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Device for emulating temperature of an exothermic composite structure through a thermal cure cycle
US9304048B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9304048-B2 |
| Application number | US-201313904363-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 29, 2013 |
| Priority date | Nov 26, 2012 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A temperature emulator may include a stacked assembly including a pair of end plates positioned at an uppermost and lowermost location of the stacked assembly, a plurality of heat sink plates positioned between the pair of end plates, a plurality of shim plates positioned between adjacent pairs of heat sink plates, and an exothermic charge assembly positioned between at least one pair of heat sink plates, the exothermic charge assembly including an exotherm charge configured to react exothermally in response to a thermal cure cycle.
First claim
Opening claim text (preview).
What is claimed is: 1. A temperature emulator comprising: a plurality of thermally conductive plates configured in a stacked assembly, wherein said plurality of thermally conductive plates define an open cavity in said stacked assembly; and an exotherm charge disposed between at least one adjacent pair of thermally conductive plates of said plurality of thermally conductive plates. 2. The temperature emulator of claim 1 further comprising at least one tem…
Assignees
Inventors
Classifications
- B29C35/0288Primary
Operations & Transport · mapped topic
Cross-Sectional Technologies · mapped topic
- G01K7/02Primary
Physics · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US9304048B2 cover?
- A temperature emulator may include a stacked assembly including a pair of end plates positioned at an uppermost and lowermost location of the stacked assembly, a plurality of heat sink plates positioned between the pair of end plates, a plurality of shim plates positioned between adjacent pairs of heat sink plates, and an exothermic charge assembly positioned between at least one pair of heat s…
- Who is the assignee on this patent?
- Boeing Co
- What technology area does this patent fall under?
- Primary CPC classification B29C35/0288. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).