Light-emitting device with electrically insulated LED module

Patent metadata

Field	Value
Publication number	US-9291335-B2
Application number	US-201113164011-A
Country	US
Kind code	B2
Filing date	Jun 20, 2011
Priority date	Jun 18, 2010
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A lighting fixture includes an outer surface with pairs of fastening holes to receive LED lighting devices. The devices include an insulating base substrate, an LED module engaging the base substrate and including positive and negative power supply input terminals, and an insulating device housing shaped to cover the base substrate and the LED module when engaged therewith. A plurality of terminal board modules are integral to the device housing and effective to electrically couple respective external power supply conductors to the power supply input terminals of the LED module. The base substrate and the device housing further include a pair of through holes corresponding to an associated pair of holes on the fixture surface. When a fastener couples the base substrate and the device housing to the fixture, the LED module is insulated with respect to the fastening device and outer surface.

First claim

What is claimed is:

1. A light-emitting device comprising:
a base substrate comprising an insulating material;
an LED module comprising positive and negative power supply input terminals;
a device housing integrally formed of an insulating material shaped so as to cover the base substrate and the LED module when engaged therewith;
a plurality of terminal board modules having
an insulating exterior portion integral to the device housing,
an interior portion comprising an electrically conductive contact extending therefrom to engage a respective power supply input terminal of the LED module when the device housing is engaged with the base substrate,
a terminal board entry portion shaped to receive an external power supply conductor wherein the conductor engages the contact; and

wherein the base substrate and the device housing further comprise one or more through holes shaped to receive fastening devices when engaged therewith, the LED module further insulated thereby with respect to the fastening devices,
wherein the exterior portions of the terminal board modules further comprise a surface shaped to engage a corresponding surface of the LED module when the device housing is coupled to the base substrate via the one or more fastening devices, and the LED module is pressure fitted thereby to the base substrate.

2. The light-emitting device of claim 1 , the base substrate comprising a recess shaped to receive the LED module.

3. The light-emitting device of claim 1 , the LED module comprising one or more LED chips coupled to an LED substrate, the LED chips electrically coupled to the power supply input terminals via printed leads in the LED substrate.

4. The light-emitting device of claim 3 , the LED module comprising an LED chip, the device housing further comprising a recessed portion having an outer aperture of a first diameter and an inner aperture of a second aperture smaller than the first aperture and larger than a diameter of the LED chip, the recessed portion extending from an outer surface of the device housing to envelop the LED chip.

5. The light-emitting device of claim 4 , an inner surface of the recessed portion of the device housing further comprising a reflective material layer.

6. The light-emitting device of claim 5 , the reflective material comprising white resin.

7. A light-emitting device comprising:
a base substrate;
an LED module comprising
a mounting substrate having a first surface configured to engage the base substrate, at least one of the base substrate and the mounting substrate comprising an insulating material,
one or more LED chips mounted on a second surface of the mounting substrate and electrically coupled to first and second power supply input terminals mounted on the second surface of the mounting substrate;

a device housing integrally formed of an insulating material shaped so as to cover the base substrate and the LED module when engaged therewith; and
a plurality of terminal board modules having
an insulating exterior portion integral to the device housing,
an interior portion comprising an electrically conductive contact extending therefrom to engage a respective power supply input terminal of the LED module when the device housing is engaged with the base substrate,

a terminal board entry portion shaped to receive an external power supply conductor wherein the conductor engages the contact; and
the base substrate and the device housing further comprising one or more through holes shaped to receive fastening devices when engaged therewith, the LED chips further insulated with respect to the fastening devices,
wherein the exterior portions of the terminal board modules further comprise a surface shaped to engage a corresponding surface of the mounting substrate when the device housing is coupled to the base substrate via the fastening device, further wherein the mounting substrate is pressure fitted to the base substrate.

8. The light-emitting device of claim 7 , the base substrate comprising a recess shaped to receive the mounting substrate.

9. The light-emitting device of claim 7 , the device housing further comprising a recessed portion having an outer aperture of a first diameter and an inner aperture of a second aperture smaller than the first aperture and larger than a diameter of the LED chip, the recessed portion extending from an outer surface of the device housing to envelop the LED chip.

10. The light-emitting device of claim 9 , further comprising:
a lens housing having an inner diameter greater than the diameter of the outer aperture of the device housing and further comprising first and second engagement flanges; and
a lens shaped to fit within the recessed portion of the device housing, the device housing further comprising first and second engagement apertures configured to receive the engagement flanges of the lens housing when engaged therewith.

11. A light-emitting device comprising:
a base substrate;
an LED mounting substrate upon which is disposed first and second power supply input terminals and one or more LED chips electrically coupled to the power supply input terminals;
a device housing configured for coupling to the base substrate via one or more metallic fastening devices;
a plurality of terminal board modules formed of an insulating material and disposed within an interior of the device housing;
each terminal board module comprising a surface shaped to engage a corresponding surface of the LED mounting substrate when the device housing is coupled to the base substrate via one or more fastening devices, thereby pressure fitting the LED mounting substrate to the base substrate;
each terminal board module defining an interior within which is disposed an electrically conductive contact configured to engage a respective power supply input terminal when the device housing is coupled to the base substrate;
each terminal board module further comprising a terminal board entry portion shaped to receive an external power supply conductor provided via a corresponding aperture through the device housing, and wherein the conductor engages the respective contact disposed therein; and
at least one of the base substrate and the mounting substrate further comprising an insulating material, whereby the LED chips are electrically insulated by the insulating materials with respect to the one or more fastening devices.

12. The light-emitting device of claim 11 , the device housing further comprising a recessed portion having an outer aperture of a first diameter and an inner aperture of a second aperture smaller than the first aperture and larger than a diameter of the LED chip, the recessed portion extending from an outer surface of the device housing to envelop the LED chip.

13. The light-emitting device of claim 12 , further comprising:
a lens housing having an inner diameter greater than the diameter of the outer aperture of the device housing and further comprising first and second engagement flanges; and
a lens shaped to fit within the recessed portion of the device housing, the device housing further comprising first and second engagement apertures configured to receive the engagement flanges of the lens housing when engaged therewith.

14. The light-emitting device of claim 11 , wherein the base substrate and the device housing each further comprise one or more through holes corresponding to an associated set of fastening holes on an outer surface of a lighting fixture within which the device is disposed, the holes shaped to receive a respective fastening device when engaged therewith, the LED module further insulated thereby with respect to the fa

Assignees

• Kataoka Takaaki
• Panasonic Ip Man Co Ltd

Inventors

• Kataoka Takaaki

Classifications

• H01R4/4818

  Electricity · mapped topic

• F21V19/0055 Primary

  by screwing · CPC title

• F21V5/04

  of lens shape · CPC title

• H01R4/4848

  Busbar integrally formed with the spring · CPC title

• H01R4/4821

  Single-blade spring · CPC title