Display device with touch panel

Patent metadata

Field	Value
Publication number	US-9292147-B2
Application number	US-201514591440-A
Country	US
Kind code	B2
Filing date	Jan 7, 2015
Priority date	Apr 22, 2008
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A manufacturing method of a touch panel includes the steps of providing a substrate, forming a first conductive film on the substrate, forming a first mask on the first conductive film, etching the first conductive film to form electrode portions and lower intersect portions of the touch panel, forming an insulating film made of a negative resist on the first conductive film, and forming a contact hole above the electrode portion by removing the insulating film. The steps further include forming a second conductive film on the insulating film, forming a second mask on the second conductive film, etching the second conductive film to form an upper intersect portion connected between two adjacent electrode portions via the contact hole and intersecting with the lower intersect portion, and forming protective film on the second conductive film.

First claim

What is claimed is:

1. A manufacturing method of a touch panel comprising the steps of:
providing a substrate;
forming a first conductive film on the substrate;
forming a first mask on the first conductive film;
etching the first conductive film to form a plurality of electrode portions and a plurality of lower intersect portions of the touch panel;
removing the first mask;
forming an insulating film made of a negative resist on the first conductive film;
forming a contact hole above one of the plurality of electrode portions by removing the insulating film;
forming a second conductive film on the insulating film;
forming a second mask on the second conductive film;
etching the second conductive film to form an upper intersect portion connected between two adjacent electrode portions of the plurality of electrode portions via the contact hole and intersecting with one of the plurality of lower intersect portions;
removing the second mask; and
forming a protective film from a negative resist on the second conductive film over the insulating film.

2. The manufacturing method of the touch panel according to claim 1 , wherein the first conductive film is made of a transparent conductive material.

3. The manufacturing method of the touch panel according to claim 1 , wherein the first mask is made of a positive resist.

4. The manufacturing method of the touch panel according to claim 1 , wherein the second mask is made of a positive resist.

5. The manufacturing method of the touch panel according to claim 1 , wherein the protective film is provided in the contact hole.

6. A manufacturing method of a touch panel comprising the steps of:
providing a substrate;
forming a first conductive film on the substrate;
forming a first mask on the first conductive film;
etching the first conductive film to form an electrode portion of an X electrode, an electrode portion of a Y electrode, and an intersect portion of the Y electrode;
removing the first mask;
forming an insulating film made of a negative resist on the first conductive film;
forming a contact portion of the electrode portion of the X electrode by removing the insulating film;
forming a second conductive film on the insulating film;
forming a second mask on the second conductive film;
etching the second conductive film to form an intersect portion of the X electrode connected to the contact portion of the X electrode and intersecting with the intersect portion of the Y electrode;
removing the second mask; and
forming a protective film from a negative resist on the second conductive film over the insulating film.

7. The manufacturing method of the touch panel according to claim 6 , wherein the first conductive film is made of a transparent conductive material.

8. The manufacturing method of the touch panel according to claim 6 , wherein the first mask is made of a positive resist.

9. The manufacturing method of the touch panel according to claim 6 , wherein the second mask is made of a positive resist.

10. The manufacturing method of the touch panel according to claim 6 , wherein the protective film is provided in the contact portion.

11. A manufacturing method of a touch panel comprising the steps of:
providing a substrate;
forming a first conductive film on the substrate,
forming a first mask on the first conductive film;
etching the first conductive film to form a lower intersect portion;
removing the first mask;
forming an insulating film made of a negative resist on the first conductive film;
forming a contact hole of the lower intersect portion by removing the insulating film;
forming a second conductive film on the insulating film;
forming a second mask on the second conductive film;
etching the second conductive film to form an upper intersect portion and electrode portions;
removing the second mask; and
forming a protective film from a negative resist on the second conductive film over the insulating film;
wherein the lower intersect portion connects between two adjacent electrode portions via the contact hole and intersects with the upper intersect portion.

12. The manufacturing method of the touch panel according to claim 11 , wherein the first conductive film is made of a transparent conductive material.

13. The manufacturing method of the touch panel according to claim 11 , wherein the first mask is made of a positive resist.

14. The manufacturing method of the touch panel according to claim 11 , wherein the second mask is made of a positive resist.

15. The manufacturing method of the touch panel according to claim 11 , wherein the protective film is provided in the contact hole.

Assignees

• Japan Display Inc
• Panasonic Liquid Crystal Displ

Inventors

• Teramoto Masahiro

Classifications

• H10P70/234

  the processing being the formation of vias or contact holes · CPC title

• H10P50/28

  of insulating materials · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10D64/01364

  the semiconductor being diamond, semiconducting diamond-like carbon or graphene · CPC title

• H10D64/0114

  to diamond, semiconducting diamond-like carbon or graphene · CPC title