Headset connector

Patent metadata

Field	Value
Publication number	US-9287657-B2
Application number	US-201313847103-A
Country	US
Kind code	B2
Filing date	Mar 19, 2013
Priority date	Sep 26, 2005
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

Headset assemblies and headset connectors are provided. Headset connectors can include a magnetic mating face and a plurality of electrical contacts disposed within the mating face. Engaging assemblies and engaging connectors are also provided. The engaging connectors can include a housing having a mating side, a magnetic array structure, and a plurality of spring biased contact members. The magnetic array structure can be fixed within the housing and house a plurality of spring biased contact members. The spring biased contact members can include tips that extend out of the mating side. The tips can electrically couple with electrical contacts in a headset connector.

First claim

We claim:

1. An engaging connector assembly comprising:
a housing having a mating face;
a magnetic array structure fixed within the housing and configured to magnetically couple the engaging connector assembly to a corresponding connector; and
a plurality of spring biased contact members arranged within the magnetic array structure, the plurality of spring biased contact members including tips that extend out of the mating face.

2. The assembly of claim 1 , wherein the plurality of spring biased contact members are electrically connected to a circuit board.

3. The assembly of claim 1 , wherein the magnetic array comprises a plurality of magnetic regions.

4. The assembly of claim 3 , wherein the plurality of magnetic regions protrude from the mating face.

5. The assembly of claim 3 , wherein the plurality of magnetic regions are flush with the mating face.

6. The assembly of claim 3 , wherein the plurality of regions comprises three of such regions.

7. The assembly of claim 1 , wherein each of the contact tips have a width of about 0.5 millimeters.

8. The assembly of claim 1 , wherein the distance between the centerlines of any two immediately adjacent contact tips is about 1.97 millimeters.

9. The assembly of claim 1 , wherein the distance between the centerlines of any two immediately adjacent contact tips ranges between 1.75 and 2.25 millimeters, 1.85 and 2.15 millimeters, 1.9 and 2.1 millimeters, or 1.95 and 2.05 millimeters.

10. The assembly of claim 1 , wherein the plurality of spring biased contact members comprises four contact members.

11. The assembly of claim 10 , wherein the distance between the center lines of the two outermost contact tips is about 5.1 millimeters.

12. The assembly of claim 1 , wherein the distance between the center lines of the two outermost contact tips ranges between 4.7 and 5.4 millimeters, 4.8 and 5.3 millimeters, 5.9 and 5.2 millimeters, 4.95 and 5.15 millimeters.

13. The assembly of claim 1 , wherein the housing has a height of about 5.1 millimeters.

14. The assembly of claim 1 , wherein the housing has a height ranging between 4.9 and 5.3 millimeters, 5.0 and 5.2 millimeters, or 4.95 and 5.15 millimeters.

15. The assembly of claim 1 , wherein the mating face has a height of about 3.43 millimeters.

16. The assembly of claim 1 , wherein the mating face has a height ranging between 3.2 and 3.7 millimeters, 3.3 and 3.6 millimeters, or 3.35 and 3.55 millimeters.

17. The assembly of claim 1 , wherein angle between a plane of the mating face and a center plane passing lengthwise through the housing ranges between 10 and 80 degrees, 20 and 70 degrees, 30 and 60 degrees, 35 and 65 degrees, or 40 and 50 degrees.

18. The assembly of claim 1 , wherein an angle between a plane of the mating face and a center plane passing lengthwise through the housing is about 60 degrees.

19. The assembly of claim 1 , the magnetic array structure comprising:
a first magnetic component; and
a second magnetic component separated from the first magnetic component by a gap;
wherein at least a portion of a particular spring biased contact member is disposed within the gap.

20. The assembly of claim 1 , the magnetic array structure comprising three spaced-apart magnetic components disposed along a direction, wherein the plurality of spring biased contact members comprises:
a first spring biased contact member set in a gap between a first and a second magnetic component; and
a second spring biased contact member set in a gap between the second and a third magnetic component.

21. The assembly of claim 1 , wherein the magnetic array structure includes a permanent magnet.

Assignees

• Apple Inc

Inventors

• Hankey M Evans
• Sanford Emery A
• Prest Christopher D
• Lim Way Chet

Classifications

• H02J7/70

  characterised by the mechanical construction · CPC title

• H02J7/64

  against overvoltage · CPC title

• H02J7/62

  against overcurrent · CPC title

• H04R2201/107

  Monophonic and stereophonic headphones with microphone for two-way hands free communication · CPC title

• H01R13/6205 Primary

  Two-part coupling devices held in engagement by a magnet · CPC title