Camera module

US9297978B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9297978-B2
Application numberUS-201313953338-A
CountryUS
Kind codeB2
Filing dateJul 29, 2013
Priority dateJul 30, 2012
Publication dateMar 29, 2016
Grant dateMar 29, 2016

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A first exemplary embodiment of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a holder member mounted on the PCB, a lens module directly mounted inside the holder member, an actuator arranged at an inside of the holder member, and an electronic circuit pattern formed on a surface of the holder member to conductibly connect the PCB and the actuator, where one end of the electronic circuit pattern is connected to the PCB, and the other end of the electronic circuit pattern is connected to the actuator.

First claim

Opening claim text (preview).

What is claimed is: 1. A camera module, the camera module comprising: a PCB (Printed Circuit Board) mounted with an image sensor; an actuator holder mounted at an upper surface of the PCB and formed at an upper surface with a through hole; a lens module directly mounted inside the actuator holder member; an actuator arranged inside the actuator holder; and an electronic circuit pattern formed on a surface of the actuator holder to conductibly connect the PCB and the actuator, where one end of the electronic circuit pattern is connected to the PCB, and the other end of the electronic circuit pattern is connected to the actuator. 2. The camera module of claim 1 , wherein an upper surface of the actuator holder is formed to wrap the actuator, and the through hole is arranged at a position corresponding to a terminal unit of the actuator. 3. The camera module of claim 1 , wherein at least two through holes are provided. 4. The camera module of claim 1 , wherein the electronic circuit pattern is formed at a lateral surface and an upper surface of the actuator and at an inner circumferential surface of the through hole. 5. The camera module of claim 1 , wherein the actuator is connected to the electronic circuit pattern at a surface facing the through hole. 6. The camera module of claim 1 , wherein an outermost lens is arranged at an upper surface of the actuator. 7. The camera module of claim 6 , wherein a diameter of the outermost lens is formed smaller than that of the actuator or other lenses. 8. The camera module of claim 1 , wherein the actuator includes any one of a MEMS (Micro Electric Mechanical System) actuator moved by using an electrostatic force and a piezoelectric force, a liquid crystal lens, a piezoelectric polymer lens, a non-MEMS actuator, a silicon type actuator, and a liquid lens, or a combination of at least two such actuators. 9. The camera module of claim 6 , wherein the actuator includes any one of a MEMS (Micro Electric Mechanical System) actuator moved by using an electrostatic force and a piezoelectric force, a liquid crystal lens, a piezoelectric polymer lens, a non-MEMS actuator, a silicon type actuator, and a liquid lens, or a combination of at least two such actuators. 10. The camera module of claim 1 , wherein the actuator performs an auto focusing function or a handshake compensation function through changes in thickness or shape of a fixed lens or changes in refractive indexes of incident light. 11. The camera module of claim 6 , wherein the actuator performs an auto focusing function or a handshake compensation function through changes in thickness or shape of a fixed lens or changes in refractive indexes of incident light. 12. The camera module of claim 1 , wherein the electronic circuit pattern and the actuator are connected using a soldering, an Ag epoxy, a conductive epoxy or a wire bonding. 13. The camera module of claim 6 , wherein the electronic circuit pattern and the actuator are connected using a soldering, an Ag epoxy, a conductive epoxy or a wire bonding.

Assignees

Inventors

Classifications

  • Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

  • G03B3/10Primary

    Power-operated focusing · CPC title

  • Focus control based on electronic image sensor signals · CPC title

  • Housings · CPC title

  • H04N23/54Primary

    Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

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Frequently asked questions

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What does patent US9297978B2 cover?
A first exemplary embodiment of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a holder member mounted on the PCB, a lens module directly mounted inside the holder member, an actuator arranged at an inside of the holder member, and an electronic circuit pattern formed on a surface of the holder member to conductibly connect the PCB and the actuator, …
Who is the assignee on this patent?
Lg Innotek Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03B3/10. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).