Semiconductor device
US-12057459-B2 · Aug 6, 2024 · US
US9306071B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9306071-B2 |
| Application number | US-201414161474-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2014 |
| Priority date | Jan 30, 2013 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A thin-film transistor (TFT) substrate includes a flexible substrate. A first barrier layer is formed on the flexible substrate. The first barrier layer includes a first silicon oxide layer and a first silicon nitride layer. A second barrier layer is formed on the first barrier layer. The second barrier layer includes a second silicon oxide layer and a second silicon nitride layer. A TFT layer is formed on the second barrier layer. The second silicon oxide layer is disposed adjacent to the TFT layer.
Opening claim text (preview).
What is claimed is: 1. A thin-film transistor (TFT) substrate, comprising: a flexible substrate; a first barrier layer formed on the flexible substrate, the first barrier layer comprising a first silicon oxide layer and a first silicon nitride layer; a second barrier layer formed on the first barrier layer, the second barrier layer comprising a second silicon oxide layer and a second silicon nitride layer; a silicon oxynitride layer interposed between the first silicon nitride layer and the second silicon nitride layer; and a TFT layer formed on the second barrier layer, wherein the second silicon oxide layer is disposed closer to the TFT layer than the first silicon oxide layer, wherein the first silicon nitride layer and the second silicon nitride layer are interposed between the first silicon oxide layer and the second silicon oxide layer, wherein the first silicon nitride layer is in contact with the second silicon nitride layer, and wherein a total thickness of the first and second silicon nitride layers is less than a total thickness of the first and second silicon oxide layers. 2. The TFT substrate of claim 1 , wherein the first silicon oxide layer is in contact with the flexible substrate, and the first silicon nitride layer of the first barrier layer is in contact with the first silicon oxide layer. 3. The TFT substrate of claim 1 , further comprising a silicon nitride layer interposed between the flexible substrate and the first silicon oxide layer. 4. The TFT substrate of claim 3 , further comprising a silicon oxynitride layer between the first silicon nitride layer and the second silicon nitride layer. 5. The TFT substrate of claim 3 , wherein the silicon oxide layer is in contact with the flexible substrate, and the silicon nitride layer is in contact with the silicon oxide layer. 6. The TFT substrate of claim 5 , further comprising a silicon oxynitride layer between the first silicon nitride layer and the second silicon nitride layer. 7. The TFT substrate of claim 1 , wherein each of the first and second barrier layers further includes one or more silicon oxide layers and one or more silicon nitride layers. 8. An organic light-emitting display device, comprising: a flexible substrate; a first barrier layer formed on the flexible substrate, the first barrier layer comprising a first silicon oxide layer and a first silicon nitride layer; a second barrier layer formed on the first barrier layer, the second barrier layer comprising a second silicon oxide layer and a second silicon nitride layer; a silicon oxynitride layer interposed between the first silicon nitride layer and the second silicon nitride layer; a thin-film transistor (TFT) formed on the second barrier layer; and an organic light-emitting layer formed on the second barrier layer, the organic light-emitting layer connected to the TFT, wherein the first silicon nitride layer is in contact with the second silicon nitride layer, and wherein the first silicon oxide layer of the first barrier layer is disposed on the flexible substrate, and the first silicon nitride layer of the first barrier layer is disposed on the first silicon oxide layer of the first barrier layer, and wherein the second silicon nitride layer of the second barrier layer is in contact with the first barrier layer, and the second silicon oxide layer of the second barrier layer is disposed on the second silicon nitride layer of the second barrier layer. 9. The organic light-emitting display device of claim 8 , further comprising a silicon oxynitride layer between the first silicon nitride layer and the second silicon nitride layer. 10. The organic light-emitting display device of claim 8 , further comprising a silicon nitride layer disposed between the flexible substrate and the first silicon oxide layer.
Flexible substrates · CPC title
wherein the TFTs are in active matrices · CPC title
characterised by the insulating substrates · CPC title
characterised by materials, geometry or structure of the substrates · CPC title
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.