Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate

Patent metadata

Field	Value
Publication number	US-9293683-B2
Application number	US-201514707101-A
Country	US
Kind code	B2
Filing date	May 8, 2015
Priority date	May 12, 2014
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

First claim

What is claimed is:

1. A method for connecting a piezoelectric element and a cable substrate, the method comprising:
softening a resin film by pressing and heating the resin film between a plurality of element electrodes located at the piezoelectric element and a plurality of substrate electrodes located on the cable substrate with the resin film and solder being sandwiched between the plurality of element electrodes and the plurality of substrate electrodes, each of the plurality of substrate electrodes having a shape of a line;
curing the resin film by further heating the resin film that has been softened;
melting the solder, and pushing out along the line a portion of the solder located at an opposing position by the pressing, the opposing position being a position where the plurality of element electrodes and the plurality of substrate electrodes are opposed to each other; and
solidifying the solder between the plurality of substrate electrodes and the plurality of element electrodes.

2. The method according to claim 1 ,
wherein the piezoelectric element has a cut-out portion that is in contact with the plurality of element electrodes and defines a gap between the piezoelectric element and the cable substrate, the gap being greater than a distance between the plurality of substrate electrodes and the plurality of element electrodes, and
the portion of the solder that has been pushed out along the line is solidified in the cut-out portion.

3. The method according to claim 2 ,
wherein the plurality of substrate electrodes extend from the opposing position to a position where the plurality of substrate electrodes are opposed to the cut-out portion.

4. The method according to claim 2 ,
wherein the resin film extends from the opposing position to a position where the resin film is opposed to the cut-out portion.

5. The method according to claim 1 ,
wherein the piezoelectric element includes a plurality of piezoelectric bodies that are adjacent to each other via grooves, and
the plurality of element electrodes are located respectively in the plurality of piezoelectric bodies.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Irie Kazunobu
• Ohtsuka Futoshi
• Kita Takeshi
• Hatanaka Motoi

Classifications

• H01L41/0475 Primary

  Electricity · mapped topic

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K31/02

  relating to soldering or welding · CPC title

• H01L41/053

  Electricity · mapped topic

• B41J2/14274

  of stacked structure type, deformed by compression/extension and disposed on a diaphragm · CPC title