Light-emitting element unit and display device

Patent metadata

Field	Value
Publication number	US-9306129-B2
Application number	US-201113277417-A
Country	US
Kind code	B2
Filing date	Oct 20, 2011
Priority date	Oct 25, 2010
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

A light-emitting element unit which can improve color purity of light emitted from a color filter is provided. A display device with high color purity and high color reproducibility is provided. The light-emitting element unit includes a wiring board, a light-emitting element chip provided over the wiring board, a micro optical resonator provided over the wiring board and at the periphery of the light-emitting element chip, and a phosphor layer covering the light-emitting element chip and the micro optical resonator. The display device includes a display panel having a coloring layer and a backlight module having the light-emitting element unit. Examples of the display panel include: a liquid crystal panel; and a display panel including an opening portion provided over a first substrate, MEMS moving over the opening portion in the lateral direction, and a second substrate provided with a coloring layer in a portion corresponding to the opening portion.

First claim

What is claimed is:

1. A light-emitting element unit comprising:
a board;
a light-emitting element chip provided over the board;
a micro optical resonator provided at a periphery of the light-emitting element chip; and
a phosphor layer covering at least the light-emitting element chip,
wherein the phosphor layer is provided between the light-emitting element chip and the micro optical resonator, and
wherein the micro optical resonator comprises a reflective layer, a semi-transmissive semi-reflective layer facing the reflective layer and a light-transmitting layer sandwiched therebetween.

2. The light-emitting element unit according to claim 1 ,
wherein the semi-transmissive semi-reflective layer covers a top surface and a side surface of the light-transmitting layer.

3. The light-emitting element unit according to claim 2 , wherein a light path length L between the reflective layer and the semi-transmissive semi-reflective layer is represented by a formula, L=(2 m+1) λ/4n, and
wherein the m indicates an integer, the λ indicates a wavelength, and the n indicates a refractive index of the light-transmitting layer.

4. The light-emitting element unit according to claim 3 , wherein the λ is 430 nm to 490 nm.

5. The light-emitting element unit according to claim 3 , wherein the λ is 490 nm to 550 nm.

6. The light-emitting element unit according to claim 3 , wherein the λ is 550 nm to 590 nm.

7. The light-emitting element unit according to claim 3 , wherein the λ is 640 nm to 770 nm.

8. The light-emitting element unit according to claim 2 , wherein the light-transmitting layer comprises a plurality of layers which are stacked.

9. The light-emitting element unit according to claim 1 , wherein the phosphor layer covers the micro optical resonator.

10. The light-emitting element unit according to claim 1 , further comprising an organic resin layer covering the phosphor layer, wherein the organic resin layer transmits a light, and wherein a shape of the organic resin layer is a convex shape.

11. The light-emitting element unit according to claim 1 , wherein the micro optical resonator does not overlap with the light-emitting element chip.

12. A display device comprising:
a substrate;
a module including a light-emitting element unit provided over the substrate;
a diffusion plate overlapping with the module;
a first polarizing plate overlapping with the diffusion plate;
a liquid crystal panel overlapping with the first polarizing plate; and
a second polarizing plate overlapping with the liquid crystal panel,
the light-emitting element unit comprising:
a board;
a light-emitting element chip provided over the board;
a micro optical resonator provided at a periphery of the light-emitting element chip; and
a phosphor layer covering at least the light-emitting element chip,
wherein the phosphor layer is provided between the light-emitting element chip and the micro optical resonator,
wherein the micro optical resonator comprises a reflective layer, a semi-transmissive semi-reflective layer facing the reflective layer and a light-transmitting layer sandwiched therebetween, and
wherein the liquid crystal panel includes a coloring layer.

13. The display device according to claim 12 , wherein an optical member is provided between the diffusion plate and the first polarizing plate.

14. The display device according to claim 12 ,
wherein the semi-transmissive semi-reflective layer covers a top surface and a side surface of the light-transmitting layer.

15. The display device according to claim 14 , wherein a light path length L between the reflective layer and the semi-transmissive semi-reflective layer is represented by a formula, L=(2 m+1) λ/4n, and
wherein the m indicates an integer, the λ indicates a wavelength, and the n indicates a refractive index of the light-transmitting layer.

16. The display device according to claim 15 , wherein the λ is 430 nm to 490 nm.

17. The display device according to claim 15 , wherein the λ is 490 nm to 550 nm.

18. The display device according to claim 15 , wherein the λ is 550 nm to 590 nm.

19. The display device according to claim 15 , wherein the λ is 640 nm to 770 nm.

20. The display device according to claim 14 , wherein the light-transmitting layer comprises a plurality of layers which are stacked.

21. The display device according to claim 12 , wherein the phosphor layer covers the micro optical resonator.

22. The display device according to claim 12 , further comprising an organic resin layer covering the phosphor layer, wherein the organic resin layer transmits a light, and wherein a shape of the organic resin layer is a convex shape.

23. The display device according to claim 12 , wherein the micro optical resonator does not overlap with the light-emitting element chip.

Assignees

• Yamazaki Shunpei
• Hirakata Yoshiharu
• Semiconductor Energy Lab

Inventors

• Yamazaki Shunpei
• Hirakata Yoshiharu

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W90/00

  Package configurations · CPC title

• H10H20/8506

  Containers · CPC title