Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9287247B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9287247-B2 |
| Application number | US-201314437785-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 25, 2013 |
| Priority date | Oct 30, 2012 |
| Publication date | Mar 15, 2016 |
| Grant date | Mar 15, 2016 |
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Official abstract text for this publication.
A light-emitting diode arrangement includes a light-emitting diode and a coding resistor for coding the light-emitting diode. The coding resistor is embodied as a star connection of a number of resistors. Furthermore, a module includes a plurality of light-emitting diode arrangements. Furthermore, a method for producing a light-emitting diode arrangement is specified, wherein the coding of a coding resistor is carried out depending on a determined characteristic of the light-emitting diode.
Opening claim text (preview).
The invention claimed is: 1. A light-emitting diode arrangement, comprising: a light-emitting diode; a coding resistor for coding the light-emitting diode, wherein the coding resistor comprises a plurality of resistors electrically interconnected with one another; and a carrier, wherein the coding resistor comprises a resistor that is buried in the carrier. 2. The light-emitting diode arrangement according to claim 1 , wherein the plurality of resistors…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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