

First claim

Opening claim text (preview).

What is claimed is: 1. A sensor structure, comprising: a support structure having a first side; a first electrically conductive layer formed on the first side of the support structure; an electrode element arranged over the first conductive layer; and a second electrically conductive layer arranged on an opposite side of the electrode element from the first electrically conductive layer; wherein a portion of the first electrically conductive layer and a portion of the second electrically conductive layer form a first chamber where the pressure in the first chamber is lower than the pressure outside the first chamber and a further portion of the first electrically conductive layer and a portion of the electrode element form a second chamber where the pressure in the second chamber is lower than the pressure outside the second chamber. 2. The sensor structure of claim 1 , further comprising: a first spacer layer formed over a portion of the first electrically conductive layer; a second spacer layer formed over a portion of the second electrically conductive layer; a first pillar structure arranged in the first chamber between the first electrically conductive layer and the second electrically conductive layer; and a second pillar structure arranged in the second chamber between the first electrically conductive layer and the electrode element. 3. The sensor structure of claim 2 , wherein the electrode element is at least partially arranged in the first chamber. 4. The sensor structure of claim 2 , wherein the pressure in the first chamber is substantially a vacuum pressure and the pressure in the second chamber is substantially a vacuum pressure. 5. The sensor structure of claim 2 , wherein the first spacer layer is arranged to fix the first electrically conductive layer to the electrode element and the second spacer layer is arranged to fix the second electrically conductive layer to the electrode element. 6. The sensor structure of claim 2 , wherein the first pillar structure is configured to electrically couple the first electrically conductive layer to the second electrically conductive layer. 7. The sensor structure of claim 2 , wherein the first pillar structure intersects the first chamber. 8. The sensor structure of claim 2 , wherein the second pillar structure is configured to electrically isolate the first electrically conductive layer from the electrode element. 9. The sensor structure of claim 2 , wherein the second pillar structure intersects the second chamber. 10. The sensor structure of claim 2 , further comprising: a cavity formed in the support structure; and a void formed through the first electrically conductive layer, the first spacer layer, the electrode element, the second spacer layer, and the second electrically conductive layer. 11. The sensor structure of claim 10 , wherein at least a portion of the first electrically conductive layer is suspended across the cavity in the support structure. 12. The sensor structure of claim 10 , wherein the void is configured to electrically isolate a portion of the sensor structure containing the first chamber from a portion containing the second chamber. 13. The sensor structure of claim 1 , wherein the sensor structure comprises a micro-electro-mechanical system. 14. A sensor structure arrangement, comprising: a sensor structure comprising: a support structure having a first side; a first electrically conductive layer formed on the first side of the support structure; an electrode element arranged over the first conductive layer; and a second electrically conductive layer arranged on an opposite side of the electrode element from the first electrically conductive layer; wherein a portion of the first electrically conductive layer and a portion of the second electrically conductive layer form a first chamber where the pressure in the first chamber is lower than the pressure outside the first chamber and a further portion of the first electrically conductive layer and a portion of the electrode element form a second chamber where the pressure in the second chamber is lower than the pressure outside the second chamber; and a circuit configured to detect at least one of a signal generated by a deflection of the first chamber and a signal generated by a deformation of the second chamber.

Assignees

Inventors

Classifications

  • by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators · CPC title

  • Mems transducers or their use · CPC title

  • using diaphragms · CPC title

  • Transmitting or indicating the displacement of flexible diaphragms · CPC title

  • using variations in capacitance · CPC title

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Frequently asked questions

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What does patent US9309105B2 cover?
In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outsi…
Who is the assignee on this patent?
Infineon Technologies Ag
What technology area does this patent fall under?
Primary CPC classification B81B7/0041. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).