Optoelectronic component

Patent metadata

Field	Value
Publication number	US-9294197-B2
Application number	US-201113822391-A
Country	US
Kind code	B2
Filing date	Sep 12, 2011
Priority date	Sep 12, 2010
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

This invention relates to an optoelectronic component which has the following: an optical component which emits optical signals to an input/output end face of a light guide and/or receives optical signals and converts them into electronic signals, a component carrier located on the optical component, and a housing part which surrounds the optical component and which has coupling means which form optical coupling means and mechanical coupling means (alignment means), the optical coupling means routing the optical signals coming from the optical component to the input end face of the light guide and/or routing the optical beams emerging from the input/output end face of the light guide to the optical component, the mechanical alignment means aligning the light guide with respect to the optical component for efficient signal transmission.

First claim

The invention claimed is:

1. An optoelectronic transceiver which has the following:
a) an optical transmitter,
b) an optical receiver,
c) coupling means consisting of a first and second optical lens made with optically active interfaces for changing/deflecting optical paths of on the one hand optical output signals A of the optical transmitter to a connectable optical light guide and on the other hand of input signals E of the same light guide to the receiver, characterized in that the first lens has a concave reflection surface which lies inside in the coupling means for signals of the optical transmitter and the second lens has a convex transmission surface which lies outside for outgoing signals of the optical transmitter and a concave reflection surface which lies inside for incoming signals.

2. The transceiver as claimed in claim 1 , wherein the material which forms the coupling means defines or fixes the position of the lenses to one another.

3. The transceiver as claimed in claim 1 , wherein the material has an index of refraction of >1.3 and the inner surface of the second lens is made with a radius of curvature such that the condition of total reflection is satisfied with reference to the optical paths of optical signals which are incident on the interface from the light guide.

4. The transceiver as claimed in claim 1 , wherein the material which has an index of refraction of >1.3 [sic], and the inner surface of the first lens is made with a radius of curvature such that the condition of total reflection is satisfied with respect to optical paths of optical signals which are incident on the interface from the transmitter.

5. An optoelectronic transceiver which has the following:
a) an electrical-optical transmitter which emits optical signals to an input/output end face of a light guide and/or
b) an optical-electrical receiver which receives optical signals and converts them into electronic signals,
c) a component carrier on which the transmitter and/or receiver is/are located, and one housing part which surrounds the transmitter and/or receiver and which has coupling means which form optical coupling means and mechanical coupling means, the optical coupling means routing or coupling the optical signals coming from the electrical-optical transmitter to the input end face of the light guide and/or routing or coupling the optical beams emerging from the input/output end face of the light guide to the optical-electrical receiver, the mechanical alignment means aligning the light guide with respect to the electrical-optical transmitter and/or the optical electrical receiver for efficient signal transmission, the optical coupling means forming a first reflection interface for the optical signals coming from the transmitter, a second reflection interface for the optical signals emerging from the light guide and furthermore a first and second transmitter surface for the optical signals coming from the transmitter.

6. The optoelectronic transceiver as claimed in claim 5 , characterized in that the housing part is formed preferably by an overmold injection method and is connected to the component carrier or its material by the injection method.

7. The optoelectronic transceiver as claimed in claim 5 , wherein the housing part forms a mechanical alignment means which aligns one light guide and thus the input/output surface of the light guide with the optical signals which have been reflected from the reflection interfaces.

8. The optoelectronic transceiver as claimed in claim 5 , that the plastic material, especially the overmold material is transparent and has an index of refraction n>1.3, preferably n=1.5.

9. The optoelectronic transceiver as claimed in claim 5 , that the mechanical coupling means is made in the form of alignment means for the light guide in the housing part, preferably the alignment means being made in the form of a V-groove which preferably has side surfaces which run obliquely to one another.

10. The optoelectronic transceiver as claimed in claim 6 , wherein the plastic material forms a reflection interface on the transition between the plastic material and air above the optical transmitter such that the light emerging from the optical transmitter is reflected by the first and second transmission surface onto the input end face of the light guide, and specifically is preferably collimated.

11. The optoelectronic transceiver as claimed in claim 6 , wherein the housing part consists made [sic] of highly transparent plastic, and when the first housing part is formed with a material of a second housing part, it assumes a mechanical connection, the second housing part being a carrier for an optical element and optionally other components or electrical circuits.

12. The optoelectronic transceiver as claimed in claim 6 , wherein the component carrier is a punched component carrier, preferably a lead frame.

13. The optoelectronic transceiver as claimed in claim 6 , wherein the overmold plastic material which forms the housing part, two reflectors or reflection mirrors which each form one reflection surface for the light which can be transmitted between the optical elements positioned on the component carrier and the entry end face of one light guide (and optionally vice versa) [sic], preferably the reflection mirrors which form the reflection surfaces being an internal conical total reflection mirror, the plastic on its interface to the ambient air forming the reflection mirror as a result of the transition from the plastic material with a higher index of refraction to the air with an index of refraction of 1.

Assignees

• Giziewicz Wojciech Piotr
• Hall Thomas Albert
• Amphenol Corp

Inventors

• Giziewicz Wojciech Piotr
• Hall Thomas Albert

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H01L2224/48091

  Electricity · mapped topic