Multi-disk chemical mechanical polishing pad conditioners and methods

Patent metadata

Field	Value
Publication number	US-9308623-B2
Application number	US-201414256704-A
Country	US
Kind code	B2
Filing date	Apr 18, 2014
Priority date	Apr 19, 2013
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

First claim

What is claimed is:

1. Apparatus for conditioning a polishing pad, comprising:
a main assembly; and
a plurality of pad conditioner assemblies each compliantly attached to the main assembly and each comprising a conditioning element,
wherein each pad conditioner assembly further includes a pad conditioner disk attached to the main assembly, and a pad conditioner base attached to the pad conditioner disk via a gimbal connection, the conditioning element attached to the pad conditioner base.

2. The apparatus of claim 1 wherein the main assembly comprises a main assembly disk and a main assembly base plate attached to the main assembly disk.

3. The apparatus of claim 2 wherein the main assembly base plate is attached to the main assembly disk via a gimbal connection.

4. The apparatus of claim 2 wherein the main assembly base plate is made of a rigid material and the main assembly disk is made of a compliant material.

5. The apparatus of claim 1 wherein the pad conditioner disk is made of a compliant material and the pad conditioner base is made of a rigid material.

6. The apparatus of claim 1 wherein the pad conditioner base comprises at least one magnet and the conditioning element is attached to the pad conditioner base magnetically.

7. A system for conditioning a polishing pad, comprising:
a conditioning head; and
a pad conditioner mounted to the conditioning head, the pad conditioner comprising a plurality of independently mounted conditioning elements,
wherein each of the conditioning elements is attached to a respective pad conditioner base, and
wherein each pad conditioner base is attached to a respective pad conditioner disk via a gimbal connection.

8. The system of claim 7 wherein each pad conditioner disk is attached to a main assembly base plate.

9. The system of claim 8 wherein each pad conditioner disk is configured to pivot about a pivot point during a conditioning process.

10. The system of claim 8 wherein the main assembly base plate is attached to a main assembly disk.

11. The system of claim 10 wherein the main assembly disk is configured to pivot about a pivot point during a conditioning process.

12. A method of conditioning a polishing pad, comprising:
providing a plurality of pad conditioner assemblies, each pad conditioner assembly having a pad conditioner base attached to a pad conditioner disk via a first gimbal connection;
attaching the plurality of pad conditioner assemblies to a main assembly base plate;
attaching the main assembly base plate to a main assembly disk; and
conditioning a polishing pad using the plurality of pad conditioner assemblies.

13. The method of claim 12 wherein the attaching the main assembly base plate to the main assembly disk comprises attaching the main assembly base plate to the main assembly disk via a second gimbal connection.

14. The method of claim 12 further comprising attaching a respective conditioning element to each pad conditioner base.

15. The method of claim 14 wherein the attaching the respective conditioning element to each pad conditioner base comprises attaching the respective conditioning element to each pad conditioner base magnetically via at least one magnet included in each pad conditioner base.

Assignees

• Applied Materials Inc

Inventors

• Chen Hung
• Chang Shou-Sung
• Fung Jason Garcheung
• Gallelli Matthew A
• Butterfield Paul D
• Chou Kevin

Classifications

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title