Metal foil for base material

US9296180B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9296180-B2
Application numberUS-201113885278-A
CountryUS
Kind codeB2
Filing dateNov 16, 2011
Priority dateNov 17, 2010
Publication dateMar 29, 2016
Grant dateMar 29, 2016

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  1. Title

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Abstract

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A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al 7 Cu 2 Fe intermetallic compound or FeAl 3 based intermetallic compounds.

First claim

Opening claim text (preview).

The invention claimed is: 1. A metal foil for a base material of a solar cell and an organic electroluminescence, the metal foil comprising: a carbon steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the carbon steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, a distance between (1) a maximum point of a cutting-plane line of a surface of the Al-containing metal layer appearing on a cross-section of the metal foil that is cut perpendicular to a rolling direction, wherein the cutting-plane line is a contour curve and the maximum point is an extremal point that is convex toward the surface of the Al-containing metal layer, and (2) an approximation straight line of the cutting-plane line, is not more than 10 μm, wherein a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al 7 Cu 2 Fe intermetallic compound or FeAl 3 based intermetallic compounds, and wherein a Vickers hardness of the alloy layer is 500 Hv to 600 Hv. 2. The metal foil according to claim 1 , further comprising a Cu layer whose thickness is 2 to 10 μm or a Ni layer whose thickness is 2 to 10 μm between the carbon steel layer and the alloy layer. 3. The metal foil according to claim 1 , wherein a thickness of the Al-containing metal layer is 0.1 to 30 μm. 4. The metal foil according to claim 1 , further comprising an AlN layer whose thickness is 0.01 to 0.08 μm or an Al 2 O 3 layer whose thickness is 0.01 to 50 μm on the Al-containing metal layer. 5. The metal foil according to claim 1 , further comprising a Cr layer whose thickness is 0.1 to 8 μm or a Ni layer whose thickness is 0.1 to 8 μm on the Al-containing metal layer. 6. The metal foil according to claim 1 , further comprising at least a film selected from a sol-gel layer and a lamination layer on the Al-containing metal layer. 7. The metal foil according to claim 1 , wherein a glossiness of the surface of the Al-containing metal layer is 75% or more as compared with a silver mirror. 8. The metal foil according to claim 1 , wherein a Cu is solid-soluted in the FeAl 3 based intermetallic compounds.

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What does patent US9296180B2 cover?
A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a c…
Who is the assignee on this patent?
Terashima Shinichi, Kobayashi Takayuki, Tanaka Masamoto, and 7 more
What technology area does this patent fall under?
Primary CPC classification B32B15/012. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).