Laser machining device and adjusting method for same

US9302347B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9302347-B2
Application numberUS-201313945909-A
CountryUS
Kind codeB2
Filing dateJul 19, 2013
Priority dateMay 14, 2013
Publication dateApr 5, 2016
Grant dateApr 5, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A laser machining device includes a laser emitting device, a supporting device including a supporting surface, a controller, and optical detecting units mounted on the supporting surface. The laser machining device sets an X-Y coordinates having an original point and moves to being substantially above one of the optical detecting units. A laser beam is emitted at a plurality of microscopically-close positions and the values of the luminous flux of the received laser beams are detected, the values being sent to the controller. The controller compares the detected values to determine the greatest value, and corrects the position of the original point to accord with the position of the greatest detected value.

First claim

Opening claim text (preview).

What is claimed is: 1. A laser machining device comprising: a laser emitting device; a supporting device comprising a supporting surface; a controller; and a optical detecting unit mounted on the supporting surface; wherein the laser machining device sets X-Y coordinates comprising an original point, the laser emitting device is configured to emit a laser beam at a plurality of positions, the optical detecting unit is configured to detect luminous flux of the laser beam and send detected values to the controller, the controller is configured to compare the luminous flux values to determine a greatest detected value, determine that the laser emitting device is aligned with the optical detecting unit at the position corresponding to the greatest detected value, and correct the position of the original point to accord with the position corresponding to the greatest detected value. 2. The laser machining device of claim 1 , wherein the supporting surface defines a supporting hole configured to receive a molding core. 3. The laser machining device of claim 2 , wherein the supporting surface and the supporting hole are rectangular. 4. The laser machining device of claim 1 , wherein the optical detecting unit comprises a lens and an optical sensor covered by the lens. 5. The laser machining device of claim 4 , wherein the lens is a collimating lens. 6. An adjusting method for a laser machining device, comprising: providing the laser machining device, the laser machining device comprising a laser emitting device, a support device comprising a support surface, a controller, and an optical detecting unit mounted on the support surface, the laser machining device setting X-Y coordinates comprising an original point, a coordinate value of the optical detecting unit being (a, b); moving the laser emitting device to substantially above the optical detecting unit; emitting a laser beam by the laser emitting device at three first positions having coordinate values of (a−d1, b), (a, b), (a+d1, b); obtaining three first luminous flux values corresponding to the three first positions by the optical detecting unit; sending the three first luminous flux values to the controller by the optical detecting unit, wherein d1 is a predetermined interval; comparing the three first luminous flux values to obtain a greatest first luminous flux value and determining that the laser emitting device is aligned with the optical detecting unit at one of the first positions corresponding to the greatest first luminous flux value; correcting the position of the original point at the X coordinate to accord with the one of the first positions corresponding to the greatest first luminous flux value; emitting a laser beam by the laser emitting device at three second positions having coordinate values of (a, b−d1), (a, b), (a, b+d1); obtaining three second luminous flux values corresponding to the three second positions by the optical detecting unit; sending the three second luminous flux values to the controller by the optical detecting unit; and comparing the three second luminous flux values to obtain a greatest second luminous flux value and determining that the laser emitting device is aligned with the optical detecting unit at one of the second positions corresponding to the greatest second luminous flux value; and correcting the position of the original point at the Y coordinate to accord with the one of the second positions corresponding to the greatest second luminous flux value. 7. The adjusting method of claim 6 , wherein if the laser emitting device is aligned with the optical detecting unit at the first position having coordinate value of (a−d1, b), the original point moves towards the negative direction of the X coordinate by a distance equal to d1; if the laser emitting device is aligned with the optical detecting unit at the first position having coordinate value of (a, b), the original point remains unchanged; and if the laser emitting device is aligned with the optical detecting unit at the first position having coordinate value of (a+d1, b), the original point moves towards the positive direction of the X coordinate by a distance equal to d1. 8. The adjusting method of claim 6 , wherein if the laser emitting device is aligned with the optical detecting unit at the second position having coordinate value of (a, b−d1), the original point moves towards the negative direction of the Y coordinate by a distance equal to d1; if the laser emitting device is aligned with the optical detecting unit at the second position having coordinate value of (a, b), the original point remains unchanged; and if the laser emitting device is aligned with the optical detecting unit at the second position having coordinate value of (a, b+d1), the original point moves towards the positive direction of the Y coordinate by a distance equal to d1. 9. The adjusting method of claim 6 , wherein the supporting surface defines a supporting hole configured to receive a molding core. 10. The adjusting method of claim 9 , wherein the supporting surface and the supporting hole are rectangular shaped. 11. The adjusting method of claim 6 , wherein the optical detecting unit comprises a lens and an optical sensor covered by the lens. 12. The adjusting method of claim 11 , wherein the lens is a collimating lens.

Assignees

Inventors

Classifications

  • for surface treatment · CPC title

  • Automatically aligning the laser beam · CPC title

  • characterised by selective application of radiation to a printing material or impression-transfer material · CPC title

  • Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light · CPC title

  • Auxiliary operations or equipment · CPC title

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What does patent US9302347B2 cover?
A laser machining device includes a laser emitting device, a supporting device including a supporting surface, a controller, and optical detecting units mounted on the supporting surface. The laser machining device sets an X-Y coordinates having an original point and moves to being substantially above one of the optical detecting units. A laser beam is emitted at a plurality of microscopically-…
Who is the assignee on this patent?
Scienbizip Consulting Shenzhen Co Ltd, Scienbizip Consulting Shenzhen Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23K26/0853. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).