Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Patent metadata

Field	Value
Publication number	US-9287476-B2
Application number	US-201313969182-A
Country	US
Kind code	B2
Filing date	Aug 16, 2013
Priority date	Sep 3, 2008
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

First claim

The invention claimed is:

1. A method of manufacturing a light emitting device having a resin package in which a resin part and a lead are formed in a substantially same plane in an outer side surface, the method comprising:
sandwiching a lead frame provided with a notch part, between an upper mold and a lower mold;
transfer-molding a thermosetting resin containing a light reflecting material in a space located between the upper mold and the lower mold such that the thermosetting resin fills the notch part, to form a resin-molded body in the lead frame, a portion of the resin molded body being located in the notch part; and
cutting the resin-molded body and the lead frame along the notch part,
wherein the lead frame is plated before being sandwiched by the upper mold and the lower mold.

2. The method according to claim 1 , wherein the notch part in a cut part of the lead frame occupies more than about half of an entire surrounding periphery of the lead frame.

3. The method according to claim 1 , wherein, a hole part is provided in the lead frame before the lead frame is sandwiched by the upper mold and the lower mold.

4. The method according to claim 1 , wherein a groove is provided in the lead frame before the lead frame is sandwiched by the upper mold and the lower mold.

5. The method according to claim 1 , wherein the upper mold and the lower mold sandwich a part of the lead frame where a light emitting element is placed.

6. A light emitting device having a resin package,
wherein a resin part and at least one lead are formed in a substantially same plane in an outer side surface,
wherein at least one surface of a bottom surface and an upper surface of the at least one lead is plated and the outer side surface of the at least one lead is not plated,
wherein the resin part has a “T” shape at least at two side surfaces of the resin package, and
wherein the at least one lead has exposed portions located at four corners of the resin package, the exposed portions being separated from each other by the resin part at four side surfaces of the resin package.

7. The light emitting device according to claim 6 , wherein the four corners of the resin package are formed in an arc shape seen from a bottom surface side.

8. The light emitting device according to claim 6 , wherein a step lowered from a bottom surface or outer surface is provided in the lead.

9. The light emitting device according to claim 6 , wherein said resin part comprises a light reflecting material.

10. The light emitting device according to claim 6 , wherein said resin part comprises titanium oxide.

11. A method of manufacturing a resin package in which a resin part and a lead are formed in a substantially same plane in an outer side surface, the method comprising:
sandwiching a lead frame provided with a notch part, between an upper mold and a lower mold;
transfer-molding a thermosetting resin containing a light reflecting material in a space located between the upper mold and the lower mold such that the thermosetting resin fills the notch part, to form a resin-molded body in the lead frame, a portion of the resin molded body being located in the notch part; and
cutting the resin-molded body and the lead frame along the notch part,
wherein the lead frame is plated before being sandwiched by the upper mold and the lower mold.

12. The method according to claim 1 , further comprising placing a light emitting element on said lead frame.

13. The method according to claim 1 , further comprising placing a light emitting element on said lead frame before cutting the resin-molded body and the lead frame along the notch part.

14. The method according to claim 1 , wherein said resin-molded body has a concave part for receiving a light emitting element.

15. The method according to claim 1 , wherein said light reflecting material is titanium dioxide.

16. The method according to claim 11 , wherein said light reflecting material is titanium dioxide.

17. A method of manufacturing a light emitting device having a resin package in which a resin part and a lead are formed in a substantially same plane in an outer side surface, the method comprising:
sandwiching a lead frame provided with a notch part, between an upper mold and a lower mold;
transfer-molding a thermosetting resin in a space located between the upper mold and the lower mold such that the thermosetting resin fills the notch part, to form a resin-molded body in the lead frame, a portion of the resin molded body being located in the notch part;
wherein the notch part is configured such that the resin-molded body and the lead frame are cuttable at the notch part, and
wherein the lead frame is plated before being sandwiched between the upper mold and the lower mold.

18. The method according to claim 17 , wherein said lead frame has a surface on which a light emitting element is placeable.

19. The method according to claim 17 , wherein said resin-molded body has a concave part configured to receive a light emitting element.

20. The method according to claim 17 , wherein said thermosetting resin comprises a light reflecting material.

21. The method according to claim 17 , wherein said thermosetting resin comprises titanium dioxide.

Assignees

• Nichia Corp

Inventors

• Ichikawa Hirofumi
• Hayashi Masaki
• Sasaoka Shimpei
• Miki Tomohide

Classifications

• B29C2793/009

  after shaping · CPC title

• B29C45/0055 Primary

  Shaping · CPC title

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title