Adhesive formulations for bonding composite materials

Patent metadata

Field	Value
Publication number	US-9290631-B2
Application number	US-4684408-A
Country	US
Kind code	B2
Filing date	Mar 12, 2008
Priority date	Mar 12, 2008
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

Adhesive formulations generally including an acrylate and/or methacrylate monomer; a vinyl ester resin having a weight average molecular weight ranging from about 450 to about 3000; and a catalyst. Also disclosed is a method for forming a composite material employing the formulations.

First claim

What is claimed is:

1. An adhesive formulation comprising:
methacrylate monomer;
a resin material; and
a catalyst;
wherein the resin material comprises vinyl ester resin having a weight average molecular weight ranging from about 450 to about 3000 and wherein the methacrylate monomer comprises phenoxyethyl methacrylate and/or ethoxylated 2-bisphenol A dimethacrylate.

2. The adhesive formulation of claim 1 , wherein the catalyst is in an amount effective to provide a workable lifetime of the formulation for a period greater than one hour.

3. The adhesive formulation of claim 1 , wherein the vinyl ester resin comprises a reaction byproduct of an unsaturated monocarboxylic acid or an anhydride with an epoxy resin.

4. The adhesive formulation of claim 1 , wherein the catalyst comprises cobalt napthenate, acetylacetone, methyl ethyl ketone peroxide, cobalt octoate, N,N-dimethyl aniline, N,N-dimethyl acetamide, N,N-dimethyl para-toluidine, and combinations thereof.

5. The adhesive formulation of claim 1 , wherein the catalyst comprises an amount of 0.05 to 1.5% by weight, based on the total weight of the adhesive formulation.

6. A method for adhesively attaching a first composite material to a second composite material comprising:
disposing the adhesive formulation according to claim 1 between the first and second composite materials; and curing the adhesive formulation to form a cured adhesive formulation to attach the first composite material to the second composite material.

7. The method of claim 6 , wherein the methacrylate monomer comprises phenoxyethyl methacrylate.

8. A method for forming a composite material, the method comprising:
preparing an infusion resin formulation;
layering a plurality of dry fiber plies to create a dry laminate material; infusing the infusion resin formulation into the dry laminate material for cr ting to create a fiber-reinforced resin composite, wherein the infusion resin formulation comprises the adhesive formulation of claim 1 and
curing the infusion resin to form a cured infusion resin in the fiber-reinforced resin composite to form a composite material.

9. The method of claim 8 , wherein the methacrylate monomer comprises phenoxyethyl methacrylate.

10. A composite material formed by the method of claim 8 .

11. A composite laminate formed by the method of claim 9 .

12. A composite material comprising:
a dry laminate material comprising a layered plurality of dry fiber plies; and
an infusion resin comprising the adhesive formulation of claim 1 wherein the infusion resin has been cured to bond at least a portion of the layered plurality of dry fiber plies together to form a bonded article.

13. The composite material of claim 12 , wherein the methacrylic monomer comprises phenoxyethyl methacrylate.

14. The adhesive formulation of claim 1 , wherein the vinyl ester resin further comprises an ethylenically unsaturated monomer.

15. The adhesive formulation of claim 14 , wherein the ethylenically unsaturated monomer is present in an amount of about 40 weight % to about 60 weight % based on the total weight of the vinyl ester resin present in the adhesive formulation.

16. The method of claim 8 , wherein the cured infusion resin has a glass transition temperature of greater than 70° C. and wherein the infusion resin has a viscosity of less than 500 centipoise.

17. The method of claim 8 , wherein the vinyl ester resin further comprises an ethylenically unsaturated monomer.

18. The method of claim 6 , wherein the adhesive formulation has a viscosity less than 500 centipoise.

19. The method of claim 6 , wherein the cured adhesive formulation after curing has a glass transition greater or equal to 50° C.

20. The adhesive formulation according to claim 1 wherein the methacrylate monomer comprises phenoxyethyl methacrylate.

21. The adhesive formulation of claim 20 , wherein the adhesive formulation has a viscosity less than 500 centipoise.

22. A method for adhesively attaching a first composite material to a second composite material comprising:
disposing the adhesive formulation according to claim 20 between the first and second composite materials; and
curing the adhesive formulation to form a cured adhesive formulation to attach the first composite material to the second composite material;
wherein the adhesive formulation after curing has a glass transition temperature greater than or equal to 50° C.

23. The method of claim 22 , wherein the adhesive formulation has a viscosity less than 500 centipoise.

24. The method according to claim 23 wherein the cured adhesive formulation has a glass transition temperature greater than 70° C.

25. The adhesive formulation of claim 1 wherein the methacrylate monomer comprises ethoxylated 2-bisphenol A dimethacrylate.

Assignees

• Olson Daniel Robert
• Lin Wendy
• Seeger George Thomas
• Gen Electric

Inventors

• Olson Daniel Robert
• Lin Wendy
• Seeger George Thomas

Classifications

• B32B5/024

  Woven fabric · CPC title

• B32B2603/00

  Vanes, blades, propellers, rotors with blades · CPC title

• B32B2262/0276

  Polyester fibres · CPC title

• B32B2262/106

  Carbon fibres, e.g. graphite fibres · CPC title

• C08J5/24 Primary

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title