Over-current protection device and protective circuit board containing the same

Patent metadata

Field	Value
Publication number	US-9307646-B2
Application number	US-201414509619-A
Country	US
Kind code	B2
Filing date	Oct 8, 2014
Priority date	Nov 25, 2013
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

An over-current protection device adapted to be soldered onto a circuit board comprises a PTC material layer, a first electrode foil, a second electrode foil, a bonding section and a metal connecting member. The PTC material layer has opposite first and second surfaces. The first electrode foil is in physical contact with the first surface, and the second electrode foil electrically connects to the second surface. Both the second electrode foil and the bonding section are disposed on bottom of the device, and the bonding section is separated from the second electrode foil. The metal connecting member is disposed on the lateral surface of the device. The second electrode foil is adapted to be soldered onto an electrode section of the circuit board. The bonding section and the metal connecting member connect to corresponding joint section of the circuit board.

First claim

We claim:

1. An over-current protection device adapted to be soldered onto a circuit board and being a rectangular cuboid of an upper surface, a lower surface and four lateral surfaces connecting the upper and lower surfaces, comprising:
a PTC material layer having opposite first and second surfaces;
a first electrode foil in physical contact with the first surface of the PTC material layer;
a second electrode foil disposed at a lower surface of the over-current protection device and electrically connecting to the second surface of the PTC material layer;
at least one bonding section disposed at a lower surface of the over-current protection device and being separated from the second electrode foil; and
at least one metal connecting member disposed on at least one of the lateral surfaces;
wherein the second electrode foil is adapted to be soldered onto an electrode section of the circuit board, and the bonding section and metal connecting member connect to at least one joint section of the circuit board by soldering.

2. The over-current protection device of claim 1 , wherein the bonding section surrounds the second electrode foil, and is disposed at a periphery of the lower surface.

3. The over-current protection device of claim 2 , wherein the metal connecting members are disposed on all of the four lateral surfaces.

4. The over-current protection device of claim 1 , wherein two bonding sections are disposed at two opposite ends of the lower surface, and the second electrode foil is disposed between the two bonding sections.

5. The over-current protection device of claim 4 , wherein the metal connecting members are disposed at two of the four lateral surfaces corresponding to the metal connecting members.

6. The over-current protection device of claim 1 , wherein the bonding sections are disposed at corners of the lower surface.

7. The over-current protection device of claim 6 , wherein the metal connecting members are disposed at corner surfaces defined by every two adjacent lateral surfaces.

8. The over-current protection device of claim 1 , wherein the metal connecting member connects the first electrode foil and the bonding section.

9. The over-current protection device of claim 1 , wherein the second electrode foil is in physical contact with the second surface of the PTC material layer.

10. The over-current protection device of claim 1 , wherein a welding plate is formed on the first electrode foil for connecting to an external electrode by spot-welding.

11. The over-current protection device of claim 1 , further comprising:
an insulating layer disposed on the first electrode foil; and
a third electrode foil disposed on the insulating layer and electrically connecting to the first electrode foil.

12. The over-current protection device of claim 1 , further comprising:
a third electrode foil disposed on the second surface of the PTC material layer and being separated from the metal connecting member;
an insulating layer disposed between the second and third electrode foils; and
a conductive member penetrating through the insulating layer to electrically connect to the second and third electrode foils.

13. A protective circuit board, comprising:
an over-current protection device being a rectangular cuboid of an upper surface, a lower surface and four lateral surfaces connecting the upper and lower surfaces, comprising:
a PTC material layer having opposite first and second surfaces;
a first electrode foil in physical contact with the first surface of the PTC material layer;
a second electrode foil disposed at a lower surface of the over-current protection device;
at least one bonding section disposed at the lower surface of the over-current protection device and being separated from the second electrode foil; and
at least one metal connecting member disposed on at least one of the lateral surfaces; and

a circuit board having a surface provided with an electrode section and at least one joint section;
wherein the second electrode foil is soldered onto the electrode section of the circuit board, and the bonding section and metal connecting member connect to the joint section by soldering.

14. The protective circuit board of claim 13 , wherein the bonding section surrounds the second electrode foil, and is disposed at a periphery of the lower surface.

15. The protective circuit board of claim 13 , wherein two bonding sections are disposed at two opposite ends of the lower surface, and the second metal electrode foil is disposed between the two bonding sections.

16. The protective circuit board of claim 13 , wherein the bonding sections are disposed at corners of the lower surface, and the metal connecting members are disposed at corner surfaces defined by every two adjacent lateral surfaces.

17. The protective circuit board of claim 13 , wherein soldering wicking structure is formed between the metal connecting member and the circuit board.

18. The protective circuit board of claim 13 , wherein the circuit board is a FPC board.

19. The protective circuit board of claim 18 , wherein the PFC board is provided with two welding plates electrically connecting to the bonding section and the second electrode foil, respectively.

20. The protective circuit board of claim 19 , wherein the FPC board is provided with two openings corresponding to two welding plates for welding connection to external electrodes at either side.

Assignees

• Tseng Chun Teng
• Su Chi Jen
• Lee Wen Feng
• Polytronics Technology Corp

Inventors

• Tseng Chun Teng
• Su Chi Jen
• Lee Wen Feng

Classifications

• H01C7/02 Primary

  having positive temperature coefficient · CPC title

• Y02P70/611

  Cross-Sectional Technologies · mapped topic

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title