Intravascular pressure devices incorporating sensors manufactured using deep reactive ion etching

Patent metadata

Field	Value
Publication number	US-9289137-B2
Application number	US-86449907-A
Country	US
Kind code	B2
Filing date	Sep 28, 2007
Priority date	Sep 28, 2007
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

An intravascular pressure sensor assembly is disclosed herein that is produced in part using photolithography and DRIE solid-state device production processes. Using DRIE production processes facilitates a number of features that could not be readily incorporated in sensor chips fabricated using mechanical saws. In accordance with a first feature, sensor chips are created with non-rectangular outlines. The sensor chip includes a widened portion that substantially abuts an inner wall of a sensor housing, and a cantilevered portion that is relatively narrow in relation to the widened portion. The non-rectangular outline of the sensor chip is formed using photolithography in combination with DRIE processing. In accordance with another feature, the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing. In accordance with yet another feature, the sensor chip comprises one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip. The outline of the sensor chip and the cutouts are formed using photolithography in combination with DRIE processing.

First claim

What is claimed is:

1. An intravascular pressure sensor assembly comprising:
a flexible elongate member including a proximal and a distal end;
a housing mounted at the distal end of the flexible elongate member; and
a sensor chip, contained within the housing, comprising:
a widened portion that substantially abuts an inner wall of the housing, and
a cantilevered portion integrally formed with and extending distally from the widened portion in a direction parallel to a longitudinal axis of the flexible elongate member, wherein the cantilevered portion is relatively narrow in relation to the widened portion, the cantilevered portion including a diaphragm comprising at least one piezoresistive element, the sensor chip including a non-rectangular transition between the widened portion and the cantilevered portion on both sides of the cantilevered portion, the non-rectangular transition curving inwardly from the widened portion towards the cantilevered portion as the cantilevered portion extends distally from the widened portion; and
wherein one or more physical features of the sensor chip are formed using photolithography in combination with deep reactive-ion etching (DRIE) processing.

2. The intravascular pressure sensor assembly of claim 1 wherein the one or more physical features comprises: a transition between a relatively wide width of the widened portion and a relatively narrow width of the cantilevered portion thereby providing strain relief for the cantilevered portion with regard to the inner wall of the housing.

3. The intravascular pressure sensor assembly of claim 2 wherein the transition includes a curved section.

4. The intravascular pressure sensor assembly of claim 1 wherein the widened portion includes one or more notches.

5. The intravascular pressure sensor assembly of claim 1 wherein the widened portion includes a textured edge.

6. The intravascular pressure sensor assembly of claim 1 wherein the flexible elongate member is a guidewire.

7. The intravascular pressure sensor assembly of claim 1 wherein the one or more physical features comprises: one or more cutouts for receiving signal wires for connection to signal lead lines on the sensor chip.

8. The intravascular pressure sensor assembly of claim 7 wherein the one or more cutouts comprises a single slot cutout which receives a set of signal lines.

9. The intravascular pressure sensor assembly of claim 7 wherein the one or more cutouts comprises a set of cutouts wherein each cutout is provided for each one of a set of distinct signal lines.

10. The intravascular pressure sensor assembly of claim 9 wherein at least one of the set of cutouts is positioned proximate a perimeter of the sensor chip.

11. The intravascular pressure sensor assembly of claim 9 wherein the set of cutouts includes three cutouts.

12. An intravascular pressure sensor assembly comprising:
a flexible elongate member including a proximal end and a distal end;
a housing mounted at the distal end of the flexible elongate member; and
a sensor chip, contained by the housing, including a diaphragm including at least one piezoresistive element, wherein the sensor chip comprises:
a rectangular mounting structure sized and shaped to engage an inner wall of the housing, wherein one or more cutouts are formed in the mounting structure, the one or more cutouts configured for receiving signal wires for connection to signal lead lines on the sensor chip;
a rectangular cantilevered structure integrally formed with and extending distally from the mounting structure in a direction parallel to a longitudinal axis of the flexible elongate member, wherein the cantilevered structure has a width less than the width of the mounting structure such that the cantilevered structure is spaced from the inner wall of the housing when the mounting structure is engaged with the inner wall of the housing, wherein the diaphragm is formed within the cantilevered structure; and
a non-rectangular transition between the rectangular mounting structure and the rectangular cantilevered structure on both sides of the cantilevered portion, the non-rectangular transition curving inwardly from the widened portion towards the cantilevered portion as the cantilevered portion extends distally from the widened portion.

13. The intravascular pressure sensor assembly of claim 12 wherein the one or more cutouts comprises a single slot cutout which receives a set of signal lines.

14. The intravascular pressure sensor assembly of claim 12 wherein the one or more cutouts comprises a set of cutouts wherein each cutout is provided for each one of a set of distinct signal lines.

15. The intravascular pressure sensor assembly of claim 1 , wherein the cantilevered portion is spaced from the inner wall of the housing.

16. The intravascular pressure sensor assembly of claim 15 , further comprising a core wire extending along a length of the flexible elongate member and through at least a portion of the housing.

17. The intravascular pressure sensor assembly of claim 16 , wherein the cantilevered portion is spaced from the portion of the core wire extending through at least a portion of the housing.

18. The intravascular pressure sensor assembly of claim 17 , wherein the portion of the core wire extending through at least a portion of the housing is flattened.

19. The intravascular pressure sensor assembly of claim 1 , wherein the widened portion has a thickness equal to a thickness of the cantilevered portion.

20. The intravascular pressure sensor assembly of claim 1 , further comprising:
a first material disposed in a first interior region of the housing and configured to hold the widened portion; and
a second material disposed in a second interior region of the housing and configured to hold the cantilevered portion, wherein the second material has a higher elasticity than the first material.

Assignees

• Corl Paul Douglas
• Volcano Corp

Inventors

• Corl Paul Douglas

Classifications

• G01L9/0054

  integral with a semiconducting diaphragm · CPC title

• G01L19/143

  Two part housings · CPC title

• A61B5/026

  Measuring blood flow {(A61B3/1233, A61B3/1241 take precedence)} · CPC title

• A61B5/6851

  Guide wires · CPC title

• A61B5/0215 Primary

  by means inserted into the body · CPC title