Expansion chuck

US9289831B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9289831-B2
Application numberUS-201213723027-A
CountryUS
Kind codeB2
Filing dateDec 20, 2012
Priority dateDec 20, 2012
Publication dateMar 22, 2016
Grant dateMar 22, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The invention relates to a hydraulic expansion chuck with a basic body, with an expansion bush which is received in the basic body and defines a reception space for a tool to be chucked, and with a pressure chamber which is delimited between the expansion bush and the basic body, at least one solder region being provided, in which the expansion bush is soldered to the basic body, wherein, between the pressure chamber and the solder region, a seal is provided which is formed by an at least essentially fluid-tight bearing contact of the expansion bush against the basic body.

First claim

Opening claim text (preview).

What is claimed is: 1. A hydraulic expansion chuck, comprising: a basic body; an expansion bush which is received in the basic body and defines a reception space for a tool to be chucked, wherein the expansion bush includes a press portion and a solder portion adjacent thereto; a pressure chamber which is delimited between the expansion bush and the basic body, a solder region being provided in which the expansion bush is soldered to the basic body, wherein between the pressure chamber and the solder region a seal is provided which is formed by an at least essentially fluid-tight bearing contact of the expansion bush against the basic body; and wherein the seal is formed by a press fit between the expansion bush and the basic body by the press portion of the expansion bush which is larger in diameter than the solder portion of the expansion bush. 2. The expansion chuck as claimed in claim 1 , wherein the press portion is formed by a portion of the expansion bush which is thickened in diameter and on one side of which the solder region lies and on the other side of which the pressure chamber lies. 3. The expansion chuck as claimed in claim 1 , wherein the solder region is adjacent an axial rearward end of the expansion bush. 4. The expansion chuck as claimed in claim 3 , further including an additional solder region adjacent a flange of the expansion bush that is adjacent an axial forward end of the expansion bush. 5. A hydraulic expansion chuck, comprising: a basic body; an expansion bush which is received in the basic body and defines a reception space for a tool to be chucked, wherein the expansion bush includes a press portion and a first solder portion adjacent thereto; a pressure chamber which is delimited between the expansion bush and the basic body; a first solder region and a second solder region in which the expansion bush is soldered to the basic body, wherein between the pressure chamber and the first solder region and the second solder region a first seal and a second seal, respectively, are provided, wherein the first seal and the second seal are formed by an at least essentially fluid-tight bearing contact of the expansion bush against the basic body; wherein the first seal is formed by a press fit between the expansion bush and the basic body by the press portion of the expansion bush which is larger in diameter than the first solder portion of the expansion bush; and wherein the second seal is formed by a bearing portion which projects axially with respect to the second solder region lying next to it. 6. The expansion chuck as claimed in claim 5 , wherein the press portion is formed by a portion of the expansion bush which is thickened in diameter and on one side of which the first solder region lies and on the other side of which the pressure chamber lies. 7. The expansion chuck as claimed in claim 5 , wherein the first solder region is adjacent an axial rearward end of the expansion bush. 8. The expansion chuck as claimed in claim 5 , wherein the second solder region is adjacent a flange of the expansion bush that is adjacent an axial forward end of the expansion bush. 9. The expansion chuck as claimed in claim 5 , wherein the bearing portion is formed on the expansion bush. 10. The expansion chuck as claimed in claim 5 , wherein the bearing portion extends in a plane which is oriented perpendicularly to the mid-axis of the reception space. 11. The expansion chuck as claimed in claim 5 , wherein the second solder region includes a radially oriented solder region and a cylindrical solder region. 12. The expansion chuck as claimed in claim 11 , wherein the bearing portion projects axially with respect to the radially oriented solder region. 13. The expansion chuck as claimed in claim 11 , wherein the bearing portion is arranged on the basic body and engages into a groove provided on the expansion bush, so that the bearing portion is offset in the axial direction with respect to the radially oriented solder region. 14. A hydraulic expansion chuck, comprising: a basic body; an expansion bush which is received in the basic body and defines a reception space for a tool to be chucked; a pressure chamber which is delimited between the expansion bush and the basic body; a first solder region and a second solder region in which the expansion bush is soldered to the basic body, wherein between the pressure chamber and the first solder region and the second solder region a first seal and a second seal, respectively, are provided, wherein the first seal and the second seal are formed by an at least essentially fluid-tight bearing contact of the expansion bush against the basic body; wherein the first seal is formed by a press fit between the expansion bush and the basic body by a press portion which differs in diameter from the diameter of the first solder region lying next to it; wherein the second seal is formed by a bearing portion which projects axially with respect to the second solder region lying next to it; and wherein the expansion bush is provided with a thread that is configured such that the expansion bush is screwed into the basic body, and wherein the second solder region extends into the thread. 15. The expansion chuck as claimed in claim 14 , wherein the second solder region includes a radially oriented solder region and a cylindrical solder region. 16. The expansion chuck as claimed in claim 15 , wherein the cylindrical solder region extends into the thread.

Assignees

Inventors

Classifications

  • using fluid-pressure means to actuate the gripping means · CPC title

  • Seals · CPC title

  • using fluid-pressure means to actuate the gripping means · CPC title

  • Brazed connections · CPC title

  • B23B31/305Primary

    the gripping means is a deformable sleeve · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9289831B2 cover?
The invention relates to a hydraulic expansion chuck with a basic body, with an expansion bush which is received in the basic body and defines a reception space for a tool to be chucked, and with a pressure chamber which is delimited between the expansion bush and the basic body, at least one solder region being provided, in which the expansion bush is soldered to the basic body, wherein, betwe…
Who is the assignee on this patent?
Kennametal Inc
What technology area does this patent fall under?
Primary CPC classification B23B31/305. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).