Camera module
US-2024214654-A1 · Jun 27, 2024 · US
Electronic component and electronic component assembly apparatus
US9307686B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9307686-B2 |
| Application number | US-201213420131-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2012 |
| Priority date | Mar 16, 2011 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic component comprising: a wiring substrate having a first surface and a second surface; an electronic component body mounted on a first surface side of the wiring substrate; a plurality of external electrodes formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrodes being electrically connected to the electronic component body, the external electrodes being connected to a subs…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9307686B2 cover?
- An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a hea…
- Who is the assignee on this patent?
- Takada Katsumi, Moriizumi Kiyokazu, Itoh Masayuki, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0212. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).