Semiconductor light device having a galvanic non-insulated driver

Patent metadata

Field	Value
Publication number	US-9287244-B2
Application number	US-201214352063-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Oct 19, 2011
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

A semiconductor light-emitting device is disclosed. The device includes a plurality of semiconductor light sources and a driver with no galvanic isolation for operating the semiconductor light sources wherein the semiconductor light sources may be divided into at least two carriers, the carriers are applied on an electrically conductive substrate, and the driver, and current-conducting regions also provided on a surface of the carriers, are electrically insulated from the substrate.

First claim

The invention claimed is:

1. A semiconductor light-emitting device, comprising:
a plurality of semiconductor light sources and
a driver with no galvanic isolation for operating the semiconductor light sources, wherein
the semiconductor light sources are divided into at least two carriers,
the carriers are applied on an electrically conductive substrate,
and the driver, and current-conducting regions also provided on a surface of the carriers, are electrically insulated from the substrate,
wherein the carriers are electrically connected to one another via at least one unsupported connecting line,
wherein the at least one unsupported connecting line is a connecting line with threefold insulation.

2. The semiconductor light-emitting device as claimed in claim 1 , wherein at least two of the carriers are arranged so as to be angled with respect to one another.

3. The semiconductor light-emitting device as claimed in claim 1 , wherein an insulating element is provided in a region between two carriers beneath at least one electrical connecting line connecting said carriers.

4. The semiconductor light-emitting device as claimed in claim 1 , wherein at least one of the carriers is a ceramic carrier.

5. The semiconductor light-emitting device as claimed in claim 1 , wherein at least one of the at least two carriers is applied to the substrate via an electrically insulating interface layer, and the interface layer protrudes laterally beyond the carrier.

6. The semiconductor light-emitting device as claimed in claim 1 , wherein the substrate is a surface of a heat sink.

7. A semiconductor light-emitting device as claimed in claim 1 , wherein the semiconductor light-emitting device is a retrofit lamp.

8. A semiconductor light-emitting device, comprising:
a plurality of semiconductor light sources and
a driver with no galvanic isolation for operating the semiconductor light sources, wherein
the semiconductor light sources are divided into at least two carriers,
the carriers are applied on an electrically conductive substrate, and the driver, and current-conducting regions also provided on a surface of the carriers, are electrically insulated from the substrate,
wherein at least one of the carriers comprises a printed circuit board basic material.

9. A semiconductor light-emitting device, comprising:
a plurality of semiconductor light sources and
a driver with no galvanic isolation for operating the semiconductor light sources, wherein
the semiconductor light sources are divided into at least two carriers,
the carriers are applied on an electrically conductive substrate,
and the driver, and current-conducting regions also provided on a surface of the carriers, are electrically insulated from the substrate,
wherein the carriers are electrically connected to one another via at least one unsupported connecting line,
wherein at least two carriers are configured as printed circuit board regions of a common flexible printed circuit board.

10. The semiconductor light-emitting device as claimed in claim 9 , wherein the at least two printed circuit board regions are arranged on in each case one heat-spreading element, which is arranged on the electrically conductive substrate.

11. The semiconductor light-emitting device as claimed in claim 9 , wherein the at least one unsupported connecting line is formed between two printed circuit board regions by at least one narrowed connecting region of the flexible printed circuit board, said connecting region having at least one conductor track.

12. The semiconductor light-emitting device as claimed in claim 10 , wherein the at least one unsupported connecting line is formed between two printed circuit board regions by at least one narrowed connecting region of the flexible printed circuit board, said connecting region having at least one conductor track.

Assignees

• Hofmann Markus
• Preuschl Thomas
• Eckert Klaus
• Strauss Christoph
• Osram Gmbh

Inventors

• Hofmann Markus
• Preuschl Thomas
• Eckert Klaus
• Strauss Christoph

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/8583

  not being in contact with the bodies · CPC title