Duplexer with balun

Patent metadata

Field	Value
Publication number	US-9294070-B2
Application number	US-201113817809-A
Country	US
Kind code	B2
Filing date	Jul 29, 2011
Priority date	Aug 20, 2010
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A duplexer is proposed with a substrate which has at least one patterned metallization plane and on which, at least to some extent, a transmission path (TX) and a reception path (RX) are arranged, both of which are connected to an antenna connection (ANT). The duplexer comprises a transmission filter (TXF) which is arranged in the transmission path (TX) and which has a first acoustic wave filter (BAW 1 ) with one or more resonators. Furthermore, the duplexer (DPL) comprises a reception filter (RXF) which is arranged in the reception path (RX) on the antenna side and which has a second acoustic wave filter (BAW 2 ) with one or more resonators and also a single-ended output. In addition, the duplexer comprises, in the reception path (RX), a balun (BL) which is connected downstream of the reception filter (RXF) and the output of which delivers a balanced signal and which is in the form of an LC circuit, wherein at least one inductance and/or at least one capacitance of the balun (BL) are implemented in the patterned metallization plane of the substrate.

First claim

The invention claimed is:

1. A duplexer, comprising a substrate, which has at least one patterned metallization plane, and, arranged at least partly on the substrate, a transmission path and a reception path, which are both connected to an antenna connection, comprising:
a transmission filter, which is arranged in the transmission path and which has a first acoustic wave filter having one or more resonators;
a reception filter, which is arranged in the reception path and next to the antenna, and which has a second acoustic wave filter having one or more resonators and has a single-ended output; and
in the reception path a balun connected downstream of the reception filter, the balun supplying a balanced signal on the output side and being embodied as an LC circuit, wherein at least one inductance or at least one capacitance of the balun is realized in the patterned metallization plane of the substrate,
wherein the substrate is constructed from a multilayer ceramic,
wherein the first acoustic wave filter or the second acoustic wave filter has at least one resonator that operates with bulk acoustic waves,
wherein the balun has:
a first balanced connection,
a second balanced connection,
an unbalanced connection,
a first inductance and a second capacitance, wherein the first inductance is electrically coupled to the first balanced connection and a reference potential and the second capacitance is electrically coupled to the second balanced connection and the reference potential,
a second inductance and a first capacitance, wherein the second inductance is electrically coupled to the second balanced connection and the unbalanced connection and the first capacitance is electrically coupled to the first balanced connection and the unbalanced connection,
a T-element comprising a series branch and a parallel branch, and having a third capacitance and a fourth capacitance in the series branch and a third inductance in the parallel branch, wherein the third capacitance is electrically coupled in the first balanced connection and the fourth capacitance is electrically coupled to the unbalanced connection,
a fifth capacitance, which is electrically coupled to the second balanced connection and the reference potential, and
a fourth inductance, which is electrically coupled to the second balanced connection and the unbalanced connection,

wherein the transmission filter has a first matching network,
wherein the reception filter has a second matching network,
wherein the balun, the first matching network, the second matching network, and an antenna matching network are integrated into the substrate constructed from the multilayer ceramic, and
wherein the substrate has at least one soldering pad and the soldering pad is at least partly utilized as the third capacitance.

2. The duplexer according to claim 1 , wherein the substrate has
an upper metallization plane, in which an at least large-area first reference potential area is arranged, and a lower metallization plane, in which at least a large-area second reference potential area is arranged, wherein the first reference potential area and second reference potential area are in each case electrically coupled to a reference potential; and
the at least one patterned metallization plane, in which capacitances or inductances of the balun or of further circuit components are realized, is arranged between the upper metallization plane and lower metallization plane.

3. The duplexer according to claim 2 , wherein the substrate has an integrated first branch junction, which represents the first balanced connection of the balun, and an integrated second branch junction, which represents the second balanced connection, wherein the first branch junction and second branch junction are arranged between the upper metallization plane and lower metallization plane.

4. The duplexer according to claim 3 , wherein the substrate has a total substrate thickness and the first branch junction and the second branch junction are arranged at the same level or are arranged in such a way that a level difference in a vertical direction perpendicular to the lower metallization plane or upper metallization plane between the first branch junction and the second branch junction is less than 0.2 times the total substrate thickness.

5. The duplexer according to claim 2 , wherein a first parallel branch comprises the first capacitance and the first inductance and a second parallel branch comprises the second capacitance and the second inductance or the first parallel branch comprises the fourth capacitance and the third inductance and the second parallel branch comprises the fifth capacitance and the fourth inductance,
wherein the first parallel branch is electrically coupled to the first reference potential area but not to the second reference potential area, and
wherein the second parallel branch is electrically coupled at least to the first reference potential area.

6. The duplexer according to claim 2 , wherein a metal area which is electrically coupled to the reference potential is arranged between the first capacitance and a third branch junction, which represents the unbalanced connection or a metal area which is electrically coupled to the reference potential is arranged between the fourth capacitance and the third branch junction.

7. The duplexer according to claim 1 , wherein the first acoustic wave filter and the second acoustic wave filter are arranged on separate chips.

8. The duplexer according to claim 1 , wherein the substrate is part of a housing for the duplexer or of a module comprising the duplexer.

Assignees

• Kiwitt Jürgen
• Epcos Ag

Inventors

• Kiwitt Jürgen

Classifications

• H03H9/0576

  including surface acoustic wave [SAW] devices · CPC title

• H03H7/42 Primary

  Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns · CPC title

• H03H9/0557

  the other elements being buried in the substrate · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title

• H03H9/706

  Duplexers · CPC title