Method for fabricating flexible display module

Patent metadata

Field	Value
Publication number	US-9308697-B2
Application number	US-201313893363-A
Country	US
Kind code	B2
Filing date	May 14, 2013
Priority date	Aug 9, 2012
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A method for fabricating flexible display module mainly includes following steps: providing a transparent carrier with a carrying-surface and a back-surface opposite to the carrying-surface; forming a photosensitive-release-film on the carrying-surface; providing a flexible substrate on the photosensitive-release-film; forming a pixel array on the flexible substrate; during or after forming the pixel array, conducting irradiation on the photosensitive-release-film from the back-surface of the transparent carrier to weaken bonding force between the photosensitive-release-film and the transparent carrier or simultaneously weaken both the bonding force between the photosensitive-release-film and the transparent carrier and the structure strength of the photosensitive-release-film; and then, removing the flexible substrate from the transparent carrier, in which at least one portion of the photosensitive-release-film is peeled off from the carrying-surface and remains on the flexible substrate.

First claim

What is claimed is:

1. A method for fabricating flexible display module, comprising:
providing a transparent carrier having a carrying-surface and a back-surface opposite to the carrying-surface;
forming a photosensitive-release-film on the carrying-surface, wherein the photosensitive-release-film is parylene;
providing a flexible substrate on the photosensitive-release-film, and conducting heat treatment on the photosensitive-release-film prior to providing the flexible substrate so as to increase bonding force between the photosensitive-release-film and the transparent carrier;
forming a pixel array on the flexible substrate;
during or after forming the pixel array, conducting irradiation on the photosensitive-release-film from the back-surface of the transparent carrier to weaken bonding force between the photosensitive-release-film and the transparent carrier or simultaneously weaken both the bonding force between the photosensitive-release-film and the transparent carrier and structural strength of the photosensitive-release-film; and
removing the flexible substrate from the transparent carrier, wherein at least one portion of the photosensitive-release-film is peeled off from the carrying-surface and remains on the flexible substrate.

2. The method for fabricating flexible display module as claimed in claim 1 , wherein the step of forming the pixel array comprises:
forming a plurality of active devices on the flexible substrate; and
forming a displaying component on the active devices.

3. The method for fabricating flexible display module as claimed in claim 2 , wherein the step of conducting irradiation on the photosensitive-release-film is performed after forming the active devices and prior to forming the displaying component.

4. The method for fabricating flexible display module as claimed in claim 1 , wherein the heat treatment comprises annealing.

5. The method for fabricating flexible display module as claimed in claim 1 , wherein light used to irradiate the photosensitive-release-film is ultraviolet (UV) light.

6. The method for fabricating flexible display module as claimed in claim 1 , wherein power of the light used to irradiate the photosensitive-release-film is greater than or equal to 5 mW/cm 2 but less than or equal to 300 mW/cm 2 .

7. The method for fabricating flexible display module as claimed in claim 1 , wherein the flexible substrate comprises a material of selected from the group consisting of polyimide (PI), polyethylene terephthalate (PET) and polyethylene naphthalate (PEN).

8. The method for fabricating flexible display module as claimed in claim 1 , wherein after conducting irradiation on the photosensitive-release-film from the back-surface of the transparent carrier, a releasing force between the photosensitive-release-film and the transparent carrier is less than or equal to 25 gf.

9. The method for fabricating flexible display module as claimed in claim 1 , wherein the photosensitive-release-film entirely overlaps bottom-surface of the flexible substrate.

10. The method for fabricating flexible display module as claimed in claim 1 , wherein the photosensitive-release-film is entirely peeled off from the carrying-surface and remains on the flexible substrate.

11. The method for fabricating flexible display module as claimed in claim 1 , further comprising forming an assist-BUV layer between the photosensitive-release-film and the transparent carrier, wherein the material of the assist-BUV layer comprises porous inorganic material, the assist-BUV layer is capable of enhancing an effect of irradiation on the photosensitive-release-film from the back-surface of the transparent carrier, so that the photosensitive-release-film evenly receives the irradiate light.

12. The method for fabricating flexible display module as claimed in claim 1 , further comprising forming an assist-BUV layer between the photosensitive-release-film and the flexible substrate, wherein the material of the assist-BUV layer comprises porous inorganic material, the assist-BUV layer is capable of enhancing an effect of irradiation on the photosensitive-release-film from the back-surface of the transparent carrier; so that the photosensitive-release-film evenly receives the irradiate light.

13. The method for fabricating flexible display module as claimed in claim 12 , further comprising forming a barrier layer between the assist-BUV layer and the flexible substrate.

14. The method for fabricating flexible display module as claimed in claim 1 , further comprising forming an assist-BUV layer between the pixel array and the flexible substrate, wherein the material of the assist-BUV layer comprises porous inorganic material, the assist-BUY layer is capable of enhancing an effect of irradiation on the photosensitive-release-film from the back-surface of the transparent carrier, so that the photosensitive-release-film evenly receives the irradiate light.

Assignees

• Au Optronics Corp

Inventors

• Ke Tsung-Ying
• Wang pei-yun
• Wang Pin-Fan

Classifications

• Y10T156/1158

  Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.] · CPC title

• B29D11/0073 Primary

  Optical laminates · CPC title

• B32B43/006

  Delaminating · CPC title

• H10D86/411

  characterised by materials, geometry or structure of the substrates · CPC title

• H10D86/60

  wherein the TFTs are in active matrices · CPC title