Pressure sensor device with through silicon via

Patent metadata

Field	Value
Publication number	US-9297713-B2
Application number	US-201414220121-A
Country	US
Kind code	B2
Filing date	Mar 19, 2014
Priority date	Mar 19, 2014
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need to used bonds to electrically connect the pressure-sensing die to the MCU, thereby saving time, reducing size, and reducing cost.

First claim

The invention claimed is:

1. A semiconductor sensor device, comprising:
a lead frame having a die flag and leads spaced from and located on at least one side of the die flag;
a microcontrol unit (MCU) attached to the die flag and electrically connected to the leads;
a pressure-sensing die, mounted on a top surface of the MCU, and having an active region on a top surface thereof that is facing away from the MCU, and at least one through silicon via (TSV) extending from the active region to an opposite bottom surface, and electrically connected to bond pads on the top surface of the MCU without using any bond wires; and
conductive bumps or pillars located between the bottom surface of the pressure-sensing die and the top surface of the MCU, and electrically connecting the active region of the pressure-sensing die to the bond pads on the top surface of the MCU via the at least one TSV.

2. The semiconductor sensor device of claim 1 , wherein the pressure-sensing die is at least partially covered with a pressure-sensitive gel.

3. The semiconductor sensor device of claim 2 , wherein the MCU die and its electrical connections to the leads are covered with a molding compound and a cavity is formed in the mold compound over the MCU, wherein the pressure-sensing die and the pressure-sensitive gel are located within the cavity.

4. The semiconductor sensor device of claim 3 , further comprising a lid covering the cavity, wherein the lid has a hole therein.

5. The semiconductor sensor device of claim 1 , further comprising a G-cell attached to the die flag and electrically connected to the MCU.

6. A method for assembling a semiconductor sensor device, the method comprising:
attaching a microcontrol unit (MCU) to a flag of a lead frame;
electrically connecting the MCU to leads of the lead frame; and
mounting a pressure-sensing die on a top surface of the MCU, wherein the pressure-sensing die has an active region on a top surface thereof that faces away from the MCU, and wherein the pressure-sensing die comprises at least one through silicon via (TSV) extending from the active region to an opposite bottom surface of the pressure-sensing die; and
electrically connecting the at least one TSV at the bottom surface of the pressure sensing die to bond pads on the top surface of the MCU using conductive bumps or pillars located between the bottom surface of the pressure sensing die and the top surface of the MCU, wherein the at least one TSV forms an electrical connection between the active region of the pressure-sensing die and the bond pads on the top surface of the MCU.

7. The method of claim 6 , further comprising:
applying molding compound over the MCU and the lead frame and forming a cavity in the molding compound, wherein the pressure-sensing die is placed on the MCU within the cavity; and
at least partially filling the cavity with pressure-sensitive gel to cover an active region of the pressure-sensing die.

8. The method of claim 7 , further comprising placing a lid comprising a hole over the gel filled cavity.

9. The method of claim 6 , further comprising attaching a G-cell to the lead frame flag and electrically connecting the G-cell to the MCU.

10. A semiconductor sensor device manufactured in accordance with the method of claim 6 .

Assignees

• Lo Wai Yew
• Tan Lan Chu
• Freescale Semiconductor Inc

Inventors

• Lo Wai Yew
• Tan Lan Chu

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/522

  Multilayered bond wires, e.g. having a coating concentric around a core · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title