Methods of manufacturing large-area sputtering targets using interlocking joints

Patent metadata

Field	Value
Publication number	US-9293306-B2
Application number	US-201514793931-A
Country	US
Kind code	B2
Filing date	Jul 8, 2015
Priority date	Sep 29, 2011
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.

First claim

What is claimed is:

1. A joined sputtering target comprising:
two sputtering-target tiles (A) each comprising a sputtering material, and (B) at least partially joined together via a mechanical joint at an interface therebetween, the mechanical joint comprising portions of the sputtering-target tiles either (i) overlapping each other or (ii) overlapping and interlocking each other at the interface; and
a region of metal powder disposed over the interface and in contact with the two sputtering-target tiles.

2. The joined sputtering target of claim 1 , wherein the sputtering material comprises a mixture or alloy of at least two constituent materials.

3. The joined sputtering target of claim 2 , wherein the at least two constituent materials comprise Mo and Ti.

4. The joined sputtering target of claim 2 , wherein the metal powder comprises at least one of the constituent materials.

5. The joined sputtering target of claim 1 , wherein the metal powder comprises the sputtering material.

6. The joined sputtering target of claim 1 , wherein the metal powder consists essentially of the sputtering material.

7. The joined sputtering target of claim 1 , wherein the two sputtering-target tiles each consists essentially of the sputtering material.

8. The joined sputtering target of claim 7 , wherein the metal powder consists essentially of the sputtering material.

9. The joined sputtering target of claim 1 , wherein the mechanical joint comprises an interlocking joint, the interlocking joint comprising a tongue-in-groove joint, a dovetail joint, a rabbet joint, a finger joint, or a spline joint.

10. The joined sputtering target of claim 1 , wherein at least a portion of each of the two sputtering-target tiles is substantially planar.

11. The joined sputtering target of claim 1 , wherein at least a portion of each of the two sputtering-target tiles is substantially tubular.

12. The joined sputtering target of claim 1 , wherein at least a portion of the metal powder is disposed within a recess defined by at least one of the sputtering-target tiles.

13. The joined sputtering target of claim 12 , wherein the recess is defined by a beveled surface of at least one of the two sputtering-target tiles.

14. The joined sputtering target of claim 13 , wherein the beveled surface is reentrant.

15. The joined sputtering target of claim 13 , wherein at least a portion of the beveled surface is substantially planar and forms an angle of greater than 45° with respect to a normal to a top surface of the joined sputtering target.

16. The joined sputtering target of claim 15 , wherein the angle is selected from the range of 45° to 60°.

17. The joined sputtering target of claim 1 , wherein the metal powder is substantially unmelted.

18. The joined sputtering target of claim 1 , further comprising a backing plate on which the two sputtering-target tiles are disposed.

19. The joined sputtering target of claim 1 , wherein the mechanical joint comprises portions of the sputtering-target tiles overlapping each other at the interface.

20. The joined sputtering target of claim 1 , wherein the mechanical joint comprises portions of the sputtering-target tiles overlapping and interlocking each other at the interface.

21. The joined sputtering target of claim 1 , wherein the two sputtering-target tiles are welded together at the interface.

22. The joined sputtering target of claim 1 , wherein the sputtering material comprises at least one of molybdenum, titanium, copper, tungsten, niobium, or tantalum.

Assignees

• Volchko Scott Jeffrey
• Loewenthal William
• Zimmermann Stefan
• Gaydos Mark
• Miller Steven Alfred
• Starck H C Inc

Inventors

• Volchko Scott Jeffrey
• Loewenthal William
• Zimmermann Stefan
• Gaydos Mark
• Miller Steven Alfred

Classifications

• H01J37/3417

  Arrangements · CPC title

• H01J37/3429 Primary

  Plural materials · CPC title

• H01J2237/081

  Sputtering sources · CPC title

• H01J2237/332

  Coating · CPC title

• C23C24/04

  Impact or kinetic deposition of particles · CPC title