Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same

Patent metadata

Field	Value
Publication number	US-9291899-B2
Application number	US-65473709-A
Country	US
Kind code	B2
Filing date	Dec 30, 2009
Priority date	Dec 30, 2008
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the composition including a solvent and an organosilane polymer, the organosilane polymer being a condensation polymerization product of at least one first compound represented by Chemical Formulae 1 and 2 and at least one second compound represented by Chemical Formulae 3 to 5.

First claim

What is claimed is:

1. A resist underlayer composition, comprising:
a solvent;
a cross-linking catalyst, the cross-linking catalyst including at least one of pyridinium p-toluenesulfonate, amidosulfobetain-16, ammonium(-)-camphor-10-sulfonic acid ammonium salt, ammonium formate, alkyltriethylammonium formate, pyridinium formate, tetrabutyl ammonium acetate, tetrabutyl ammonium azide, tetrabutyl ammonium benzoate, tetrabutyl ammonium bisulfate, tetrabutyl ammonium bromide, tetrabutyl ammonium chloride, tetrabutyl ammonium cyanide, tetrabutyl ammonium fluoride, tetrabutyl ammonium iodide, tetrabutyl ammonium sulfate, tetrabutyl ammonium nitrate, tetrabutyl ammonium nitrite, tetrabutyl ammonium p-toluene sulfonate, and tetrabutyl ammonium phosphate; and
an organosilane polymer, the organosilane polymer being a condensation polymerization product of:
at least one first compound represented by Chemical Formula 1 or 2, and
at least one second compound represented by any one of Chemical Formulae 3 to 5
wherein the at least one first compound represented by Chemical Formula 1 or 2 includes at least one compound represented by Chemical Formula 1, and the at least one second compound represented by any one of Chemical Formulae 3 to 5 includes at least one compound represented by Chemical Formula 3, at least one compound represented by Chemical Formula 4, and at least one compound represented by Chemical Formula 5;
[R 1 ] 3 Si-[Ph 1 ] 1 -Si[R 2 ] 3   [Chemical Formula 1]

[R 1 ] 3 Si-[Ph 1 ] m -Ph 2   [Chemical Formula 2]

[R 1 ] 3 Si—(CH 2 ) n —R 3   [Chemical Formula 3]

[R 1 ] 3 Si—R 4   [Chemical Formula 4]

[R 1 ] 3 Si—X—Si[R 2 ] 3   [Chemical Formula 5]

wherein, in Chemical Formulae 1 to 5:
Ph 1 is a substituted or unsubstituted phenylene group,
Ph 2 is a substituted or unsubstituted phenyl group,
R 1 and R 2 are each independently a halogen, a hydroxyl group, an alkoxy group, a carboxyl group, an ester group, a cyano group, a haloalkylsulfite group, an alkylamine group, an alkylsilylamine group, or an alkylsilyloxy group,
R 3 is a substituted or unsubstituted C6 to C12 aryl group,
R 4 is hydrogen or a C1 to C6 alkyl group,
X is a substituted or unsubstituted linear alkylene group, a substituted or unsubstituted branched alkylene group, or an alkylene group including an alkenylene group, an alkynylene group, a heterocyclic group, a urea group, or an isocyanurate group in its main chain,
l is an integer of 2 to 4, and m is an integer of 1 to 4, and
n is an integer of 0 to 5.

2. The resist underlayer composition as claimed in claim 1 , wherein the organosilane polymer is produced by a condensation polymerization reaction of about 1 to about 99 mol % of the at least one first compound, and about 1 to about 99 mol % of the at least one second compound, under an acid catalyst or a base catalyst.

3. The resist underlayer composition as claimed in claim 1 , wherein the organosilane polymer has a weight average molecular weight of about 2,000 to about 50,000.

4. The resist underlayer composition as claimed in claim 1 , wherein the organosilane polymer is included in an amount of about 0.1 to about 50 wt %, based on a total weight of the resist underlayer composition.

5. The resist underlayer composition as claimed in claim 1 , further comprising at least one of a cross-linking agent, a radical stabilizer, and a surfactant.

6. The resist underlayer composition as claimed in claim 1 , wherein:
the at least one first compound includes bis(triethoxysilyl)biphenyl, and
the at least one second compound includes bis(triethoxysilyl)ethane, phenyltrimethoxysilane, and methyltrimethoxysilane.

7. A method of manufacturing semiconductor integrated circuit device, the method comprising:
providing a material layer on a substrate;
forming a first resist underlayer on the material layer;
coating the resist underlayer composition as claimed in claim 1 on the first resist underlayer to form a second resist underlayer on the first resist underlayer;
forming a radiation-sensitive imaging layer on the second resist underlayer;
patternwise exposing the radiation-sensitive imaging layer to radiation to form a pattern of radiation-exposed regions in the imaging layer;
selectively removing portions of the radiation-sensitive imaging layer and the second resist underlayer to expose portions of the first resist underlayer;
selectively removing the patterned second resist underlayer and portions of the first resist underlayer to expose portions of the material layer; and
etching the exposed portions of the material layer to pattern the material layer.

8. The method as claimed in claim 7 , further comprising forming an anti-reflection coating after forming the second resist underlayer and prior to forming a radiation-sensitive imaging layer.

9. The method as claimed in claim 7 , wherein the second resist underlayer includes an organosilane polymer including a repeating unit represented by Chemical Formula 6:
(SiO 1.5 -[Ph 1 ] 1 -SiO 1.5 ) a (Ph 2 -[Ph 1 ] m -SiO 1.5 ) b (R 3 —(CH 2 ) n —SiO 1.5 ) c (R 4 —SiO 1.5 ) d (SiO 1.5 —X—SiO 1.5 ) e   [Chemical Formula 6]

wherein, in Chemical Formula 6:
Ph 1 is a substituted or unsubstituted phenylene group,
Ph 2 is a substituted or unsubstituted phenyl group,
R 3 is a substituted or unsubstituted C6 to C12 aryl group,
R 4 is hydrogen or a C1 to C6 alkyl group,
X is a substituted or unsubstituted linear alkylene group, a substituted or unsubstituted branched alkylene group, or an alkylene group including an alkenylene group, an alkynylene group, a heterocyclic group, an urea group, or an isocyanurate group in its main chain,
l is an integer of 2 to 4, and m is an integer of 1 to 4,
n is an integer of 0 to 5, and
a, b, c, d, and e satisfy the relations: 0<a≦0.99, 0≦b≦0.99, 0.01≦a+b≦0.99, 0<c≦0.99, 0<d≦0.99, 0<e≦0.99, 0.01≦c+d+e≦0.99, and a+b+c+d+e=1.

10. A resist underlayer composition, comprising:
a solvent;
a cross-linking catalyst, the cross-linking catalyst including at least one of pyridinium p-toluenesulfonate, amidosulfobetain-16, ammonium(-)-camphor-10-sulfonic acid ammonium salt, ammonium formate, alkyltriethylammonium formate, pyridinium formate, tetrabutyl ammonium acetate, tetrabutyl ammonium azide, tetrabutyl ammonium benzoate, tetrabutyl ammonium bisulfate, tetrabutyl ammonium bromide, tetrabutyl ammonium chloride, tetrabutyl ammonium cyanide, tetrabutyl ammonium fluoride, tetrabutyl ammonium iodide, tetrabutyl ammonium sulfate, tetrabutyl ammonium nitrate, tetrabutyl ammonium nitrite, tetrabutyl ammonium p-toluene sulfonate, and tetrabutyl ammonium phosphate; and
an organosilane polymer, the organosilane polymer including a repeating unit represented by Chemical Formula 6:
(SiO 1.5 -[Ph 1 ] 1 -SiO 1.5 ) a (Ph 2 -[Ph 1 ] m -SiO 1.5 ) b (R 3 —(CH 2 ) n —SiO 1.5 ) c (R 4 —SiO 1.5 ) d (SiO 1.5 —X—SiO 1.5 ) e   [Chemical Formula 6]

wherein, in Chemical Formula 6:
Ph 1 is a substituted or unsubstituted phenylene group,
Ph 2 is a substituted or unsubstituted phenyl group,
R 3 is a substituted or unsubstituted C6 to C12 aryl group,
R 4 is hydrogen or a C1 to C6 alkyl group,
X is a substituted or unsubstituted linear alkylene group, a substituted or unsubstituted branched alkylene group, or an alkylene group including an alkenylene group, an alkynylene group, a heterocyclic group, a urea group, or an isocyanurate group in its main chain,
l is an integer of 2 to 4, and m is an integer of 1 to 4,
n is an integer of 0 to 5, and
a, b, c, d, and e satisfy the relations: 0<a≦0.99, 0≦b≦0.99, 0.01≦a+b≦0.99, 0<c≦0.99, 0<d≦0.99, 0<e≦0.99, 0.01≦c+d+e≦0.99, and a+b+c+d+e=1.

11. A resist

Assignees

• Cho Hyeon-Mo
• Kim Sang-Kyun
• Woo Chang-Soo
• Kim Mi-Young
• Koh Sang-Ran
• Yun Hui-Chan
• Lee Woo-Jin
• Kim Jong-Seob
• Cheil Ind Inc

Inventors

• Cho Hyeon-Mo
• Kim Sang-Kyun
• Woo Chang-Soo
• Kim Mi-Young
• Koh Sang-Ran
• Yun Hui-Chan
• Lee Woo-Jin
• Kim Jong-Seob

Classifications

• C08G77/52

  containing aromatic rings · CPC title

• C08G77/24

  halogen-containing groups · CPC title

• C08G77/16

  to hydroxy groups · CPC title

• C08K5/0008

  Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59 · CPC title

• C09D183/14

  in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence) · CPC title