High-frequency module

Patent metadata

Field	Value
Publication number	US-9300019-B2
Application number	US-201314016422-A
Country	US
Kind code	B2
Filing date	Sep 3, 2013
Priority date	Mar 24, 2011
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

A multilayer substrate includes therein wiring conductors, ground conductors, interlayer connection conductors, and a matching inductor. A control signal input terminal is provided on a second main surface of the multilayer substrate. Electrodes on which a high-frequency switch is mounted are electrically connected to the wiring conductors through the interlayer connection conductors. The control signal wiring conductor is located on a dielectric layer close to the second main surface of the multilayer substrate, and the high-frequency signal wiring conductor is located on a dielectric layer close to a first main surface of the multilayer substrate. The ground conductor, which is superposed with the control signal wiring conductor in plan view is separated from the matching device conduction ground conductor by a separation portion. With this structure, influence of harmonic noise due to input of high-frequency switch control signals is reduced and degradation of the communication characteristics is reduced.

First claim

What is claimed is:

1. A high-frequency module comprising:
a multilayer substrate including a plurality of dielectric layers, wiring conductors located on the dielectric layers, and interlayer connection conductors extending through the dielectric layers in a thickness direction;
a high-frequency switch and an electronic component mounted on a first main surface of the multilayer substrate; and
a control signal input terminal that is located on a second main surface of the multilayer substrate and that receives a control signal for the high-frequency switch; wherein
a control signal wiring conductor connected to the control signal input terminal and located on of the dielectric layers adjacent to the second main surface of the multilayer substrate;
a high-frequency signal wiring conductor through which a high-frequency signal of the high-frequency switch flows is located on one of the dielectric layers adjacent to the first main surface of the multilayer substrate; and
the control signal for the high-frequency switch received by the high-frequency switch from the control signal input terminal includes a serial data signal and a clock signal.

2. The high-frequency module according to claim 1 , wherein an electronic component conduction ground conductor connected to a ground terminal of the electronic component is located on the one of the dielectric layers adjacent to the first main surface of the multilayer substrate.

3. The high-frequency module according to claim 2 , wherein a ground conductor adjacent to the control signal wiring conductor and the electronic component conduction ground conductor are electrically separated from each other within the multilayer substrate.

4. The high-frequency module according to claim 2 , wherein another ground conductor other than the electronic component conduction ground conductor is provided between the control signal wiring conductor and the electronic component conduction ground conductor.

5. The high-frequency module according to claim 1 , wherein an interlayer connection conductor electrically connecting the high-frequency switch to the control signal wiring conductor is located in a region of the high-frequency switch when the multilayer substrate is viewed in plan.

6. The high-frequency module according to claim 5 , wherein the interlayer connection conductor is located within a region of the high-frequency switch when the multilayer substrate is viewed in plan.

7. The high-frequency module according to claim 1 , further comprising a plurality of duplexers, a diplexer, a plurality of filters, a plurality of matching inductors mounted on the multilayer substrate.

8. The high-frequency module according to claim 1 , wherein the electronic component is a matching device connected between the high-frequency signal wiring conductor and ground.

9. The high-frequency module according to claim 8 , wherein the matching device includes an inductor device including an interlayer connection conductor and a wiring conductor within the multilayer substrate.

10. The high-frequency module according to claim 8 , wherein the matching device includes an inductor device mounted on the first main surface of the multilayer substrate.

11. The high-frequency module according to claim 1 , further comprising an interlayer connection conductor connected to the control signal input terminal of the high-frequency switch.

12. The high-frequency module according to claim 11 , wherein the interlayer connection conductor extends straight directly under a position where the high-frequency switch is mounted.

13. The high-frequency module according to claim 1 , further comprising an electronic component conduction ground conductor and a plurality of ground conductor layers located between the control signal wiring conductor and the electronic component conduction ground conductor.

14. The high-frequency module according to claim 13 , further comprising a matching device located within the multilayer substrate, wherein one of the ground conductor layers that is superposed with the control signal wiring conductor in plan view is separated from a matching device conduction ground conductor by a separation portion.

15. The high-frequency module according to claim 14 , wherein the control signal wiring conductor and the high-frequency signal wiring conductor are spaced apart from each other, and the control signal wiring conductor and the matching device conduction ground conductor are spaced apart from each other.

16. The high-frequency module according to claim 1 , further comprising a matching inductor located within the multilayer substrate including a plurality of wiring conductors extending in an in-plane direction of the dielectric layers and a plurality of interlayer connection conductors extending in an interlayer direction.

17. A high-frequency module comprising:
a multilayer substrate including a plurality of dielectric layers, wiring conductors located on the dielectric layers, and interlayer connection conductors extending through the dielectric layers in a thickness direction;
a high-frequency switch and an electronic component mounted on a first main surface of the multilayer substrate; and
a control signal input terminal that is located on a second main surface of the multilayer substrate and that receives a control signal for the high-frequency switch; wherein
a control signal wiring conductor connected to the control signal input terminal and located on of the dielectric layers adjacent to the second main surface of the multilayer substrate;
a high-frequency signal wiring conductor through which a high-frequency signal of the high-frequency switch flows is located on one of the dielectric layers adjacent to the first main surface of the multilayer substrate; and
the high-frequency switch includes an antenna port, a plurality of input/output ports, a power supply terminal, a ground terminal, a serial data input terminal, a clock signal input terminal, and a digital circuit portion power supply terminal.

18. The high-frequency module according to of claim 17 , wherein the control signal for the high-frequency switch received by the high-frequency switch from the control signal input terminal includes a serial data signal and a clock signal.

19. A high-frequency module comprising:
a multilayer substrate including a plurality of dielectric layers, wiring conductors located on the dielectric layers, and interlayer connection conductors extending through the dielectric layers in a thickness direction;
a high-frequency switch and an electronic component mounted on a first main surface of the multilayer substrate; and
a control signal input terminal that is located on a second main surface of the multilayer substrate and that receives a control signal for the high-frequency switch; wherein
a control signal wiring conductor connected to the control signal input terminal and located on of the dielectric layers adjacent to the second main surface of the multilayer substrate;
a high-frequency signal wiring conductor through which a high-frequency signal of the high-frequency switch flows is located on one of the dielectric layers adjacent to the first main surface of the multilayer substrate; and
a serial data input terminal and a clock signal input terminal define the control signal input terminal and are provided on a common one of the dielectric layers.

20. The high-frequency module according to claim 19 , further comprising a control signal wiring conductor connected to the clock signal input

Assignees

• Murata Manufacturing Co

Inventors

• Ono Atsushi

Classifications

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H04B15/00

  Suppression or limitation of noise or interference (by means associated with receiver H04B1/10) · CPC title

• H01P1/10 Primary

  for switching or interrupting {(in systems using reflection or reradiation of radio, acoustic or other waves G01S7/034)} · CPC title

• H01P1/2135

  using strip line filters (H01P1/2131 takes precedence) · CPC title

• H04B1/0057

  using diplexing or multiplexing filters for selecting the desired band · CPC title