Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Cluster system for eliminating barrier overhang
US9305840B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9305840-B2 |
| Application number | US-201314138038-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 21, 2013 |
| Priority date | Dec 21, 2013 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
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Abstract
Official abstract text for this publication.
A cluster tool is disclosed that can increase throughput of a wafer fabrication process by facilitating removal of barrier overhang in contact holes of contact film stacks. Individual chambers of the cluster tool provide for deposition of barrier material onto a semiconductor structure, depositing over with an amorphous carbon film (ACF), etching back the ACF, and etching a corner region of the contact hole. Removal of the barrier overhang improves the quality of metal fill-in of the contact hole. An expectedly ensuing feature entails a technique in which filling-in of the contact hole with a metal such as tungsten can be achieved with attenuated or eliminated adverse consequence.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for metal fill-in comprising: providing a semiconductor structure that includes at least one undulation; depositing a barrier material to cover at least part of the semiconductor structure including the at least one undulation and to form an overhang of the barrier material in the at least one undulation in a first chamber of a cluster tool; depositing an ashable material film on the semiconductor structure including the at least one undulation…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W20/42Primary
Electricity · mapped topic
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- What does patent US9305840B2 cover?
- A cluster tool is disclosed that can increase throughput of a wafer fabrication process by facilitating removal of barrier overhang in contact holes of contact film stacks. Individual chambers of the cluster tool provide for deposition of barrier material onto a semiconductor structure, depositing over with an amorphous carbon film (ACF), etching back the ACF, and etching a corner region of the…
- Who is the assignee on this patent?
- Macronix Int Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W20/42. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).