Method for manufacturing a module with a hollow region, preferably for fluid circulation

Patent metadata

Field	Value
Publication number	US-9289847-B2
Application number	US-201013393649-A
Country	US
Kind code	B2
Filing date	Sep 3, 2010
Priority date	Sep 7, 2009
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A manufacturing method for a module having a hollow region, including: making an assembly including at least one recessed plate having a recess open at one face, defining thereon a recess outline and, between the face and the immediately adjacent plate of the assembly, a strand of material lying along the recess outline; treating the assembly, aiming to obtain diffusion bonding of the strand to the plate(s) with which it is in contact, to constitute, along its associated recess outline, a gas-tight connection of the two plates between which it is placed; and consolidating the assembly by hot isostatic pressing.

First claim

The invention claimed is:

1. A method for manufacturing a module having a hollow region, comprising:
making an assembly of plates stacked in a stacking direction and defining the hollow region, including at least one recessed plate having a recess constituting all or part of the hollow region and open at at least one of its faces, defining thereon a recess outline, the assembly including, between each face defining a recess outline and the plate of the assembly that is immediately adjacent in the stacking direction, a strand of material comprising a linear element defining a closed line lying along and contacting the entire circumventing top edge of the hollow region at an intersection of the hollow region and a face of the plate, with substantially all segments of the closed line of said strand of material along the entire circumventing top edge of the hollow region extending only along the top edge and not substantially extending over the hollow region;
treating the assembly to achieve a first diffusion bonding of each strand of material to the plates with which the strand is in contact, to constitute, along the associated recess outline, a gas-tight connection of the two plates between which it is placed; and
thereafter, consolidating the assembly by hot isostatic pressing, carried out to achieve a second diffusion bonding of the plates and the strand of material together, the consolidating being implemented while allowing pressurization gas to enter the hollow region.

2. A method according to claim 1 , wherein each material strand is designed in a single unit with its associated recessed plate, or is applied to the assembly as an insert.

3. A method according to claim 1 , wherein at least one recessed plate of the assembly has a recess constituting all or a portion of the hollow region and open only at one of its faces, defining thereon a recess outline.

4. A method according to claim 3 , wherein the strand of material, associated with the recessed plate defining a recess opening only at one of its faces, cooperates with a solid plate or with another recessed plate of the assembly.

5. A method according to claim 1 , wherein at least one recessed plate of the assembly has a recess constituting all or a portion of the hollow region and open at its two opposite faces, this through recess defining a recess outline on each of the two opposite faces of the plate.

6. A method according to claim 5 , wherein strand of material and another strand of material, each associated with a respective side of the recessed plate defining a through recess, cooperate with a solid plate or with another recessed plate of the assembly.

7. A method according to claim 1 , wherein the assembly treatment is also carried out by hot isostatic pressing, at a pressure lower than that employed for the consolidating.

8. A method according to claim 7 , wherein the assembly treatment carried out by hot isostatic pressing is followed by drilling the assembly, implemented so as to cause the recess to communicate with an outside of the assembly.

9. A method according to claim 1 , wherein the assembly is constituted that before its treatment, an area in orthogonal projection in the stacking direction of the face of the plate having the recess is at least N times greater than an area of its associated strand of material, N being greater than 1.5, or greater than 3.

10. A method according to claim 1 , wherein the assembly further includes, between each face of a recessed plate defining a recess outline and the plate of the assembly that is immediately adjacent in the stacking direction, a peripheral strand of material lying along the perimeter of these two plates, the subsequent assembly treatment also obtaining diffusion bonding of each peripheral strand of material to the plate(s) of the assembly with which it is in contact, to constitute, along their perimeter, a gas-tight connection of the two plates between which it is placed.

11. A method according to claim 1 , wherein the hollow region takes a form of one or of a plurality of fluid circulation channels.

12. A method according to claim 1 , wherein the module is configured to equip a heat exchanger system.

13. A method according to claim 1 , wherein the module takes a form of a plate.

14. A method comprising:
making an assembly of plates stacked in a stacking direction, said assembly of plates including a bottom plate with a hollow region open on an upper face and closed on a lower face and an upper plate disposed above the bottom plate,
said making including disposing a strand of material comprising a linear element defining a closed line lying along and contacting the entire circumventing top edge of the hollow region at an intersection of the hollow region and a face of the plate with substantially all segments of the closed line of said strand of material along the entire circumventing top edge of the hollow region extending only along the top edge and not substantially extending over the hollow region; and
initially bonding the plates and said each strand of material together by causing a diffusion bond of the strand of material to the bottom plate and the upper plate with which the strand of material is in contact.

15. The method of claim 14 , wherein the making includes disposing the strand of material along the recess outline of the hollow recess and an outer peripheral edge of the bottom plate, and a zone, along a face of the bottom plate on which the strand of material is disposed, between the recess outline and the outer peripheral edge of the bottom plate, is devoid of the strand of material.

16. The method of claim 14 , wherein a total width of the strand of material in a plane orthogonal to a stacking direction of the assembly of plates is smaller than a total width of the bottom plate in the plane.

17. The method of claim 16 , comprising:
obtaining the diffusion bond of the strand of material to the bottom plate and the upper plate with which the strand of material is in contact, and thereby forming, along the outer peripheral edge, a gas-tight connection of the bottom plate and the upper plate.

18. A method comprising:
making an assembly of plates stacked in a stacking direction, said assembly of plates including a bottom plate with a hollow region open on an upper face and closed on a lower face and an upper plate disposed above the bottom plate,
said making including disposing a strand of material in contact with an intersection of the hollow region and a face of the bottom plate with substantially all segments of said strand of material along an entire circumventing top edge of the hollow region extending only along the top edge and not substantially extending over the hollow region; and
initially bonding the plates and said each strand of material together by causing a diffusion bond of the strand of material to the bottom plate and the upper plate with which the strand of material is in contact.

Assignees

• Rigal Emmanuel
• Bucci Philippe
• Commissariat à l'énergie atomique et aux énergies alternatives

Inventors

• Rigal Emmanuel
• Bucci Philippe

Classifications

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• B23K20/021 Primary

  Isostatic pressure welding · CPC title

• B23K2201/14

  Operations & Transport · mapped topic

• F28F3/048

  in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels · CPC title

• B23K20/023

  Thermo-compression bonding · CPC title