Light emitting module having heat conductive substrate

Patent metadata

Field	Value
Publication number	US-9303855-B2
Application number	US-201414158207-A
Country	US
Kind code	B2
Filing date	Jan 17, 2014
Priority date	May 30, 2008
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

A lighting apparatus including at least one light-emitting element mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer.

First claim

What is claimed is:

1. A module substrate comprising:
a substrate comprising a first surface, a second surface opposite to the first surface, and a corresponding portion of the first surface having an heat conductive layer;
a light-emitting element mounted on the first surface; and
a heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is not electrically connected to the light-emitting element, and is thermally connected to the heat conductive layer,
wherein the heat conductive layer is not electrically connected to the light-emitting element.

2. A lighting apparatus comprising:
an apparatus main body; and
a module substrate, the module substrate comprising:
a substrate comprising a first surface, a second surface opposite to the first surface, and a corresponding portion of the first surface having an heat conductive layer;
a light-emitting element mounted on the first surface; and
a heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is not electrically connected to the light-emitting element, and is thermally connected to the heat conductive layer,

wherein the heat conductive layer is not electrically connected to the light-emitting element.

Assignees

• Toshiba Lighting & Technology
• Toshiba Kk

Inventors

• Moriyama Takayoshi
• Higuchi Kazunari
• Hashimoto Sumio
• Kumashiro Shinichi

Classifications

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K2201/10409

  Screws · CPC title

• F21V21/00

  Supporting, suspending, or attaching arrangements for lighting devices (F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00); Hand grips · CPC title

• H05K2201/09063

  Holes or slots in insulating substrate not used for electrical connections · CPC title