Process and material solution to reduce metal ion release for implantable medical device application

US9284648B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9284648-B2
Application numberUS-201213447873-A
CountryUS
Kind codeB2
Filing dateApr 16, 2012
Priority dateApr 27, 2011
Publication dateMar 15, 2016
Grant dateMar 15, 2016

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.

First claim

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What is claimed is: 1. A treated alloy composition comprising cobalt, nickel, molybdenum and chromium, wherein the alloy surface has increased concentrations of molybdenum and chromium within at least the first 2 nm of the depth of the surface, wherein the alloy surface concentration of molybdenum is from about 2.2 atomic percent to about 3.9 atomic percent and the concentration of chromium is from about 10.4 atomic percent to about 17.5 atomic percent. 2. The treated alloy composition of claim 1 , wherein the alloy surface has increased concentrations of molybdenum and chromium within the first 5 nm of the depth of the surface. 3. The treated alloy composition of claim 2 , wherein the alloy surface has increased concentrations of molybdenum and chromium at least 10 nm in depth. 4. The treated alloy composition of claim 1 , wherein the alloy is configured as a spring or an electrical lead. 5. The treated alloy composition of claim 4 , wherein the spring or electrical lead is in a medical device. 6. The treated alloy composition of claim 5 , wherein the medical device is a drug pump. 7. The treated alloy composition of claim 1 , wherein the alloy surface is pretreated with an alkaline aqueous solution containing about 0.01 percent to about 10 percent surfactants and chelating agents by weight. 8. A treated alloy composition comprising cobalt, nickel, molybdenum and chromium, wherein the alloy surface has increased concentrations of molybdenum and chromium, wherein the alloy surface concentration of molybdenum is from about 2.2 atomic percent to about 3.9 atomic percent and the concentration of chromium is from about 10.4 atomic percent to about 17.5 atomic percent, and wherein the alloy releases less than 1 ng/mm 2 of cobalt or nickel over a 16 week period at 37° C. in an aqueous nitric acid solution at a pH of 2.2. 9. The treated alloy composition of claim 8 , wherein the alloy surface is treated with about 15 to about 30 percent nitric acid by volume at a temperature of from about 40° C. to about 100° C. for a period of time from about 60 minutes to about 180 minutes. 10. The treated alloy composition of claim 8 , wherein the treated surface of has increased concentrations of molybdenum and chromium through a depth of about 2 nm from the surface of the alloy. 11. The treated alloy composition of claim 8 , wherein the treated surface has increased concentrations of molybdenum and chromium through a depth of about 5 nm of the surface of the alloy. 12. The treated alloy composition of claim 11 , wherein the alloy surface has increased concentrations of molybdenum and chromium at least 10 nm in depth. 13. The treated alloy composition of claim 8 , wherein the alloy is configured as a spring or an electrical lead. 14. The treated alloy composition of claim 13 , wherein the spring or electrical lead is in a medical device. 15. The treated alloy composition of claim 14 , wherein the medical device is a drug pump. 16. A method to modify a surface of a cobalt, nickel, molybdenum and chromium alloy as claimed in claim 1 , wherein the alloy surface is treated to have increased concentrations of molybdenum and chromium, wherein the alloy surface concentration of molybdenum is from about 2.2 atomic percent to about 3.9 atomic percent and the concentration of chromium is from about 10.4 atomic percent to about 17.5 atomic percent, comprising the step: treating the alloy with about 15 to about 30 percent nitric acid by volume at a temperature of from about 40° C. to about 100° C. for a period of time from about 60minutes to about 180 minutes. 17. The method of claim 16 , further comprising the step of rinsing the alloy surface with water after the nitric acid treatment. 18. The method of claim 16 , wherein the surface of the alloy releases less than 1 ng/mm 2 cobalt or nickel over a 16 week period at 37 ° C. in an aqueous nitric acid solution at a pH of 2.2. 19. The method of claim 16 , wherein the surface has increased concentrations of molybdenum and chromium through a depth of about 10 nm of the surface of the alloy. 20. The method of claim 16 , wherein the surface has increased concentrations of molybdenum and chromium through a depth of about 5nm of the surface of the alloy. 21. The method of claim 20 , wherein the surface has increased concentrations of molybdenum and chromium to at least 2 nm in depth. 22. The method of claim 16 , further comprising the step: pretreating the alloy surface with an alkaline aqueous solution containing about 0.01 percent to about 10 percent surfactants and chelating agents by weight at a temperature of from about 37° C. to about 71° C. for a period of time from about 30 minutes to about 120 minutes.

Assignees

Inventors

Classifications

  • Materials characterised by their function or physical properties {, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials} · CPC title

  • Cobalt or cobalt alloys · CPC title

  • Modification of implant surfaces in order to improve biocompatibility, cell growth, fixation of biomolecules, e.g. plasma treatment · CPC title

  • C23F1/00Primary

    Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) · CPC title

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What does patent US9284648B2 cover?
The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.
Who is the assignee on this patent?
Shi Alan, Li Bernard, Medtronic Inc
What technology area does this patent fall under?
Primary CPC classification C23F1/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).