Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, manufacturing method of electronic device, electronic device and resin

Patent metadata

Field	Value
Publication number	US-9291898-B2
Application number	US-201514605415-A
Country	US
Kind code	B2
Filing date	Jan 26, 2015
Priority date	Jul 27, 2012
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having (a) a repeating unit represented by the specific formula; a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method comprising (i) a step of forming a film by using the actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using a developer to form a pattern; a method for manufacturing an electronic device, comprising the pattern forming method; and an electronic device manufactured by the manufacturing method of an electronic device.

First claim

The invention claimed is:

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:
a compound capable of generating an acid upon irradiation with an actinic ray or radiation;
a solvent; and
(P) a resin having (a) a repeating unit represented by the following formula (1):

wherein
each of R 11 , R 12 and R 13 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group, R 12 may combine with L 11 to form a ring, and in this case, R 12 represents a single bond or an alkylene group;
R 1 represents a hydrogen atom or an alkyl group;
L 11 represents a single bond or a divalent linking group, and in the case of forming a ring with R 12 , L 11 represents a trivalent linking group;
R represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an acyl group or a heterocyclic group;
n1 represents an integer of 1 or more;
M 1 represents a single bond or a divalent linking group;
Q 1 represents an alkyl group, a cycloalkyl group, an aryl group or a heterocyclic group;
when M 1 is a divalent linking group, Q 1 may combine with M 1 through a single bond or another linking group to form a ring; and
the case where R combines with Q 1 or M 1 to form a ring is excluded.

2. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein R 1 is a hydrogen atom.

3. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein L 11 is a single bond, a group represented by —COO-L 1 - or a group represented by -L 2 -O—CH 2 — (wherein L 1 represents an alkylene group having a carbon number of 1 to 9, which may contain a heteroatom or a carbonyl bond, and L 2 represents an arylene group having a carbon number of 1 to 10.

4. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 3 ,
wherein L 11 is a single bond.

5. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein R in formula (1) is a group represented by —C(R 21 )(R 22 )(R 23 ) wherein each of R 21 to R 23 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or a heterocyclic group, and each of at least two members of R 21 to R 23 independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or a heterocyclic group, and
at least two members of R 21 to R 23 may combine with each other to form a ring, with the provided excluding the case where at least one of R 21 to R 23 combines with M 1 or Q 1 to form a ring.

6. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 5 ,
wherein in formula (1), each of R 21 to R 23 is independently an alkyl group.

7. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein n1 in formula (1) is 1.

8. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the resin (P) is a resin further containing a repeating unit represented by the following formula (5) or (6):

wherein each of R 51 and R 61 independently represents a hydrogen atom or a methyl group,
each of Ar 51 and Ar 61 independently represents an arylene group, and
L 61 represents a single bond or an alkylene group.

9. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein the resin (P) is a resin further containing a repeating unit represented by the following formula (4):

wherein R 41 represents a hydrogen atom or a methyl group,
L 41 represents a single bond or a divalent linking group,
L 42 represents a divalent linking group, and
S represents a structural moiety capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid on the side chain.

10. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein R formula (1) is an alkyl group having a carbon number of 5 or more.

11. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein Q 1 in formula (1) is an aryl group.

12. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 1 ,
wherein Q 1 in formula (1) is an alkyl group having a carbon number of 6 or more.

13. A resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition claimed in claim 1 .

14. A pattern forming method comprising
(i) a step of forming a film by using the actinic ray-sensitive or radiation-sensitive resin composition claimed in claim 1 ,
(ii) a step of exposing the film, and
(iii) a step of developing the exposed film by using a developer to form a pattern.

15. The pattern forming method as claimed in claim 14 ,
wherein the developer contains an organic solvent.

16. A method for manufacturing an electronic device, comprising
(i) a step of forming a film on an inorganic substrate or a coating-type inorganic substrate suitable for use in a process of producing a semiconductor, a liquid crystal device or a circuit board by using the actinic ray-sensitive or radiation-sensitive resin composition claimed in claim 1 ,
(ii) a step of pattern-wise exposing the film, and
(iii) a step of developing the exposed film by using a developer to form a pattern on the inorganic substrate or coating-type inorganic substrate.

17. A resin comprising a repeating unit having a phenolic hydroxyl group represented by the following formula and a repeating unit represented by the following formula (1-2):

wherein in formula (1-2),
R 0 represents a hydrogen atom or a methyl group;
each of R 21 to R 23 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or a heterocyclic group, and each of at least two members of R 21 to R 23 independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or a heterocyclic group;
at least two of R 21 to R 23 may combine with each other to form a ring, with the proviso excluding the case where at least one of R 21 to R 23 combines with R 71 to form a ring; and
R 71 represents an unsubstituted alkyl group, a cycloalkyl group-substituted alkyl group, a cycloalkyl group, an aralkyl group, an aryloxyalkyl group or a heterocyclic group.

18. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 17 ,
wherein the total number of the carbon numbers of R 21 to R 23 in formula (1-2) is 4 or more.

19. The actinic ray-sensitive or radiation-sensitive resin composition as claimed in claim 17 ,
wherein R 71 in formula (1-2) is an alkyl group having a carbon number of 6 or more.

Assignees

• Fujifilm Corp

Inventors

• Yokokawa Natsumi
• Hirano Shuji
• Takizawa Hiroo
• Nihashi Wataru

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• C08F220/12

  of monohydric alcohols or phenols · CPC title

• C08F12/24

  Phenols or alcohols · CPC title