Thermal conduction principle and device for intercrossed structure having different thermal characteristics

Patent metadata

Field	Value
Publication number	US-9303928-B2
Application number	US-60739609-A
Country	US
Kind code	B2
Filing date	Oct 28, 2009
Priority date	Jul 23, 2008
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

The present invention relates to relay thermal conductor made of material having better thermal conductivity coefficient, wherein which is thermal conductively coupled with heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof; the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof; and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between the relay thermal conductor and the second thermal body.

First claim

The invention claimed is:

1. A multi-layer thermally conductive structure including a plurality of partially overlapping conductors having different thermal conducting characteristics, comprising:
a relay thermal conductor having a first surface that contacts and is thermally coupled with a first thermal body;
an interface thermal conductor between said relay thermal conductor and a second thermal body, said second thermal body contacting only the interface thermal conductor and…

Assignees

• Yang Tai-Her

Inventors

• Yang Tai-Her

Classifications

• H10W40/255

  Electricity · mapped topic

• H10W40/228

  Electricity · mapped topic

• H10W40/25

  Electricity · mapped topic

• H10W40/10

  Electricity · mapped topic

• F28F13/00 Primary

  Mechanical Engineering · mapped topic