Solar cell pad dressing

Patent metadata

Field	Value
Publication number	US-9293636-B2
Application number	US-201313953538-A
Country	US
Kind code	B2
Filing date	Jul 29, 2013
Priority date	Aug 1, 2012
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

First claim

What is claimed is:

1. A method of removing excess solder from an area on a surface of a substrate, using a machine comprising an X-Y translation stage, the method comprising:
identifying a first area from which excess solder needs to be removed;
pre-heating the substrate to a first temperature;
pre-heating the first area and the excess solder on the first area, but not the entire substrate, to a second temperature that is greater than the first temperature;
heating a vacuum nozzle having a tip to a third temperature that is greater than the first temperature and the second temperature and is equal to or greater than a melting temperature of the solder;
applying a vacuum to the vacuum nozzle;
positioning the tip of the vacuum nozzle at substantially the surface of the substrate; and
scanning the first area on the substrate to remove the excess solder.

2. The method of claim 1 , wherein the first area is predetermined.

3. The method of claim 2 , wherein the first area is predetermined by an operator of a machine configured to implement the method.

4. The method of claim 2 , wherein the first area is predetermined by a machine configured to implement the method.

5. The method of claim 4 , wherein the first area is predetermined by a machine configured to implement the method by analyzing an image of the substrate.

6. The method of claim 1 , wherein scanning the first area comprises the machine translating the vacuum nozzle at least in the X-Y plane.

7. The method of claim 1 , wherein pre-heating the first area precludes heating the entire substrate.

8. The method of claim 1 , further comprising, prior to pre-heating the substrate:
positioning a solar cell housing in a recessed area of a mount, wherein the solar cell housing includes a module mounted within the housing such that an opening is formed at a top of the solar cell housing when the module is within the housing, wherein the module includes a substrate and a component soldered to the substrate.

9. The method of claim 8 , further comprising, after positioning a solar cell
housing and prior to pre-heating the substrate:
lowering a vacuum cover down onto the solar cell die housing, thereby forming a sealed chamber from the solar cell housing, the vacuum cover and the substrate, and wherein when the vacuum cover is lowered down onto the solar cell die housing within the module mounted therein, a bottom surface of the vacuum cover that interfaces with the solar cell housing extends beyond the perimeter of the opening.

10. The method of claim 9 , further comprising, after lowering a vacuum cover and prior to pre-heating the substrate:
extending the heat source from within the mount towards the module without extending the mount; and
transmitting heat from the heat source.

11. A method of removing excess solder from an area on a surface of a substrate,
using a machine comprising an X-Y translation stage, the method comprising:
identifying a first area on the substrate from which excess solder needs to be removed;
pre-heating the substrate to a first temperature;
pre-heating the first area but not the entire substrate to a second temperature that is greater than the first temperature such that the temperature differential between the first area and a location of the excess solder is smaller than the temperature differential between area outside the first area on the substrate and the location of excess solder;
heating a vacuum nozzle having a tip to a third temperature that is greater than the first temperature and the second temperature and is equal to or greater than a melting temperature of the solder;
applying a vacuum to the vacuum nozzle;
positioning the tip of the vacuum nozzle at substantially the surface of the substrate; and
scanning the first area on the substrate to remove the excess solder.

12. The method of claim 11 , wherein the location of excess solder is in the first area.

Assignees

• Flextronics Ap Llc

Inventors

• Cheung Dason
• Kurwa Murad
• Loi Richard
• Krog Tor

Classifications

• H10F71/00 Primary

  Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title

• B23K1/018

  Unsoldering; Removal of melted solder or other residues · CPC title

• B23K1/203

  Fluxing, i.e. applying flux onto surfaces · CPC title

• H01L31/186 Primary

  Electricity · mapped topic

• H01L2924/0001

  Electricity · mapped topic