Integrated CMOS back cavity acoustic transducer and the method of producing the same

Patent metadata

Field	Value
Publication number	US-9299671-B2
Application number	US-201314054495-A
Country	US
Kind code	B2
Filing date	Oct 15, 2013
Priority date	Oct 15, 2013
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

First claim

The invention claimed is:

1. A MEMS device comprising:
a MEMS substrate including a movable element;
a CMOS substrate having a cavity, the MEMS substrate disposed on top of the CMOS substrate, wherein the MEMS substrate includes a handle wafer and at least one stud bump protrudes beyond a top surface of the handle wafer;
a cap layer disposed to cover the cavity, the cap layer being physically attached to the CMOS substrate; and
a back cavity connected to the CMOS substrate, the back cavity formed at least partially by the cavity in the CMOS substrate,
wherein the movable element is acoustically coupled to the back cavity.

2. The MEMS device, as recited in claim 1 , wherein the MEMS substrate is electrically coupled to the CMOS substrate.

3. The MEMS device, as recited in claim 1 , wherein the cap layer is made of conductive material.

4. The MEMS device, as recited in claim 1 , wherein the cap layer is made of a non-conductive layer including conductive material.

5. The MEMS device, as recited in claim 1 , wherein the cap layer is connected to the CMOS substrate by a conductive material.

6. The MEMS device, as recited in claim 1 , wherein the CMOS substrate further comprises at least one bond pad and at least one stud bump, wherein the at least one stud bump is connected to the at least one bond pad.

7. The MEMS device, as recited in claim 1 , wherein the stud bump is made of gold.

8. The MEMS device, as recited in claim 1 , further including a silicone sealant disposed between the at least one stud bump and the MEMS substrate.

9. The MEMS device, as recited in claim 1 , wherein the CMOS substrate is electrically connected to the at least one stud bump.

10. The MEMS device, as recited in claim 1 , further including a carrier substrate bonded to at least one stud bump and further including solder metal disposed on top of the carrier substrate.

11. The MEMS device, as recited in claim 1 , wherein the cap layer is substantially flat.

12. The MEMS device, as recited in claim 1 , wherein the cap layer is indented.

13. The MEMS device, as recited in claim 6 , further including a carrier substrate bonded to the at least one stud bump wherein the carrier substrate is a laminate.

14. The MEMS device, as recited in claim 1 , further including an underfill disposed between the CMOS substrate and the carrier substrate.

15. The MEMS device, as recited in claim 14 , wherein the underfill acoustically seals the carrier substrate and the MEMS substrate.

16. The MEMS device, as recited in claim 1 , wherein the carrier substrate has an acoustic port.

17. The MEMS device, as recited in claim 1 , wherein the MEMS device is encapsulated in a radio frequency (RF) shielding.

18. The MEMS device, as recited in claim 17 , wherein the shielding is metal.

19. The MEMS device, as recited in claim 1 , wherein the MEMS device is a microphone or ultrasonic transducer.

20. The MEMS device, as recited in claim 1 , further including an inner acoustic seal ring enclosing the movable element.

21. A MEMS device comprising:
a MEMS substrate including a movable element;
a CMOS substrate having a port, the MEMS substrate disposed on top of the CMOS substrate, wherein the MEMS substrate includes a handle wafer and at least one stud bump protrudes beyond a top surface of the handle wafer;
a cap layer disposed to cover the cavity, the cap layer being physically attached to the CMOS substrate; and
a back cavity connected to the CMOS substrate, the back cavity formed at least partially by the port in the CMOS substrate,
wherein the movable element is acoustically coupled to the back cavity.

22. The MEMS device, as recited in claim 21 , wherein the MEMS substrate is electrically coupled to the CMOS substrate.

23. The MEMS device, as recited in claim 21 , further including a cap layer disposed to cover the port.

24. The MEMS device, as recited in claim 21 , wherein the CMOS substrate further comprises at least one bond pad and at least one stud bump, wherein the at least one stud bump is connected to the at least one bond pad.

25. The MEMS device, as recited in claim 21 , further including a silicone sealant disposed between the at least one stud bump and the MEMS substrate.

26. The MEMS device, as recited in claim 21 , wherein the CMOS substrate is electrically connected to the at least one stud bump.

27. The MEMS device, as recited in claim 21 , further including a carrier substrate bonded to the at least one stud bump and further including solder metal disposed on top of the carrier substrate.

Assignees

• Invensense Inc

Inventors

• Liu Fang
• Daneman Michael Julian
• Kim Brian
• Minervini Anthony

Classifications

• H10W72/90

  Bond pads, in general · CPC title

• B81C1/00238 Primary

  Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• B81C1/00309

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

• B81C2203/0792

  Forming interconnections between the electronic processing unit and the micromechanical structure · CPC title