Multilayer ceramic capacitor and board with the same mounted thereon

Patent metadata

Field	Value
Publication number	US-9287047-B2
Application number	US-201414282990-A
Country	US
Kind code	B2
Filing date	May 20, 2014
Priority date	Jan 27, 2014
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; a first capacitor part including a first internal electrode and a second internal electrode disposed in the ceramic body; second to fifth capacitor parts including a third internal electrode having first and second leads and a fourth internal electrode having third and fourth leads, the third and fourth internal electrodes being disposed on one dielectric layer in the ceramic body, and fifth and sixth internal electrodes disposed on another dielectric layer in the ceramic body; and a first external electrode and a second external electrode. The first capacitor part and the second to fifth capacitor parts may be connected in parallel to each other.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers, first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;
a first capacitor part including a first internal electrode disposed in the ceramic body and exposed to the first side surface and a second internal electrode disposed in the ceramic body and exposed to the second side surface;
second to fifth capacitor parts including a third internal electrode having first and second leads exposed to the first and second end surfaces and a fourth internal electrode having third and fourth leads exposed to the first and second end surfaces, the third and fourth internal electrodes being disposed on one dielectric layer in the ceramic body, and fifth and sixth internal electrodes disposed on another dielectric layer in the ceramic body and spaced apart from each other; and
a first external electrode disposed on the first side surface of the ceramic body and extended to the first end surface and the first and second main surfaces and a second external electrode disposed on the second side surface of the ceramic body and extended to the second end surface and first and second main surfaces,
wherein the first capacitor part and the second to fifth capacitor parts are connected in parallel to each other.

2. The multilayer ceramic capacitor of claim 1 , wherein the first and second internal electrodes are disposed in a central portion of the ceramic body, and the third to sixth internal electrodes are disposed on and below the first and second internal electrodes.

3. The multilayer ceramic capacitor of claim 1 , wherein the first lead of the third internal electrode and the third lead of the fourth internal electrode are connected to the first external electrode, and the second lead of the third internal electrode and the fourth lead of the fourth internal electrode are connected to the second external electrode.

4. The multilayer ceramic capacitor of claim 1 , wherein the second capacitor part is disposed in a region in which the third and fifth internal electrodes are overlapped with each other.

5. The multilayer ceramic capacitor of claim 1 , wherein the third capacitor part is disposed in a region in which the fourth and fifth internal electrodes are overlapped with each other.

6. The multilayer ceramic capacitor of claim 1 , wherein the fourth capacitor part is disposed in a region in which the third and sixth internal electrodes are overlapped with each other.

7. The multilayer ceramic capacitor of claim 1 , wherein the fifth capacitor part is disposed in a region in which the fourth and sixth internal electrodes are overlapped with each other.

8. A board with a multilayer ceramic capacitor mounted thereon, comprising:
a printed circuit board having first and second electrode pads disposed on the printed circuit board; and
the multilayer ceramic capacitor of claim 1 mounted on the printed circuit board.

Assignees

• Samsung Electro Mech

Inventors

• Choi Young Don
• Lee Hai Joon

Classifications

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title