Laminate and method for separating the same

Patent metadata

Field	Value
Publication number	US-9308715-B2
Application number	US-201414183988-A
Country	US
Kind code	B2
Filing date	Feb 19, 2014
Priority date	Nov 15, 2010
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

First claim

What is claimed is:

1. A method for separating a support plate from a substrate, the method including:
providing a laminate including a substrate having a major surface, a support plate transmissive to an infrared light, an adhesive layer interposed between the support plate and the substrate, and a separation layer interposed between the support plate and the adhesive layer, wherein the separation layer comprises an infrared absorbent compound and includes a first portion and a second portion adjacent to the first portion when viewed from a direction perpendicular to the major surface, wherein the adhesive layer does not comprise an optical curing resin,
selectively emitting an infrared light beam to the first portion of the separation layer via the support plate while not emitting the infrared light to the second portion of the separation layer, such that the first portion of the separation layer is denatured as the infrared absorbent compound absorbs the infrared light beam and that the second portion remains undenatured and
subsequently, while the second portion of the separation layer remains undenatured after infrared light emission, exerting an external force to the laminate to separate the support plate from the substrate.

2. The method of claim 1 , wherein the laminate is such that a semiconductor wafer as the substrate is temporarily attached to the support plate in order to reinforce strength of the substrate, and
the method is used to separate the semiconductor wafer from the support plate.

3. The method of claim 1 , wherein energy of the infrared light beam is absorbed in the infrared absorbent compound to cause decomposition of the infrared absorbent compound, so that the substrate is removable from the support plate.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Imai Hirofumi
• Tamura Koki
• Kubo Atsushi
• Yoshioka Takahiro
• Fujii Yasushi
• Inao Yoshihiro

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title