Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Anti-tin whisker solder and method of manufacture thereof
US9308604B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9308604-B1 |
| Application number | US-201213585037-A |
| Country | US |
| Kind code | B1 |
| Filing date | Aug 14, 2012 |
| Priority date | Feb 6, 2008 |
| Publication date | Apr 12, 2016 |
| Grant date | Apr 12, 2016 |
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Abstract
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A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for preventing tin whiskers in a lead-free solder, the method comprising the steps of: providing a first amount of lead-free tin solder; and mixing a second amount of polyhedral oligomeric silsesquioxane with the first amount of lead-free tin solder, wherein the first and second amounts are selected to provide a resulting composition containing about 90% to about 99% by weight of the lead-free tin solder based on the total weight of the resulting composition and about 1% to about 10% by weight of the polyhedral oligomeric silsesquioxane based on the total weight of the resulting composition, and wherein the polyhedral oligomeric silsesquioxane contains at least one mercaptopropyl group. 2. The method of claim 1 , wherein the lead-free tin solder comprises about 3.5% by weight of silver and a balance of tin. 3. The method of claim 1 , wherein the lead-free tin solder comprises about 0.5% to about 0.7% by weight of copper, about 3.0% to about 4.0% by weight of silver, and a balance of tin. 4. The method of claim 1 , further comprising the step of atomizing the lead-free tin solder. 5. The method of claim 4 , further comprising the step of atomizing the polyhedral oligomeric silsesquioxane. 6. The method of claim 5 , wherein the step of mixing the second amount of polyhedral oligomeric silsesquioxane with the first amount of lead-free tin solder comprises mixing the atomized polyhedral oligomeric silsesquioxane and the atomized lead-free tin solder. 7. The method of claim 6 , further comprising the step of adding flux to the mixed polyhedral oligomeric silsesquioxane and lead-free solder to form a solder paste. 8. The method of claim 1 , wherein the polyhedral oligomeric silsesquioxane comprises at least one of mercaptopropylisobutyl and mercaptopropylisooctyl. 9. A method for preventing tin whiskers in a lead-free solder, the method comprising the steps of: providing a lead-free tin solder base; and adding a polyhedral oligomeric silsesquioxane containing a thiol functional group to the lead-free tin solder base, the thiol group forming covalent bonds with the tin element of the lead-free tin solder, reducing the number of sites for potential tin whisker growth, wherein the polyhedral oligomeric silsesquioxane contains at least one mercaptopropyl group. 10. The method of claim 9 , wherein the amount of lead-free tin solder and polyhedral oligomeric silsesquioxane are selected to provide a resulting composition containing about 90% to about 99% by weight of the lead-free tin solder based on the total weight of the resulting composition and about 1% to about 10% by weight of the polyhedral oligomeric silsesquioxane based on the total weight of the resulting composition. 11. The method of claim 9 , wherein the lead-free tin solder comprises about 0.5% to about 0.7% by weight of copper, about 3.0% to about 4.0% by weight of silver, and a balance of tin.
Assignees
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Classifications
- B23K35/262Primary
Sn as the principal constituent · CPC title
Alloys based on antimony or bismuth · CPC title
Silica or silicates · CPC title
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Frequently asked questions
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- What does patent US9308604B1 cover?
- A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.
- Who is the assignee on this patent?
- Daly Gregory T, Yan Gary H, Lockheed Corp
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).