Lapping head with a sensor device on the rotating lapping head

Patent metadata

Field	Value
Publication number	US-9308622-B2
Application number	US-201314057368-A
Country	US
Kind code	B2
Filing date	Oct 18, 2013
Priority date	Oct 18, 2013
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.

First claim

What is claimed is:

1. A lapping assembly comprising:
a lapping head including a base plate coupled to a proximal end of a rotatable shaft to support one or more workpieces against an abrasive lapping surface on a platen; and
a gap measurement sensor including a sensor element that is an opening of the base plate coaxially aligned with the rotatable shaft, the sensor element is configured to measure a gap between the sensor element and the platen.

2. A lapping assembly comprising:
a lapping head including a base structure coupled to a drive motor through a rotatable shaft, the base structure is configured to support one or more workpieces against an abrasive lapping surface;
a sensor device disposed in a no-conductive ring inset in the base structure of the lapping head; and
an electrical connector comprising a rotatable portion coupled to a distal end of the rotatable shaft and a stationary portion electrically coupled to one or more electronic components or circuitry that are separate from the lapping head and configured to process input from the sensor device, wherein the rotatable portion and the stationary portion together provide an electrical interface between the sensor element on the lapping head and the one or more electronic components or circuitry.

3. The lapping assembly of claim 2 wherein the electrical connector utilizes electrically conductive fluid to electrically connect one or more leads extending through the shaft and through the rotatable portion of the electrical connector to one or more leads connected to the stationary portion of the electrical connector.

4. The lapping assembly of claim 2 wherein the base structure of the head is coupled to a proximal end of the shaft and the electrical connector is coupled to a distal end of the shaft and the drive motor is axially spaced from a rotation axis of the shaft and is operably coupled to the shaft through a gear assembly to rotate the shaft for lapping.

5. The lapping assembly 4 wherein the gear assembly includes a first gear axially aligned with the motor and rotatable via rotation of the motor and a second gear coaxially aligned with the shaft and rotated via the motor through rotation of the second gear through engagement of the first gear.

6. The lapping assembly of claim 2 wherein the abrasive lapping surface is on a conductive platen and the sensor device is an eddy current sensor including a sensor element to induce an eddy current in the platen to measure a gap between the sensor element and the conductive platen.

7. The lapping assembly of claim 6 including the non-conductive ring inset in the base structure of the lapping head and the eddy current sensor is disposed in the non-conductive ring.

8. The lapping assembly of claim 2 , and further comprising a temperature sensor on the base structure of the lapping head electrically connected to the one or more electronic components or circuitry through the electrical connector.

9. The lapping assembly of claim 2 wherein the base structure includes a base plate including a plurality of flutes formed about a circumference of the base plate to dissipate heat.

10. A lapping assembly comprising:
a lapping head including a base plate coupled to a proximal end of a rotating shaft to support one or more workpieces against an abrasive lapping surface on a platen;
a gap measurement sensor including a sensor element that is inset in an opening of the base plate coaxially aligned with the rotatable shaft, the sensor element is configured to measure a gap between the sensor element and the abrasive lapping surface on the platen; and
an electrical connector comprising a rotatable portion coupled to a distal end of the rotating shaft and a stationary portion electrically coupled to one or more electronic components or circuitry that are separate from the lapping head and configures to process input from the sensor element, wherein the rotatable portion and the atationary portion together provide an electrical interface between the sensor element on the rotating lapping head and the one or more electronic components or circuitry.

11. The lapping assembly of claim 10 wherein the lapping head is coupled to a drive motor through the rotating shaft to rotate the base plate relative to the abrasive lapping surface.

12. The lapping assembly of claim 11 wherein the drive motor is axially spaced from the shaft and coupled to the shaft through a gear assembly including a first gear axially aligned with the motor and rotatable via rotation of the motor and a second gear coaxially aligned with the shaft and rotated via the motor through engagement of the first gear relative to the second gear.

13. The lapping assembly of claim 10 wherein the electrical connector provides an electrical connection through a conductive fluid.

14. The lapping assembly of claim 10 wherein the platen is conductive and the sensor is an eddy current sensor configured to measure the gap between the sensor element and the abrasive lapping surface on the conductive platen.

15. The lapping assembly of claim 14 wherein the eddy current sensor is inset in an insulated ring disposed in an opening of the base plate.

16. The lapping assembly of claim 10 and comprising a temperature sensor on the base plate connectable to the one or more electronic components or circuitry through the electrical connector.

Assignees

• Seagate Technology Llc

Inventors

• Li Leping
• Menz Andrew S
• Schmidt John F
• Mackin Stephen J

Classifications

• B24B37/013

  Devices or means for detecting lapping completion · CPC title

• B24B49/12

  involving optical means · CPC title

• B24B37/048

  of sliders and magnetic heads of hard disc drives or the like · CPC title

• B24B49/105 Primary

  using eddy currents · CPC title