Thermosetting epoxy resin composition and semiconductor device

Patent metadata

Field	Value
Publication number	US-9303115-B2
Application number	US-63735909-A
Country	US
Kind code	B2
Filing date	Dec 14, 2009
Priority date	Dec 15, 2008
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by:

R 11 —COO—R 12   (1)

wherein R 11 and R 12 are C n H 2n+1 and n is 1 to 30 and a compound represented by:

wherein R 1 , R 2 , and R 3 are selected from H, —OH, —OR, and —OCOC a H b with the proviso that at least one includes —OCOC a H b ; R is C n H 2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.

First claim

The invention claimed is:

1. A thermosetting epoxy resin composition comprising
(A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0;
(B) an internal mold release agent;
(C) a reflective material;
(D) an inorganic filler; and
(E) a curing catalyst;

wherein the internal mold release agent of component (B) comprises in combination:
a carboxylate ester represented by the following general formula (1):
R 11 —COO—R 12   (1)

wherein
R 11 and R 12 are independently an alkyl group represented by C n H 2n+1 , and
for R 11 n is a number of 2 to 28, and
for R 12 n is a number of 5 to 25, and

a compound represented by the following general formula (2):

wherein R 1 , R 2 , and R 3 are independently selected from H, —OH, —OR, and —O(C═O)C a H b with the proviso that at least one of the R 1 , R 2 , and R 3 includes —O(C═O)C a H b ; R is an alkyl group represented by C p H 2p+1 ,
wherein p is an integer of 1 to 30, a is an integer of 10 to 30, and b is an integer of 17 to 61, and

wherein the weight ratio, in the internal mold release agent of component (B), of the carboxylate ester of the formula (1) to the compound of the formula (2) is in the range of 1:5 to 3:4, and
the compound of the formula (2) constitutes at least 50% by weight of the entire internal mold release agent of component (B), and
the internal mold release agent of component (B) has a melting point in the range of 50 to 90° C., and
the internal mold release agent of component (B) has a volatile content at 250° C. of up to 10% by weight, and
wherein an amount of the reflective material of component (C) is from 5 to 80% by weight of the entire composition.

2. A thermosetting epoxy resin composition according to claim 1 wherein the total content of the carboxylate ester of formula (1) and the compound of the formula (2) in the entire composition is 0.2 to 5.0% by weight.

3. A thermosetting epoxy resin composition according to claim 1 wherein the reflective material of component (C) is titanium dioxide which has its surface treated with an inorganic or organic substance; lead content in component (C) is up to 10 ppm; the curing catalyst of component (E) is an octylate of a tertiary amine; and the content of component (E) is 0.05 to 5% by weight in relation to the entire composition.

4. A thermosetting epoxy resin composition according to claim 1 wherein the triazine derivative epoxy resin is 1,3,5-triazine derivative epoxy resin.

5. A thermosetting epoxy resin composition according to claim 4 wherein the reaction mixture of the component (A) contains a compound represented by the following general formula (3):

wherein R 4 represents an acid anhydride residue, and m is a number of 0 to 200.

6. A semiconductor element case comprising a cured product of the thermosetting epoxy resin composition according to claim 1 .

7. A semiconductor device comprising a semiconductor element encapsulated by a cured product of the thermosetting epoxy resin composition according to claim 1 .

8. A thermosetting epoxy resin composition according to claim 1 , wherein the compound of formula (2) in the internal mold release agent of component (B) comprises glycerin monostearate having a melting point of 50 to 70° C. and the content of the internal mold release agent is 0.2 to 5.0% by weight in the entire composition.

9. A thermosetting epoxy resin composition according to claim 1 , wherein a reinforcing material (F) is added.

10. A thermosetting epoxy resin composition according to claim 9 , wherein the component (F) is a triclinic silicate mineral represented by the chemical formula: CaSiO 3 .

11. A thermosetting epoxy resin composition according to claim 9 , wherein the content of the reinforcing material of component (F) is 1 to 80% by weight in the entire composition.

12. A package comprising the thermosetting epoxy resin composition according to claim 1 and a recess for placing a light-emitting element in the recess.

13. A thermosetting epoxy resin composition according to claim 1 , wherein for R 11 n is a number of 5 to 25.

14. A thermosetting epoxy resin composition according to claim 1 , wherein n=18 for R 11 or R 12 of general formula (1).

15. A thermosetting epoxy resin composition according to claim 1 , wherein the internal mold release agent of component (B) has a melting point in the range of 65 to 85° C.

Assignees

• Hayashi Masaki
• Taguchi Yusuke
• Tomiyoshi Kazutoshi
• Tada Tomoyoshi
• Nichia Corp

Inventors

• Hayashi Masaki
• Taguchi Yusuke
• Tomiyoshi Kazutoshi
• Tada Tomoyoshi

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W76/47

  Solid or gel fillings · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title