In-situ lapping plate mapping device

Patent metadata

Field	Value
Publication number	US-9286930-B2
Application number	US-201314018027-A
Country	US
Kind code	B2
Filing date	Sep 4, 2013
Priority date	Sep 4, 2013
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

A device and associated method of use can have at least an object with a work surface that contacts a lapping surface of a tool. Topography of the lapping surface can be mapped in-situ by an adjacent sensor array and the topography stored in a memory. The sensor array may be configured with a plurality of sensors positioned on opposite sides of the object.

First claim

What is claimed is:

1. An apparatus comprising a rowbar having a work surface contacting a lapping surface of a tool, a topography of the lapping surface mapped in-situ by an adjacent sensor array and the topography stored in a memory, the sensor array comprising first, second, and third sensors that are respectively different sensor types, the first and second sensors positioned on opposite sides of the rowbar, the first sensor configured to monitor the rowbar, the second sensor configured to monitor the lapping surface, and the third sensor attached to the rowbar with a lapping guide pad.

2. The apparatus of claim 1 , wherein the sensor array comprises at least one inductive sensor.

3. The apparatus of claim 1 , wherein the sensor array comprises at least one optical sensor.

4. The apparatus of claim 1 , wherein the plurality of sensors are positioned on opposite sides of the tool by a continuous array frame.

5. The apparatus of claim 1 , wherein the work surface has an undulating surface prior to contact with the lapping surface.

6. The apparatus of claim 1 , wherein the lapping surface has a non-flat shape.

7. The apparatus of claim 6 , wherein the non-flat shape comprises a saddle.

8. The apparatus of claim 1 , wherein the work surface comprises a plurality of transducing means.

9. The apparatus of claim 8 , wherein the lapping surface concurrently contacts the plurality of transducing means.

10. A method comprising:
contacting a work surface of a rowbar with a lapping surface of a tool;
mapping a topography of the lapping surface in-situ by a first sensor positioned on a first side of the rowbar;
monitoring the work surface of the rowbar with second and third sensors, the second sensor positioned on a second side of the rowbar, opposite the first side, the third sensor attached to the rowbar via a lapping guide pad, the first, second, and third sensors being different types of sensors; and
storing the topography in a memory.

11. The method of claim 10 , wherein the work surface is adjusted for a pitch and roll to maintain a parallel relationship between the work and lapping surfaces in response to the mapped topography.

12. The method of claim 10 , wherein the distance between the work and lapping surfaces is measured during the mapping step.

13. The method of claim 10 , wherein the lapping surface is disengaged from the work surface in response to the mapping step identifying a deformation in the lapping surface.

14. The method of claim 10 , wherein the first and second sensors concurrently map the lapping and work surfaces.

15. The method of claim 10 , wherein the first sensor array concurrently maps multiple different portions of the lapping surface corresponding to different abrasive regions.

16. The method of claim 10 , wherein the mapped topography is compared to a predicted lapping model.

17. The method of claim 16 , wherein the predicted lapping model is computed from the topography of the lapping surface being mapped prior to contact with the work surface.

18. The method of claim 10 , wherein a lapping plate pressure is adjusted in response to the mapping and monitoring steps.

19. A method comprising:
contacting a work surface of a rowbar with a lapping surface of a tool;
mapping a topography of the lapping surface in-situ by an inductive sensor positioned on a first side of the rowbar;
monitoring the work surface of the rowbar with an environmental sensor positioned on a second side of the rowbar, opposite the first side, and with a lapping guide sensor attached to the rowbar via a lapping guide pad;
storing the topography in a memory; and
adjusting the work surface in response to the mapped topography and the monitored work surface.

20. The method of claim 19 , wherein the work surface is tilted to maintain a parallel orientation to the lapping surface.

Assignees

• Seagate Technology Llc

Inventors

• Moudry Raymond Leroy
• Parikh Pramit
• Herendeen Mark Allen
• Hoehn Joel W

Classifications

• G11B5/1871 Primary

  Shaping or contouring of the transducing or guiding surface · CPC title

• G11B5/6005

  Specially adapted for spacing from a rotating disc using a fluid cushion · CPC title

• G11B7/08 Primary

  Disposition or mounting of heads or light sources relatively to record carriers · CPC title

• G11B5/3169

  Working or finishing the interfacing surface of heads, e.g. lapping of heads · CPC title