Methods for forming vias in glass substrates

Patent metadata

Field	Value
Publication number	US-9296646-B2
Application number	US-201414464851-A
Country	US
Kind code	B2
Filing date	Aug 21, 2014
Priority date	Aug 29, 2013
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

First claim

What is claimed is:

1. A method of forming a via in a glass substrate, the method comprising:
laser drilling the via through at least a portion of a thickness of the glass substrate, wherein the via is laser drilled through the glass substrate from an incident surface of the glass substrate;
etching the glass substrate for an etching duration, thereby increasing a diameter of an incident opening of the via; and
applying ultrasonic energy to the glass substrate during at least a portion of the etching duration, wherein the ultrasonic energy has a frequency between 40 kHz and 192 kHz, and wherein the ultrasonic energy has a first frequency and a second frequency or the ultrasonic energy is centered about a primary frequency and dithered or swept above and below the primary frequency.

2. The method of claim 1 , wherein the via is a through via, wherein the through via is drilled from the incident surface to an exit surface of the glass substrate, the through via extending between the incident opening of the incident surface of the glass substrate and an exit opening of the exit surface of the glass substrate.

3. The method of claim 1 , wherein the via is a blind via, wherein the blind via is drilled from the incident surface to a depth of the glass substrate, the blind via extending through the glass substrate from the incident opening of the incident surface to the depth of the glass substrate.

4. The method of claim 1 , wherein the frequency is between 80 kHz and 132 kHz.

5. The method of claim 1 , wherein the first frequency of ultrasonic energy is delivered by a first ultrasonic transducer, the second frequency of the ultrasonic energy is delivered by a second ultrasonic transducer, and the first ultrasonic transducer and the second ultrasonic transducer produce the first frequency and the second frequency simultaneously.

6. The method of claim 1 , wherein the first frequency is 80 kHz and the second frequency is 120 kHz.

7. The method of claim 1 , further comprising mechanically agitating the glass substrate during the etching duration.

8. A method of forming a through via in a glass substrate, the method comprising:
laser drilling the through via through a thickness of the glass substrate, wherein the through via is drilled from an incident surface to an exit surface of the glass substrate, the through via extending between an incident opening of the incident surface of the glass substrate and an exit opening of the exit surface of the glass substrate;
applying an acid-resistant film to the incident surface of the glass substrate, wherein the acid-resistant film covers the incident opening of the through via;
etching the glass substrate for a first etching duration, thereby increasing a diameter of the exit opening of the through via;
removing the acid-resistant film from the incident opening of the through via;
etching the glass substrate for a second etching duration, thereby increasing the diameter of the incident opening and the exit opening of the through via; and
applying ultrasonic energy to the glass substrate during at least one of the first etching duration and the second etching duration, wherein the ultrasonic energy has a first frequency and a second frequency.

9. The method of claim 8 , wherein the ultrasonic energy has a frequency between 40 kHz and 192 kHz.

10. The method of claim 8 , wherein the first frequency is 40 kHz and the second frequency is 80 kHz or the first frequency is 80 kHz and the second frequency is 120 kHz.

11. The method of claim 8 , further comprising mechanically agitating the glass substrate during at least one of the first etching duration and the second etching duration.

12. The method of claim 8 , wherein the glass substrate is etched during the first etching duration, during the second etching duration, or during both the first etching duration and the second etching duration with an etching solution including a primary acid and a secondary acid.

13. The method of claim 12 , wherein the primary acid is hydrofluoric acid and the secondary acid is nitric acid, hydrochloric acid, or sulfuric acid.

14. The method of claim 8 , wherein the acid-resistant film is applied to the glass substrate by lamination.

15. The method of claim 8 , wherein an incident diameter of the incident opening is substantially equal to an exit diameter of the exit opening after the glass substrate is etched for the first etching duration.

16. The method of claim 8 , wherein an incident diameter of the incident opening and an exit diameter of the exit opening are equal to a desired diameter after the second etching duration.

17. A method of forming a through via in a glass substrate, the method comprising:
laser drilling the through via through a thickness of the glass substrate, wherein the through via is drilled from an incident surface to an exit surface of the glass substrate, the through via extending between an incident opening of the incident surface of the glass substrate and an exit opening of the exit surface of the glass substrate;
applying an acid-resistant film to the incident surface of the glass substrate, wherein the acid-resistant film covers the incident opening of the through via;
etching the glass substrate for a first etching duration, thereby increasing a diameter of the exit opening of the through via;
applying ultrasonic energy to the glass substrate during at least a portion of the first etching duration;
removing the acid-resistant film from the incident opening of the through via;
etching the glass substrate for a second etching duration, thereby increasing the diameter of the incident opening and the exit opening of the through via; and
applying ultrasonic energy to the glass substrate during at least a portion of the second etching duration, wherein the ultrasonic energy applied during the second etching duration has a first frequency and a second frequency.

Assignees

• Corning Inc

Inventors

• Burket Robert Carl
• Goers Uta-Barbara
• Owusu Samuel Odei
• Petriwsky Tammy Lynn

Classifications

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K2203/0285

  Using ultrasound, e.g. for cleaning, soldering or wet treatment · CPC title

• C03C15/00 Primary

  Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title

• H05K3/0017

  Etching of the substrate by chemical or physical means · CPC title

• B23K26/383

  Operations & Transport · mapped topic