Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus

Patent metadata

Field	Value
Publication number	US-9302366-B2
Application number	US-201514800896-A
Country	US
Kind code	B2
Filing date	Jul 16, 2015
Priority date	Jun 2, 2011
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

First claim

What is claimed is:

1. A method of monitoring a polishing surface of a polishing pad for use in a polishing apparatus, said method comprising:
conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface;
measuring a height of the polishing surface at a measuring point while said conditioning of the polishing surface is performed;
calculating a position of the measuring point of the height on a two-dimensional surface defined on the polishing surface;
associating the calculated position of the measuring point with a measured value of the height;
repeating said measuring, said calculating, and said associating at a plurality of different points on the polishing pad to obtain a set of measured values of the height and associated positions of the measured values;
creating a height distribution of the polishing surface based on the set of measured values of the height and the associated positions of the measured values;
creating an X-axis profile and a Y-axis profile of the polishing pad from the height distribution based on the measured values of the height at measuring points located in predetermined sampling regions on an X axis and a Y axis of a X-Y rotating coordinate system defined on the two-dimensional surface;
calculating a first difference in the height of the polishing surface between an initial X-axis profile and a subsequent X-axis profile obtained when a predetermined time has elapsed;
dividing the first difference by the predetermined time to determine an X-axis cutting rate;
calculating a second difference in the height of the polishing surface between an initial Y-axis profile and a subsequent Y-axis profile obtained when the predetermined time has elapsed; and
dividing the second difference by the predetermined time to determine a Y-axis cutting rate.

2. The method according to claim 1 , wherein said creating of the X-axis profile and the Y-axis profile comprises arranging the measured values of the height at the measuring points, located in the predetermined sampling regions, along the X axis and the Y axis of the X-Y rotating coordinate system defined on the two-dimensional surface to thereby create the X-axis profile and the Y-axis profile of the polishing pad, the predetermined sampling regions extending on the X axis and the Y axis, respectively.

3. The method according to claim 2 , further comprising:
determining whether said conditioning of the polishing pad is performed properly based on the X-axis cutting rate and the Y-axis cutting rate.

4. The method according to claim 3 , wherein said determining whether said conditioning of the polishing pad is performed properly comprises determining that said conditioning of the polishing pad is not performed properly if the X-axis cutting rate is not uniform over an entirety of the X-axis and the Y-axis cutting rate is not uniform over an entirety of the Y-axis.

5. The method according to claim 1 , wherein said creating of the X-axis profile and the Y-axis profile comprises extracting, from the measured values obtained, measured values of the height at the measuring points located in the predetermined sampling regions that extend respectively on the X axis and the Y axis of the X-Y rotating coordinate system defined on the two-dimensional surface, and arranging the extracted measured values along the X axis and the Y axis to thereby create the X-axis profile and the Y-axis profile of the polishing pad.

6. The method according to claim 5 , further comprising:
determining whether said conditioning of the polishing pad is performed properly based on the X-axis cutting rate and the Y-axis cutting rate.

7. The method according to claim 6 , wherein said determining whether said conditioning of the polishing pad is performed properly comprises determining that said conditioning of the polishing pad is not performed properly if the X-axis cutting rate is not uniform over an entirety of the X-axis and the Y-axis cutting rate is not uniform over an entirety of the Y-axis.

8. The method according to claim 1 , wherein said measuring the height of the polishing surface comprises measuring a height of the polishing surface from a vertical position of the dresser on the polishing surface at a measuring point while said conditioning of the polishing surface is performed.

9. The method according to claim 1 , further comprising:
determining whether said conditioning of the polishing pad is performed properly based on the X-axis cutting rate and the Y-axis cutting rate.

10. The method according to claim 9 , wherein said determining whether said conditioning of the polishing pad is performed properly comprises determining that said conditioning of the polishing pad is not performed properly if the X-axis cutting rate is not uniform over an entirety of the X-axis and the Y-axis cutting rate is not uniform over an entirety of the Y-axis.

11. An apparatus for monitoring a polishing surface of a polishing pad for use in a polishing apparatus, said apparatus comprising:
a rotatable dresser configured to condition the polishing surface of the polishing pad while oscillating on the polishing surface;
a pad height sensor configured to measure a height of the polishing surface at a plurality of different measuring points while conditioning of the polishing surface is performed to obtain measured values of the height;
a pad monitoring device configured to monitor the polishing pad, said pad monitoring device including
a position calculator configured to calculate a position of each of the plurality of different measuring points on a two-dimensional surface, said the pad monitoring device being configured to associate the calculated position of each of the plurality of different measuring points with a corresponding one of the measured values of the height to obtain associated positions, and
a pad height analyzer configured to create a height distribution of the polishing surface from the measured values of the height and the associated positions, and

a pad-profile generator configured to:
create an X-axis profile and a Y-axis profile of the polishing pad from the height distribution based on the measured values of the height at measuring points located in predetermined sampling regions on an X axis and a Y axis of an X-Y rotating coordinate system defined on the two-dimensional surface;
calculate a first difference in the height of the polishing surface between an initial X-axis profile and a subsequent X-axis profile obtained when a predetermined time has elapsed;
divide the first difference by the predetermined time to determine an X-axis cutting rate;
calculate a second difference in the height of the polishing surface between an initial Y-axis profile and a subsequent Y-axis profile obtained when the predetermined time has elapsed; and
divide the second difference by the predetermined time to determine a Y-axis cutting rate.

12. The apparatus according to claim 11 , wherein said pad-profile generator is configured to arrange the measured values of the height at the measuring points, located in the predetermined sampling regions, along the X axis and the Y axis of the X-Y rotating coordinate system defined on the two-dimensional surface to thereby create the X-axis profile and the Y-axis profile of the polishing pad, the predetermined sampling regions extending on the X axis and the Y axis, respectively.

13. The apparatus according to claim 12 , wherein said pad-profile generator is configured to determine whether conditioning of the polishing pad is performed properly based on the X-axis cutting rate and the Y-axis cutting rate.

Assignees

• Ebara Corp

Inventors

• Shinozaki Hiroyuki
• Shimano Takahiro
• Imamura Akira
• Nakamura Akira

Classifications

• B24B49/18

  taking regard of the presence of dressing tools · CPC title

• B24B49/02

  according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent (B24B49/12 takes precedence) · CPC title

• B24B53/017

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B37/042 Primary

  operating processes therefor · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title