Circuit module
US-2024237188-A9 · Jul 11, 2024 · US
Device mounting board, cell, and battery module
US9307630B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9307630-B2 |
| Application number | US-201313768777-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 15, 2013 |
| Priority date | Mar 31, 2011 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.
First claim
Opening claim text (preview).
What is claimed is: 1. A device mounting board comprising: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulating resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, wherein the heat dissipating substrate comprises a first porous layer having a surface facing the insulating resin layer, and having cavities elongated…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9307630B2 cover?
- A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random…
- Who is the assignee on this patent?
- Sanyo Electric Co, Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0203. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).